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2019 Conference Publication Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditionsSomidin, Flora, McDonald, Stuart D., Ye, Xiaozou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions. 2019 International Conference on Electronics Packaging (ICEP2019), Niigata, Japan, 17-20 April 2019. NEW YORK: Institute of Electrical and Electronics Engineers (IEEE). doi: 10.23919/ICEP.2019.8733594 |
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2019 Conference Publication Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substratesAbdul Razak, Nurul Razliana, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012008 |
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2019 Conference Publication Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substratesTan, Xin Fu, Abdul Razak, Nurul Razliana, Husain, Muhammad Hafiz, McDonald, Stuart and Nogita, Kazuhiro (2019). Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019, Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012007 |
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2018 Conference Publication Effect of reflow conditions on the intermetallic layer in solder jointsNogita, K., Somidin, F., Mohd Salleh, M. A.A., Sweatman, K., Nishimura, T., McDonald, S. D., Maeno, H. and Matsumura, S. (2018). Effect of reflow conditions on the intermetallic layer in solder joints. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kuwana, Mie, Japan, 17 - 21 April 2018. Japan: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2018.8374678 |
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2018 Conference Publication The challenges associated with the formation of equiaxed grains during additive manufacturing of titanium alloysStJohn, David H., McDonald, Stuart D., Bermingham, Michael J., Mereddy, Sri, Prasad, Arvind and Dargusch, Matthew (2018). The challenges associated with the formation of equiaxed grains during additive manufacturing of titanium alloys. 4th International Conference on Powder Metallurgy of Titanium, PMTi 2017, Xian, China, 8-10 September 2017. Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/KEM.770.155 |
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2018 Conference Publication The interaction of Sn-Ga alloys and Au coated Cu substratesLiu, Shi Qian, Qu, Dong Dong, McDonald, Stuart D. and Nogita, Kazuhiro (2018). The interaction of Sn-Ga alloys and Au coated Cu substrates. 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1 - 2 November 2017. Pfaffikon, Switzerland: Scientific.Net. doi: 10.4028/www.scientific.net/SSP.273.3 |
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2018 Conference Publication Experimental study of the solidification microstructure in the Mg-Rich corner of Mg–Al–Ce systemWong, Charlotte, Styles, Mark J., Zhu, Suming, Abbott, Trevor, Nogita, Kazuhiro, McDonald, Stuart D., StJohn, David H., Gibson, Mark A. and Easton, Mark A. (2018). Experimental study of the solidification microstructure in the Mg-Rich corner of Mg–Al–Ce system. International Symposium on Magnesium Technology, 2018, Phoenix, AZ, USA, March 11, 2018-March 15, 2018. Springer International Publishing. doi: 10.1007/978-3-319-72332-7_13 |
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2018 Conference Publication Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solderXuan, Quy Tran, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart D. and Nogita, Kazuhiro (2018). Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solder. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan , 1-2 November 2017 . Zurich, Switzerland : Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.9 |
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2018 Conference Publication Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloysTan, Xin Fu, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart and Nogita, Kazuhiro (2018). Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloys. Electronic Packaging Interconnect Technology Symposium, Fukuoka, Japan, 1-2 November 2017. Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/SSP.273.20 |
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2018 Conference Publication Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffractionQu, Dong Dong, McDonald, Stuart D., Yasuda, Hideyuki, Ohara, Koji, Kohara, Shinji and Nogita, Kazuhiro (2018). Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.101 |
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2018 Conference Publication Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bondingSomidin, Flora, McDonald, Stuart and Nogita, Kazuhiro (2018). Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bonding. Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1-2 November 2017. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.14 |
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2017 Conference Publication Real-time observation of AZ91 solidification by synchrotron radiographyZeng, G., Nogita, K., Belyakov, S., Xian, J. W., McDonald, S. D., Yang, K. V., Yasuda, H. and Gourlay, C. M. (2017). Real-time observation of AZ91 solidification by synchrotron radiography. Magnesium Technology 2017, San Diego, CA, United States, 26 February - 2 March 2017. Cham, Switzerland: Springer. doi: 10.1007/978-3-319-52392-7_82 |
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2017 Conference Publication Effects of Bi in Sn-Cu based lead-free solder alloys and interconnectsNogita, K., Salleh, M. A. A. Mohd, Smith, S., Wu, Y. Q., McDonald, S. D., Ab Razak, A. G., Akaiwa, T. and Nishimura, T. (2017). Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects. 2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Japan, 19 - 22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2017.7939399 |
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2017 Conference Publication Real time X-ray imaging of soldering processes at the SPring-8 synchrotronNogita, K., Salleh, M. A. A. Mohd, Zeng, G., McDonald, S. D., Gourlay, C. and Yasuda, H. (2017). Real time X-ray imaging of soldering processes at the SPring-8 synchrotron. International Conference on Electronics Packaging (ICEP), Tendo, Japan, 19-22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers . doi: 10.23919/ICEP.2017.7939343 |
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2016 Conference Publication The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloysDarlapudi, A., McDonald, S.D. and St John, D.H. (2016). The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloys. 4th International Conference on Advances in Solidification Processes, ICASP 2014, Windsor, United Kingdom, July 8-11, 2014. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/117/1/012022 |
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2016 Conference Publication Effects of trace phosphorus in Sn-Cu-Ni wave solder drossNogita, K., Mohd Salleh, M. A. A., Tran, X. Q., Read, J., Smith, S. and McDonald, S. D. (2016). Effects of trace phosphorus in Sn-Cu-Ni wave solder dross. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.49 |
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2016 Conference Publication Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloysNogita, K., Kefford, B., Read, J. and McDonald, S. D. (2016). Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.53 |
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2016 Conference Publication Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applicationsSmith, S., Zeng, G., Read, J., McDonald, S. D. and Nogita, K. (2016). Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.58 |
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2015 Conference Publication The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substratesNg, Wayne, Zeng, Guang, Nishimura, Takatoshi, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2015). The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates. 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, Kyoto, Japan, 14-17 April 2015. Japan: IEEE. doi: 10.1109/ICEP-IAAC.2015.7111122 |
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2015 Conference Publication Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modellingPrasad, A., Liotti, E., McDonald, S. D., Nogita, K., Yasuda, H., Grant, P. S. and StJohn, D. H. (2015). Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling. 14th International Conference on Modeling of Casting, Welding and Advanced Solidification Processes, Awaji island, Hyogo, Japan, 21-26 June 2015. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/84/1/012014 |
