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2025 Conference Publication In-situ gas atmosphere transmission electron microscopy observation of hydrogen De/absorption in metal hydridesTan, Xin Fu, Kawami, Youichirou, Hamano, Yuma, Yamamoto, Tomokazu, Nogita, Kazuhiro and Yasuda, Kazuhiro (2025). In-situ gas atmosphere transmission electron microscopy observation of hydrogen De/absorption in metal hydrides. 13th Asia Pacific Microscopy Congress, Brisbane, QLD, Australia, 2-7 February 2025. ScienceOpen. doi: 10.14293/apmc13-2025-0105 |
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2024 Conference Publication Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder AlloysZhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535431 |
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2024 Conference Publication In-situ observations of CU<sub>6</sub>Sn<sub>5</sub> mophological changes at the liquid SAC305/ solid OSP-Cu interfaceNogita, Kazuhiro, Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Maeno, Hiroshi and Matsumura, Syo (2024). In-situ observations of CU6Sn5 mophological changes at the liquid SAC305/ solid OSP-Cu interface. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535651 |
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2024 Conference Publication Temperature-Dependent Electrical Resistivity in Sn-Bi AlloysTan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535619 |
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2023 Conference Publication The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%BiYe, Xiaozhou, Tao, Lei, McDonald, Stuart D., Tan, Xin Fu, Sweatman, Keith and Nogita, Kazuhiro (2023). The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129707 |
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2023 Conference Publication Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy studyTan, Xin F., Zhou, Jiye, McDonald, Stuart D., Ikeda, Masahiko and Nogita, Kazuhiro (2023). Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study. International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129743 |
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2023 Conference Publication Controlling porosity during transient liquid phase bonding for high-temperature soldering processesAbdul Razak, Nurul R., Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffery, Nishimura, Tetsuro and Nogita, Kazuhiro (2023). Controlling porosity during transient liquid phase bonding for high-temperature soldering processes. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129722 |
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2022 Conference Publication Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solderHao, Qichao, Tan, Xin Fu, McDonald, Stuart D., Sweatman, Keith, Nishimura, Takatoshi, Nishimura, Tetsuro and Nogita, Kazuhiro (2022). Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795406 |
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2019 Conference Publication Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substratesTan, Xin Fu, Abdul Razak, Nurul Razliana, Husain, Muhammad Hafiz, McDonald, Stuart and Nogita, Kazuhiro (2019). Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019, Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012007 |
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2019 Conference Publication Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substratesAbdul Razak, Nurul Razliana, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012008 |
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2018 Conference Publication Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloysTan, Xin Fu, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart and Nogita, Kazuhiro (2018). Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloys. Electronic Packaging Interconnect Technology Symposium, Fukuoka, Japan, 1-2 November 2017. Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/SSP.273.20 |
