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2023

Journal Article

Effects of multiple reflow on the formation of primary crystals in Sn-3.5Ag and solder joint strength: experimental and finite element analysis

Amli, Siti Farahnabilah Muhd, Salleh, Mohd Arif Anuar Mohd, Aziz, Mohd Sharizal Abdul, Yasuda, Hideyuki, Nogita, Kazuhiro, Abdullah, Mohd Mustafa Al Bakri, Nemes, Ovidiu, Sandu, Andrei Victor and Vizureanu, Petrica (2023). Effects of multiple reflow on the formation of primary crystals in Sn-3.5Ag and solder joint strength: experimental and finite element analysis. Materials, 16 (12) 4360, 1-17. doi: 10.3390/ma16124360

Effects of multiple reflow on the formation of primary crystals in Sn-3.5Ag and solder joint strength: experimental and finite element analysis

2023

Journal Article

The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys

Zhou, Jiye, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2023). The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys. JOM, 75 (8), 3149-3161. doi: 10.1007/s11837-023-05870-y

The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys

2023

Journal Article

Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bath

Qu, Dongdong, Gear, Matthew, Gu, Qinfen, Setargew, Nega, Renshaw, Wayne, McDonald, Stuart, StJohn, David and Nogita, Kazuhiro (2023). Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bath. Materials, 16 (3) 1211. doi: 10.3390/ma16031211

Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bath

2023

Journal Article

Events That Led Me to Establish the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) at the University of Queensland, Australia オーストラリア Queensland 大学で,日本スペリア電子材料製造研究センター (NS CMEM) を設立してみた。

Nogita, Kazuhiro (2023). Events That Led Me to Establish the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) at the University of Queensland, Australia オーストラリア Queensland 大学で,日本スペリア電子材料製造研究センター (NS CMEM) を設立してみた。. Journal of Japan Institute of Electronics Packaging, 26 (6), 571-576. doi: 10.5104/jiep.26.571

Events That Led Me to Establish the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) at the University of Queensland, Australia オーストラリア Queensland 大学で,日本スペリア電子材料製造研究センター (NS CMEM) を設立してみた。

2022

Journal Article

Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints

Zhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints. Materials, 15 (23) 8321, 1-12. doi: 10.3390/ma15238321

Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints

2022

Journal Article

Grain refinement of primary Cu6Sn5 in the Sn-3wt%Ag-5wt%Cu alloy by Ge

Tan, C.Y., Salleh, M.A.A.Mohd, Saud, N., Chaiprapa, J. and Nogita, K. (2022). Grain refinement of primary Cu6Sn5 in the Sn-3wt%Ag-5wt%Cu alloy by Ge. Journal of Materials Research and Technology, 21, 3301-3312. doi: 10.1016/j.jmrt.2022.10.128

Grain refinement of primary Cu6Sn5 in the Sn-3wt%Ag-5wt%Cu alloy by Ge

2022

Journal Article

Negative thermal expansion and phase transition of low-temperature Mg2NiH4

Luo, Qun, Cai, Qi, Gu, Qinfen, Shi, Yu, Liu, Bin, Tran, Xuan Quy, Matsumura, Syo, Zhang, Tong-Yi, Nogita, Kazuhiro, Lyu, Tao, Li, Qian and Pan, Fusheng (2022). Negative thermal expansion and phase transition of low-temperature Mg2NiH4. Journal of Magnesium and Alloys, 11 (9), 3338-3349. doi: 10.1016/j.jma.2022.09.012

Negative thermal expansion and phase transition of low-temperature Mg2NiH4

2022

Journal Article

Understanding micro and atomic structures of secondary phases in Cu‐doped SnTe

Kawami, Youichirou, Tran, Xuan Quy, Aso, Kohei, Yamamoto, Tomokazu, Wang, Yuan, Li, Meng, Yago, Anya, Matsumura, Syo, Nogita, Kazuhiro and Zou, Jin (2022). Understanding micro and atomic structures of secondary phases in Cu‐doped SnTe. Small, 18 (42) 2204225, 1-12. doi: 10.1002/smll.202204225

Understanding micro and atomic structures of secondary phases in Cu‐doped SnTe

2022

Journal Article

Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage

Tan, Xin F., Kim, Manjin, Gu, Qinfen, Pinzon Piraquive, Julio, Zeng, Guang, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage. Journal of Power Sources, 538 231538, 231538. doi: 10.1016/j.jpowsour.2022.231538

Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage

2022

Journal Article

Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg

Tan, C. Y., Salleh, M.A.A. Mohd, Tan, X. F., Yasuda, H., Saud, N., Ramli, M. I.I. and Nogita, K. (2022). Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg. Materials Today Communications, 31 103221, 103221. doi: 10.1016/j.mtcomm.2022.103221

Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg

2022

Journal Article

Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint

Abdul Razak, N. R., Tan, X. F., Mohd Salleh, M. A. A., McDonald, S. D., Bermingham, M. J., Yasuda, H. and Nogita, K. (2022). Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint. Materials Today Communications, 31 103248, 103248. doi: 10.1016/j.mtcomm.2022.103248

Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint

2022

Journal Article

Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder

Amli, S. F. Muhd, Salleh, M. A. A. Mohd, Ramli, M. I. I., Aziz, M. S. Abdul, Yasuda, H., Chaiprapa, J. and Nogita, K. (2022). Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder. Journal of Materials Science: Materials in Electronics, 33 (17), 14249-14263. doi: 10.1007/s10854-022-08353-z

Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder

2022

Journal Article

Cobalt‐doped Cu6Sn5 lithium‐ion battery anodes with enhanced electrochemical properties

Tan, Xin F., Tao, Shiwei, Ran, Lingbing, Knibbe, Ruth and Nogita, Kazuhiro (2022). Cobalt‐doped Cu6Sn5 lithium‐ion battery anodes with enhanced electrochemical properties. Nano Select, 3 (8), 1264-1276. doi: 10.1002/nano.202200056

Cobalt‐doped Cu6Sn5 lithium‐ion battery anodes with enhanced electrochemical properties

2022

Journal Article

Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process

Kim, Manjin, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D., Ali, Yahia, Matsumura, Syo and Nogita, Kazuhiro (2022). Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process. International Journal of Hydrogen Energy, 47 (36), 16132-16143. doi: 10.1016/j.ijhydene.2022.03.102

Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process

2022

Journal Article

Effect of kaolin geopolymer ceramics addition on the microstructure and shear strength of Sn-3.0Ag-0.5Cu solder joints during multiple reflow

Zaimi, Nur Syahirah Mohamad, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al-Bakri, Nadzri, Nur Izzati Muhammad, Sandu, Andrei Victor, Vizureanu, Petrica, Ramli, Mohd Izrul Izwan, Nogita, Kazuhiro, Yasuda, Hideyuki and Sandu, Ioan Gabriel (2022). Effect of kaolin geopolymer ceramics addition on the microstructure and shear strength of Sn-3.0Ag-0.5Cu solder joints during multiple reflow. Materials, 15 (8) 2758, 2758. doi: 10.3390/ma15082758

Effect of kaolin geopolymer ceramics addition on the microstructure and shear strength of Sn-3.0Ag-0.5Cu solder joints during multiple reflow

2022

Journal Article

The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy

Chang, M. S., Salleh, M. A. A. Mohd, Halin, D. S. C., Ramli, M. I. I., Yasuda, H. and Nogita, K. (2022). The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy. Journal of Alloys and Compounds, 897 163172, 1-10. doi: 10.1016/j.jallcom.2021.163172

The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy

2022

Journal Article

Liquid/solid interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu dissimilar joints during soldering at low temperature by in-situ synchrotron imaging

Ramli, M. I.I., Salleh, M. A. A. Mohd, Nishimura, T., Yasuda, H., Zaimi, N. S. Mohamad and Nogita, K. (2022). Liquid/solid interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu dissimilar joints during soldering at low temperature by in-situ synchrotron imaging. JOM, 74 (7), 2760-2769. doi: 10.1007/s11837-022-05229-9

Liquid/solid interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu dissimilar joints during soldering at low temperature by in-situ synchrotron imaging

2022

Journal Article

Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering

Tan, Xin F., Gu, Qinfen, Bermingham, Michael, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering. Acta Materialia, 226 117661. doi: 10.1016/j.actamat.2022.117661

Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering

2022

Journal Article

The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys

Hao, Qichao, Tan, Xin F., Gu, Qinfen, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2022). The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys. JOM, 74 (4), 1739-1750. doi: 10.1007/s11837-021-05145-4

The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys

2022

Journal Article

Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5

Yang, Wenhui, Tran, Xuan Quy, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Tan, Xin Fu, Kawami, Youichirou, Nogita, Kazuhiro and Matsumura, Syo (2022). Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5. Acta Materialia, 224 117513, 117513. doi: 10.1016/j.actamat.2021.117513

Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5