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2013 Journal Article Fluorine mobility during SEM-EDX analysis: A challenge for characterizing epoxy/fluoropolymer interfacesVandi, Luigi-Jules, Truss, Rowan, Veidt, Martin, Rasch, Ronald, Heitzmann, Michael T. and Paton, Rowan (2013). Fluorine mobility during SEM-EDX analysis: A challenge for characterizing epoxy/fluoropolymer interfaces. Journal of Physical Chemistry C, 117 (33), 16933-16941. doi: 10.1021/jp403314t |
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2013 Journal Article Single-plant biocomposite from Ricinus Communis: preparation, properties and environmental performanceHeitzmann, M., Veidt, M., Ng, C. T., Lindenberger. B., Hou, M., Truss, R. and Liew, C. K. (2013). Single-plant biocomposite from Ricinus Communis: preparation, properties and environmental performance. Journal of Polymers and the Environment, 21 (2), 366-374. doi: 10.1007/s10924-012-0517-3 |
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2012 Journal Article Morphology of an interface between polyetherimide and epoxy prepregHeitzmann, Michael T., Hou, Meng, Veidt, Martin, Vandi, Luigi-Jules and Paton, Rowan (2012). Morphology of an interface between polyetherimide and epoxy prepreg. Advanced Materials Research, 393-395, 184-188. doi: 10.4028/www.scientific.net/AMR.393-395.184 |
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2011 Journal Article Influence of nonlinearities on the accuracy of the analytical solution for the shaft loaded blister testHeitzmann, M.T., Hou, M., Veidt, M. and Falzon, P. (2011). Influence of nonlinearities on the accuracy of the analytical solution for the shaft loaded blister test. International Journal of Solids and Structures, 48 (10), 1424-1435. doi: 10.1016/j.ijsolstr.2011.01.024 |
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2011 Journal Article Microanalysis techniques for the investigation of interphases formed between thermoset and thermoplastic polymers: Scanning electron microscopy and energy dispersive x-ray analysisHeitzmann, Michael T., Hou, Meng, Veidt, Martin, Paton, Rowan and Rasch, Ron (2011). Microanalysis techniques for the investigation of interphases formed between thermoset and thermoplastic polymers: Scanning electron microscopy and energy dispersive x-ray analysis. Key Engineering Materials, 471-472, 309-314. doi: 10.4028/www.scientific.net/KEM.471-472.309 |
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1993 Journal Article Electromigration in ALCu interconnections with W‐plug contactsFerlazzo, L., Reimbold, G., Gonchond, J. P., Heitzmann, M., Demolliens, O. and Lormand, G. (1993). Electromigration in ALCu interconnections with W‐plug contacts. Quality and Reliability Engineering International, 9 (4), 299-302. doi: 10.1002/qre.4680090410 |
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1991 Journal Article A fully scaled 0.5μm CMOS process for fast random logicLerme, M., Guegan, G., Deléonibus, S., Martin, F., Heitzmann, M., Vinet, F., Jaffard, C., Belleville, M., Guerin, M., Reimbold, G. and Leroux, C. (1991). A fully scaled 0.5μm CMOS process for fast random logic. Microelectronic Engineering, 15 (1-4), 257-260. doi: 10.1016/0167-9317(91)90224-2 |
