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2022 Journal Article In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopyTan, Xin F., Somidin, Flora, McDonald, Stuart D., Bermingham, Michael J., Maeno, Hiroshi, Matsumura, Syo and Nogita, Kazuhiro (2022). In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy. Materials, 15 (2) 510, 510. doi: 10.3390/ma15020510 |
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2022 Journal Article Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a reviewZeng, Guang, Liu, Shiqian, Gu, Qinfen, Zheng, Zebang, Yasuda, Hideyuki, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a review. Acta Metallurgica Sinica, 35 (1), 49-66. doi: 10.1007/s40195-021-01350-x |
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2021 Journal Article Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regimeMehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart D., Yasuda, Hideyuki and StJohn, David H. (2021). Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime. Acta Materialia, 220 117295, 1-11. doi: 10.1016/j.actamat.2021.117295 |
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2021 Journal Article Re-evaluation of the mechanical properties and creep resistance of commercial magnesium die-casting alloy AE44Zhu, Suming, Abbott, Trevor B., Nie, Jian-Feng, Ang, Hua Qian, Qiu, Dong, Nogita, Kazuhiro and Easton, Mark A. (2021). Re-evaluation of the mechanical properties and creep resistance of commercial magnesium die-casting alloy AE44. Journal of Magnesium and Alloys, 9 (5), 1537-1545. doi: 10.1016/j.jma.2021.04.016 |
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2021 Journal Article Rapid fabrication of tin-copper anodes for lithium-ion battery applicationsTan, Xin Fu, Belyakov, Sergey A., Su, Te-Cheng, Gu, Qinfen, Liu, Shiqian, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Hideyuki, Matsumura, Syo and Nogita, Kazuhiro (2021). Rapid fabrication of tin-copper anodes for lithium-ion battery applications. Journal of Alloys and Compounds, 867 159031, 159031. doi: 10.1016/j.jallcom.2021.159031 |
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2021 Journal Article The effect of Na addition on the first hydrogen absorption kinetics of cast hypoeutectic Mg–La alloysKim, Manjin, Gu, Qinfen, Hussain, Tanveer, Ali, Yahia, Abbott, Trevor B. and Nogita, Kazuhiro (2021). The effect of Na addition on the first hydrogen absorption kinetics of cast hypoeutectic Mg–La alloys. International Journal of Hydrogen Energy, 46 (53), 27096-27106. doi: 10.1016/j.ijhydene.2021.05.180 |
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2021 Journal Article Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi jointsLiu, Shiqian, Tan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2021). Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi joints. Intermetallics, 133 107168, 1-9. doi: 10.1016/j.intermet.2021.107168 |
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2021 Journal Article In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiographyAbdul Razak, N.R., Tan, X.F., Somidin, F., Yasuda, H., McDonald, S.D. and Nogita, K. (2021). In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography. Materials Letters, 291 129520, 1-4. doi: 10.1016/j.matlet.2021.129520 |
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2021 Journal Article Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG)Teoh, A.L., Mohd Salleh, M.A.A., Halin, D.S.C., Foo, K.L., Abdul Razak, N.R., Yasuda, H. and Nogita, K. (2021). Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG). Journal of Materials Research and Technology, 12, 1700-1714. doi: 10.1016/j.jmrt.2021.03.068 |
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2021 Journal Article Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu3Sn phase in Sn-10 wt.%Cu AlloysMehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart D., Yasuda, Hideyuki and StJohn, David H. (2021). Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu3Sn phase in Sn-10 wt.%Cu Alloys. Journal of Electronic Materials, 50 (3), 881-892. doi: 10.1007/s11664-020-08709-3 |
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2021 Journal Article Microstructure evolution of Ag/TiO2 thin filmHalin, Dewi Suriyani Che, Razak, Kamrosni Abdul, Mohd Salleh, Mohd Arif Anuar, Ramli, Mohd Izrul Izwan, Abdullah, Mohd Mustafa Al Bakri, Azhari, Ayu Wazira, Nogita, Kazuhiro, Yasuda, Hideyuki, Nabiałek, Marcin and Wysłocki, Jerzy J. (2021). Microstructure evolution of Ag/TiO2 thin film. Magnetochemistry, 7 (1) 14, 1-10. doi: 10.3390/magnetochemistry7010014 |
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2021 Journal Article Evaluation of wave-like nucleation events in Al-4%Si alloys with addition of TiB2 particles by time-resolved and in-situ observation Yasuda, Hideyuki and Nogita, Kazuhiro (2021). Evaluation of wave-like nucleation events in Al-4%Si alloys with addition of TiB2 particles by time-resolved and in-situ observation . Keikinzoku/Journal of Japan Institute of Light Metals, 71 (1), 22-29. doi: 10.2464/jilm.71.22 |
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2021 Journal Article Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and StrengthMuhd Amli, S. F. N., Mohd Salleh, M. A. A., Ramli, M. I. I., Abdul Razak, N. R., Yasuda, H., Chaiprapa, J. and Nogita, K. (2021). Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength. Journal of Electronic Materials, 50 (3), 855-868. doi: 10.1007/s11664-020-08641-6 |
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2020 Journal Article A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La systemKim, Manjin, McDonald, Stuart D., Abbott, Trevor B., Easton, Mark A., Ali, Yahia, StJohn, David H. and Nogita, Kazuhiro (2020). A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La system. Journal of Alloys and Compounds, 844 156068, 156068. doi: 10.1016/j.jallcom.2020.156068 |
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2020 Journal Article Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applicationsTan, Xin F., Gu, Qinfen, Qu, Dongdong, Yong, Adrian X.B., Yang, Wenhui, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2020). Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications. Acta Materialia, 201, 341-349. doi: 10.1016/j.actamat.2020.10.011 |
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2020 Journal Article Origin of primary Cu6Sn5 in hypoeutectic solder alloys and a method of suppression to improve mechanical propertiesMuhd Amli, S. F.N., Mohd Salleh, M. A.A., Ramli, M. I.I., Yasuda, H., Chaiprapa, J., Somidin, F., Shayfull, Z. and Nogita, K. (2020). Origin of primary Cu6Sn5 in hypoeutectic solder alloys and a method of suppression to improve mechanical properties. Journal of Electronic Materials, 50 (3), 710-722. doi: 10.1007/s11664-020-08428-9 |
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2020 Journal Article Effect of Na and cooling rate on the activation of Mg-Ni alloys for hydrogen storageKim, Manjin, McDonald, Stuart D., Ali, Yahia, Abbott, Trevor and Nogita, Kazuhiro (2020). Effect of Na and cooling rate on the activation of Mg-Ni alloys for hydrogen storage. Journal of Nanoscience and Nanotechnology, 20 (8), 5192-5200. doi: 10.1166/jnn.2020.18529 |
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2020 Journal Article The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodesTan, Xin Fu, Yong, Adrian Xiao Bin, Gu, Qinfen, Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2020). The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodes. Journal of Nanoscience and Nanotechnology, 20 (8), 5182-5191. doi: 10.1166/jnn.2020.18538 |
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2020 Journal Article Atomic locations of minor dopants and their roles in the stabilization of η−Cu6Sn5Yang, Wenhui, Quy Tran, Xuan, Yamamoto, Tomokazu, Yoshioka, Satoru, Somidin, Flora, Nogita, Kazuhiro and Matsumura, Syo (2020). Atomic locations of minor dopants and their roles in the stabilization of η−Cu6Sn5. Physical Review Materials, 4 (6) 065002. doi: 10.1103/physrevmaterials.4.065002 |
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2020 Journal Article Intermetallic formation mechanisms and properties in room-temperature Ga solderingLiu, Shiqian, Qu, Dongdong, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Intermetallic formation mechanisms and properties in room-temperature Ga soldering. Journal of Alloys and Compounds, 826 154221, 154221. doi: 10.1016/j.jallcom.2020.154221 |
