|
2016 Conference Publication Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni soldersGourlay, C. M., Ma, Z. L., Xian, J. W., Belyakov, S. A., Mohd Salleh, M. A. A., Zeng, G., Yasuda, H. and Nogita, K. (2016). Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni solders. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.44 |
|
2015 Conference Publication The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substratesNg, Wayne, Zeng, Guang, Nishimura, Takatoshi, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2015). The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates. 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, Kyoto, Japan, 14-17 April 2015. Japan: IEEE. doi: 10.1109/ICEP-IAAC.2015.7111122 |
|
2015 Conference Publication Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modellingPrasad, A., Liotti, E., McDonald, S. D., Nogita, K., Yasuda, H., Grant, P. S. and StJohn, D. H. (2015). Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling. 14th International Conference on Modeling of Casting, Welding and Advanced Solidification Processes, Awaji island, Hyogo, Japan, 21-26 June 2015. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/84/1/012014 |
|
2014 Conference Publication Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'Nogita, Kazuhiro, Kennedy, James, Amsler, John, Greaves, Matthew, Tuesley, Cameron and Nishimura, Takatoshi (2014). Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'. 2014 International Conference on Electronics Packaging, ICEP 2014, Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826652 |
|
2014 Conference Publication Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kineticsZeng, Guang, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2014). Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics. 2014 International Conference on Electronics Packaging (ICEP 2014), Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826677 |
|
2013 Conference Publication Grain refinement for improved lead-Free solder joint reliabilitySweatman, K., Mcdonald, S. D., Whitewick, M., Nishimura, T. and Nogita, K. (2013). Grain refinement for improved lead-Free solder joint reliability. IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013, San Diego, United States, 19-21 February 2013. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries. |
|
2013 Conference Publication Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallicsZeng, Guang, McDonald, Stuart, Gu, Qinfen and Nogita, Kazuhiro (2013). Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallics. Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, 3-7 March 2013. |
|
2013 Conference Publication Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short reviewMohd Salleh, M. A. A., McDonald, Stuart and Nogita, Kazuhiro (2013). Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review. ITMS 2013: 4th International Conference on Information Technology for Manufacturing Systems, Auckland, New Zealand, 27-29 August, 2013. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/AMM.421.260 |
|
2013 Conference Publication New phase in stoichiometric Cu6Sn5 and effect of Ni addition on phase stabilization in wide temperature rangeBarry, J., Yamamoto, T., Gu, Q., Huang, Yang, Matsumura, S. and Nogita, Kazuhiro (2013). New phase in stoichiometric Cu6Sn5 and effect of Ni addition on phase stabilization in wide temperature range. Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, 3-7 March 2013. |
|
2013 Conference Publication Crack formation and propagation mechanisms in interfacial Cu6Sn5Nogita, Kazuhiro, Mu, Dekui, McDonald, Stuart D., Read, Stuart D. and Sweatman, Keith (2013). Crack formation and propagation mechanisms in interfacial Cu6Sn5. ICEP 2013: International Conference on Electronic Packaging 2013, Osaka, Japan, 10-12 April 2013. Osaka, Japan: Japan Institute of Electronics Packaging (JIEP). |
|
2012 Conference Publication Effect of cooling rate on the intermetallic layer in solder jointsSweatman, Keith, Nishimura, Tetsuro, McDonald, Stuary D. and Nogita, Kazuhiro (2012). Effect of cooling rate on the intermetallic layer in solder joints. IPC APEX Expo 2012, San Diego, United States, 28 February - 1 March 2012. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries. |
|
2012 Conference Publication Industry-university collaboration and advances in lead-free solder technologyNogita, Kazuhiro (2012). Industry-university collaboration and advances in lead-free solder technology. Proc. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012. |
|
2012 Conference Publication The stability of Cu6Sn5 in the formation and performance of lead-free solder jointsSweatman, Keith, Nishimura, T. and Nogita, Kazuhiro (2012). The stability of Cu6Sn5 in the formation and performance of lead-free solder joints. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012. |
|
2012 Conference Publication Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5Mu, Dekui, Huang, Han and Nogita, Kazuhiro (2012). Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. TMS 2012 141st Annual Meeting and Exhibition, Orlando, United States, 11-15 March 2012. |
|
2011 Conference Publication Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder jointsMu, D., Read, J., Yang, Y-F. and Nogita, K. (2011). Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder joints. International Conference on Electronic Packaging (ICEP 2011), Nara, Japan, 13-15 April 2011. Nara, Japan: The Japan Institute of Electronics Packaging. |
|
2011 Conference Publication The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free soldersSweatman, Keith, Read, J., Nishimura, T. and Nogita, Kazuhiro (2011). The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free solders. SMTA International, Fort Worth, Texas, United States, 16-20 October 2011. |
|
2010 Conference Publication Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFSNogita, Kazuhiro, Jenke, Marc, Wood, David, Duguid, Andrew and McDonald, Stuart D. (2010). Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS. 7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2 - 6 August 2010. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2851 |
|
2010 Conference Publication Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interfaceTsukamoto, Hideaki, Dong, Zigang, Huang, Han, Nishimura, Tetsuro and Nogita, Kazuhiro (2010). Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface. Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2-6 August, 2010. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2446 |
|
2010 Conference Publication Trace element distribution in solder joints between Sn-based solders and Cu substratesNogita, K., Yasuda, H., Gourlay, C. M., Suenaga, S., Tsukamoto, H., McDonald, S. D., Takeuchi, A., Uesugi, K. and Suzuki, Y. (2010). Trace element distribution in solder joints between Sn-based solders and Cu substrates. International Conference on Electronics Packaging ICEP2010, Sapporo, Hokkaido, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP). |
|
2010 Conference Publication Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder jointsMu, Dekui, Tsukamoto, Hideaki, Huang, Han and Nogita, Kazuhiro (2010). Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, Cairns, QLD, Australia, 2-6 August, 2010. Stafa-Zurich ; United Kingdom: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2450 |
