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1999

Conference Publication

The chemorheology and cure of model filled epoxy resins use for advanced materials

Halley, P. J., Altmann, N. and Kelly, C. T. (1999). The chemorheology and cure of model filled epoxy resins use for advanced materials. fifteenth annual meeting of the Polymer Processing Society PPS-15, The Netherlands, 31 May - 4 June 1999. The Netherlands: not available.

The chemorheology and cure of model filled epoxy resins use for advanced materials

1999

Conference Publication

Epoxy-amine/silica interface and its effect on gelation and vitrification

Altmann, N., Halley, P. J. and Coombs, S. J. (1999). Epoxy-amine/silica interface and its effect on gelation and vitrification. Developments in polymer characterisation RACI-APS23, Geelong, Vic, 27-28 November, 1999. Victoria, Australia: Royal Australian Chemical Institute.

Epoxy-amine/silica interface and its effect on gelation and vitrification

1999

Conference Publication

The effects of microstructure on the macroscopic properties of highly filled thermosets

Altmann, N., Halley, P. J. and Kelly, C. T. (1999). The effects of microstructure on the macroscopic properties of highly filled thermosets. International Symposium Eurofillers' 99, Villeurbanne, Lyon, France, 6-9 September 1999. not available: not available.

The effects of microstructure on the macroscopic properties of highly filled thermosets

1999

Conference Publication

Effect of additives on gelatinization, rheological properties and biodegradability of thermoplastic starch

Yu, L., Christie, G., Gray, J., Dutt, U., Harvey, T., Halley, P., Coombs, S., Jayasekara, R. and Lonergan, G. (1999). Effect of additives on gelatinization, rheological properties and biodegradability of thermoplastic starch. International Scientific Workshop on biodegradable Plastics and Polymers, Stockholm, Sweden, 9-13 June 1998. Weinheim, Germany: Wiley-VCH. doi: 10.1002/masy.19991440134

Effect of additives on gelatinization, rheological properties and biodegradability of thermoplastic starch

1999

Conference Publication

Understanding the chemorheology of highly filld model and industrial epoxy moulding compounds used in microelectronics encapsulation

Halley, P. J. and Wang, J. (1999). Understanding the chemorheology of highly filld model and industrial epoxy moulding compounds used in microelectronics encapsulation. 23rd Australasian Polymer Symposium: Polymers for the new millenium, Geelong, Vic, 28 Nov - 2 Dec 1999. Victoria, Australia: Royal Australian Chemical Institute.

Understanding the chemorheology of highly filld model and industrial epoxy moulding compounds used in microelectronics encapsulation