Advanced Lithographic Solutions using Block Copolymers: Integrating Self Assembly and Lithography (2009-2011)
Abstract
The trillion dollar semiconductor industry relies on continual increases in the density of transistors that are printed on integrated circuits. This project aims to develop an integrated top down/bottom up process, using traditional photolithography and self assembly of novel block copolymers, for significantly reducing pattern defectivity for current and future generations of integrated circuit manufacture. Ultimately this will lead to faster, more energy-efficient processors. Through the course of the project a detailed fundamental understanding of the thermodynamic properties of the range novel block copolymers will also be developed, which will also be significant in technological areas such as high density data storage devices.'',
