Micro/nano-mechanical testing methodologies for interfacial adhesion (2019-2024)
Abstract
Adhesion between metal thin film conductors and polymer substrates is a critical factor influencing the reliability of the emerging polymer-based flexible electronics. Hence, there is a compelling need to develop new methodologies for understanding the behavior of these metal/polymer interfaces. The proposed project thus aims to develop reliable approaches for measuring the toughness of a variety of metal/polymer interfaces integral to contemporary flexible devices. The methodologies will contribute to the field of adhesion science, micromechanics and fracture mechanics and will ultimately be a crucial enabler to accelerate the development of new flexible microelectronic technologies, from solar panels to electronic skin.
