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2010 Conference Publication Lead-free solders for electric vehicles - Global Green Challenge: Eco-challenge racingNogita, K., Greaves, M., Guymer, B., Walsh, B., Kennedy, J., Duke, M. and Nishimura, T. (2010). Lead-free solders for electric vehicles - Global Green Challenge: Eco-challenge racing. International Conference on Electronics Packaging 2010, Sapporo, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP). |
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2010 Conference Publication Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFSNogita, Kazuhiro, Jenke, Marc, Wood, David, Duguid, Andrew and McDonald, Stuart D. (2010). Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS. 7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2 - 6 August 2010. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2851 |
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2010 Conference Publication Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interfaceTsukamoto, Hideaki, Dong, Zigang, Huang, Han, Nishimura, Tetsuro and Nogita, Kazuhiro (2010). Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface. Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2-6 August, 2010. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2446 |
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2010 Conference Publication Trace element distribution in solder joints between Sn-based solders and Cu substratesNogita, K., Yasuda, H., Gourlay, C. M., Suenaga, S., Tsukamoto, H., McDonald, S. D., Takeuchi, A., Uesugi, K. and Suzuki, Y. (2010). Trace element distribution in solder joints between Sn-based solders and Cu substrates. International Conference on Electronics Packaging ICEP2010, Sapporo, Hokkaido, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP). |
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2010 Conference Publication Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder jointsMu, Dekui, Tsukamoto, Hideaki, Huang, Han and Nogita, Kazuhiro (2010). Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, Cairns, QLD, Australia, 2-6 August, 2010. Stafa-Zurich ; United Kingdom: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2450 |
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2009 Conference Publication Mechanism of Improved Hydrogen Absorption Kinetics in Cast Mg-Ni AlloysNogita, Kazuhiro (2009). Mechanism of Improved Hydrogen Absorption Kinetics in Cast Mg-Ni Alloys. Switzerland: Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/MSF.618-619.391 |
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2009 Conference Publication The influence of solder composition on the impact strength of lead-free solder BGA jointsTsukamoto, Hideaki, Nogita, Kazuhiro, McDonald, Stuart, Nishimura, Tetsuro, Suenaga, Shoichi and Sweatman, Keith W. (2009). The influence of solder composition on the impact strength of lead-free solder BGA joints. 2009 TMS Annual Meeting & Exhibition, San Francisco, CA, USA, 15 - 19 February 2009. TMS. |
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2009 Conference Publication Ball impact behavior of Sn-Cu (-Ni) lead-free solder jointsTsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, 1-3 July 2009. |
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2009 Conference Publication Effect of intermetallic stabilization on the impact resistance of joints to BGA packagesSweatman, Keith, Suenaga, Shoichi, Miyaoka, M., Nozu, Takashi, Nogita, Kazuhiro and Nishimura, Tetsuro (2009). Effect of intermetallic stabilization on the impact resistance of joints to BGA packages. 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, 9 - 11 December 2009. Piscataway, NJ United States: I E E E. doi: 10.1109/EPTC.2009.5416526 |
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2009 Conference Publication The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substratesNogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. TMS 2009, San Francisco, California, USA, 15-19 February 2009. |
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2009 Conference Publication Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfacesNogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, 14-16 April, 2009. Kyoto, Japan: Japan Institute of Electronics Packaging. |
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2009 Conference Publication Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substratesHideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, 1-16 April 2009. Japan: Japan Institute of Electronics Packaging. |
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2009 Conference Publication The Effect of Ni on Phase Stability in Cu6Sn5Nogita, K., Read, J., Tsukamoto, H., McDonald, S. D., Gourlay, C. M. and Nishimura, T. (2009). The Effect of Ni on Phase Stability in Cu6Sn5. Japan Institute of Metals Autumn Meeting 2009, Kyoto, Japan, 15-17 September 2009. |
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2009 Conference Publication The influence of Ni additions on the solidification of Sn-0.7%Cu solderT. Ventura, C. M. Gourlay, K. Nogita, M. Rappaz and A. K. Dahle (2009). The influence of Ni additions on the solidification of Sn-0.7%Cu solder. Materials and AustCeram 2009 Conference, Gold Coast, Australia, 1-3 July 2009. |
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2008 Conference Publication Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfacesTsukamoto, H., Dong, Z., Huang, H., Nishimura, T. and Nogita, K. (2008). Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces. Materials and AustCeram Conference (MAC 2009), Gold Coast, Queensland, 1-3 July 2009. |
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2008 Conference Publication Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloysNogita, K., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. and Tsukamoto, H. (2008). Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys. Japanese Institute of Metals Annual Autumn Meeting 2008, Kumamoto, Japan, 23-25 September 2008. |
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2007 Conference Publication Solidification characteristics of lead-free solder Sn-0.7Cu-0.06NiVentura, T., Nogita, K., Gourlay, C., Nishimura, T., Rappaz, M. and Dahle, A.K. (2007). Solidification characteristics of lead-free solder Sn-0.7Cu-0.06Ni. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. United Kingdom: Department of Engineering Materials, University of Sheffield. |
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2007 Conference Publication New approaches to understand modification and nucleation mechanisms of hypoeutectic Al-Si AlloysNogita, K., McDonald, S.D. and Dahle, A.K. (2007). New approaches to understand modification and nucleation mechanisms of hypoeutectic Al-Si Alloys. TMS Annual Meeting, Orlando, Florida, USA, February 25 - March 1 2007. United Stated: The Minerals, Metals and Materials Society. |
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2007 Conference Publication Analysis of trace elements in Na-modified Al-10 wt%Si using EMPA and NanoSIMSSimensen, C.J., Hillion, F., Nielsen, O., Nogita, K. and Dahle, A.K. (2007). Analysis of trace elements in Na-modified Al-10 wt%Si using EMPA and NanoSIMS. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. Great Britain: Department of Engineering Materials, University of Sheffield. |
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2007 Conference Publication Microstructure and solidification of hypoeutectic, eutectic, and hypereutectic Mg-Mg2Ni alloysNogita, K. and Dahle, A.K. (2007). Microstructure and solidification of hypoeutectic, eutectic, and hypereutectic Mg-Mg2Ni alloys. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July, 2007. Sheffield, United Kingdom: Department of Engineering Materials, University of Sheffield. |
