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2020 Journal Article On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrateQu, D.D., Gear, M., Setargew, N., Renshaw, W., McDonald, S., StJohn, D., Paterson, D.J. and Nogita, K. (2020). On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrate. Materialia, 11 100669, 100669. doi: 10.1016/j.mtla.2020.100669 |
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2020 Journal Article Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder pasteMohd Said, R., Mohd Salleh, M. A. A., Saud, N., Ramli, M. I. I., Yasuda, H. and Nogita, K. (2020). Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste. Journal of Materials Science: Materials in Electronics, 31 (14), 11077-11094. doi: 10.1007/s10854-020-03657-4 |
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2020 Journal Article Interfacial reactions between Ga and Cu-10Ni substrate at low temperatureLiu, Shiqian, Zeng, Guang, Yang, Wenhui, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Interfacial reactions between Ga and Cu-10Ni substrate at low temperature. ACS Applied Materials and Interfaces, 12 (18) acsami.0c02032, 21045-21056. doi: 10.1021/acsami.0c02032 |
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2020 Journal Article Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profileSomidin, Flora, McDonald, Stuart David, Ye, Xiaozhou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profile. Japan Institute of Electronics Packaging. Transactions, 13, E19-004. doi: 10.5104/jiepeng.13.e19-004-1 |
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2020 Journal Article Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compoundsSomidin, Flora, Maeno, Hiroshi, Toriyama, Takaaki, McDonald, Stuart D., Yang, Wenhui, Matsumura, Syo and Nogita, Kazuhiro (2020). Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compounds. Materialia, 9 100530, 100530. doi: 10.1016/j.mtla.2019.100530 |
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2020 Journal Article The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength solderingRamli, M. I.I., Mohd Salleh, M. A.A., Yasuda, H., Chaiprapa, J. and Nogita, K. (2020). The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering. Materials and Design, 186 108281, 108281. doi: 10.1016/j.matdes.2019.108281 |
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2020 Journal Article Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room TemperatureLiu, Shiqian, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, Sweatman, Keith, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature. Journal of Electronic Materials, 49 (1), 128-139. doi: 10.1007/s11664-019-07688-4 |
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2020 Journal Article The effect of Ni and Bi additions on the solderability of Sn-0.7Cu solder coatingsRamli, M. I.I., Mohd Salleh, M. A.A., Abdullah, M. M.A., Narayanan, P., Chaiprapa, J., Mohd Said, R., Yoriya, S. and Nogita, K. (2020). The effect of Ni and Bi additions on the solderability of Sn-0.7Cu solder coatings. Journal of Electronic Materials, 49 (1), 1-12. doi: 10.1007/s11664-019-07596-7 |
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2019 Journal Article Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodesTan, Xin F., Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodes. ACS Applied Energy Materials, 3 (1) acsaem.9b02014, 141-145. doi: 10.1021/acsaem.9b02014 |
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2019 Journal Article The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodesTan, Xin F., McDonald, Stuart D., Gu, Qinfen, Wang, Lianzhou, Matsumura, Syo and Nogita, Kazuhiro (2019). The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes. Journal of Power Sources, 440 227085, 227085. doi: 10.1016/j.jpowsour.2019.227085 |
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2019 Journal Article Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reactionLiu, Shiqian, Yang, Wenhui, Kawami, Youichirou, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, McDonald, Stuart and Nogita, Kazuhiro (2019). Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reaction. ACS Applied Materials and Interfaces, 11 (35) acsami.9b10630, 32523-32532. doi: 10.1021/acsami.9b10630 |
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2019 Journal Article In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloyZeng, G., Callaghan, M. D., McDonald, S. D., Yasuda, H. and Nogita, K. (2019). In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloy. Journal of Alloys and Compounds, 797, 804-810. doi: 10.1016/j.jallcom.2019.04.153 |
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2019 Journal Article Solidification path and microstructure evolution of Mg-3Al-14La alloy: implications for the Mg-rich corner of the Mg-Al-La phase diagramWong, Charlotte, Nogita, Kazuhiro, Styles, Mark J., Zhu, Suming, Qiu, Dong, McDonald, Stuart D., Gibson, Mark A., Abbott, Trevor B. and Easton, Mark A. (2019). Solidification path and microstructure evolution of Mg-3Al-14La alloy: implications for the Mg-rich corner of the Mg-Al-La phase diagram. Journal of Alloys and Compounds, 784, 527-534. doi: 10.1016/j.jallcom.2019.01.029 |
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2019 Journal Article Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collectorTan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Hu, Yuxiang, Wang, Lianzhou, Matsumura, Syo, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collector. Journal of Power Sources, 415, 50-61. doi: 10.1016/j.jpowsour.2019.01.034 |
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2019 Journal Article Relationship between free solder thickness to the solderability of Sn–0.7Cu–0.05Ni solder coating during solderingRamli, M.I.I., Mohd Salleh, M.A.A., Mohd Sobri, F. A., Narayanan, P., Sweatman, K. and Nogita, K. (2019). Relationship between free solder thickness to the solderability of Sn–0.7Cu–0.05Ni solder coating during soldering. Journal of Materials Science: Materials in Electronics, 30 (4), 3669-3677. doi: 10.1007/s10854-018-00647-5 |
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2019 Journal Article Experimental determination of the Sn-Cu-Ni phase diagram for Pb-free solder applicationsHenao, Hector M., Chu, Ching-shun, Solis, Juan P. and Nogita, Kazuhiro (2019). Experimental determination of the Sn-Cu-Ni phase diagram for Pb-free solder applications. Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science, 50 (1), 502-516. doi: 10.1007/s11663-018-1456-8 |
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2019 Journal Article Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compoundYang, Wenhui, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Nogita, Kazuhiro and Matsumura, Syo (2019). Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compound. Scripta Materialia, 158, 1-5. doi: 10.1016/j.scriptamat.2018.08.020 |
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2019 Journal Article Al8Mn5 particle settling and interactions with oxide films in liquid AZ91 magnesium alloysPeng, L., Zeng, G., Su, T. C., Yasuda, H., Nogita, K. and Gourlay, C. M. (2019). Al8Mn5 particle settling and interactions with oxide films in liquid AZ91 magnesium alloys. JOM, 71 (7), 2235-2244. doi: 10.1007/s11837-019-03471-2 |
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2018 Journal Article Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder jointSomidin, Flora, Maeno, Hiroshi, Tran, Xuan, McDonald, Stuart D., Mohd Salleh, Mohd, Matsumura, Syo and Nogita, Kazuhiro (2018). Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint. Materials, 11 (11) 2229, 2229. doi: 10.3390/ma11112229 |
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2018 Journal Article Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05NiXian, J. W., Mohd Salleh, M. A.A., Belyakov, S. A., Su, T. C., Zeng, G., Nogita, K., Yasuda, H. and Gourlay, C. M. (2018). Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni. Intermetallics, 102, 34-45. doi: 10.1016/j.intermet.2018.08.002 |
