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2026 Journal Article Multimodal Feature-Level Fusion CBAM U-Net for Static Plantar Pressure Prediction Using Plantar Geometry and Sparse Anatomical LandmarksWang, Chongguang, Evans, Kerrie, Hartley, Dean, Morrison, Scott, McDonald, Stuart, Veidt, Martin and Wang, Gui (2026). Multimodal Feature-Level Fusion CBAM U-Net for Static Plantar Pressure Prediction Using Plantar Geometry and Sparse Anatomical Landmarks. Sensors, 26 (13), 4143. doi: 10.3390/s26134143 |
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2026 Journal Article Reconstruction of gait variables from 3D foot geometry and sparse plantar pressure landmarks using deep learningWang, Chongguang, Evans, Kerrie, Hartley, Dean, Morrison, Scott, McDonald, Stuart, Veidt, Martin and Wang, Gui (2026). Reconstruction of gait variables from 3D foot geometry and sparse plantar pressure landmarks using deep learning. Journal of Biomechanics, 205 113427, 113427-113427. doi: 10.1016/j.jbiomech.2026.113427 |
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2026 Conference Publication In-situ observation of dislocation movement, accumulation and crack propagation during tensile loading in Sn and Sn-based solder alloysNogita, Kazuhiro, Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Maeno, Hiroshi, Matsumura, Syo and Yasuda, Kazuhiro (2026). In-situ observation of dislocation movement, accumulation and crack propagation during tensile loading in Sn and Sn-based solder alloys. IEEE. doi: 10.23919/icep-hbs69241.2026.11550492 |
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2026 Conference Publication Tensile properties of Sn-37Bi-0.5Sb-0.5Cu-0.03Ni low-temperature soldering alloyYe, Xiaozhou, McDonald, Stuart D, Tan, Xin Fu, Nishimura, Takatoshi, Sweatman, Keith and Nogita, Kazuhiro (2026). Tensile properties of Sn-37Bi-0.5Sb-0.5Cu-0.03Ni low-temperature soldering alloy. IEEE. doi: 10.23919/icep-hbs69241.2026.11550708 |
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2026 Conference Publication In-situ observation of BiIn <sub>2</sub> (Sn) dissolution in low temperature In-Sn-Bi alloysZhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2026). In-situ observation of BiIn 2 (Sn) dissolution in low temperature In-Sn-Bi alloys. IEEE. doi: 10.23919/icep-hbs69241.2026.11550719 |
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2026 Journal Article IMU-based wearable insoles in clinical settings: key parameters differentiating clinical and non-clinical populationsLin, Sheng, Evans, Kerrie, Hartley, Dean, Morrison, Scott, McDonald, Stuart, Veidt, Martin and Wang, Gui (2026). IMU-based wearable insoles in clinical settings: key parameters differentiating clinical and non-clinical populations. Sensors, 26 (6) 1802, 1-17. doi: 10.3390/s26061802 |
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2026 Journal Article Temperature‐dependent electrical resistivity in In–Sn alloys with varied phase composition and ternary element levelsZhou, Jiye, Ye, Hanyue, Tan, Xin F., McDonald, Stuart D. and Nogita, Kazuhiro (2026). Temperature‐dependent electrical resistivity in In–Sn alloys with varied phase composition and ternary element levels. Journal of Materials Science: Materials in Electronics, 37 (4) 293, 1-18. doi: 10.1007/s10854-026-16650-0 |
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2025 Journal Article Effect of Ni addition on the solidification of liquid Al and solid Cu diffusion couplesHari, Vigneshwar, McDonald, Stuart D., Tan, Xin Fu and Nogita, Kazuhiro (2025). Effect of Ni addition on the solidification of liquid Al and solid Cu diffusion couples. Materials, 18 (24) 5689. doi: 10.3390/ma18245689 |
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2025 Journal Article Mechanical properties and microstructure of hypoeutectic and eutectic Sn-Bi alloys over a broad range of temperatures and strain ratesYe, Xiaozhou, McDonald, Stuart D, Tan, Xin Fu and Nogita, Kazuhiro (2025). Mechanical properties and microstructure of hypoeutectic and eutectic Sn-Bi alloys over a broad range of temperatures and strain rates. Journal of Alloys and Compounds, 1050 185678, 185678. doi: 10.1016/j.jallcom.2025.185678 |
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2025 Journal Article Unlocking superplasticity and enhanced strength in ultra-low temperature In-Sn-Bi solder alloys via dynamic microstructure engineeringZhou, Jiye, Tan, Xin F., Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2025). Unlocking superplasticity and enhanced strength in ultra-low temperature In-Sn-Bi solder alloys via dynamic microstructure engineering. Materials Science and Engineering: A, 944 148897, 1-11. doi: 10.1016/j.msea.2025.148897 |
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2025 Journal Article In-Situ Observation of Failure in Pb-Free Solder Joints in Tensile StrainSweatman, Keith, Tan, Xin F., McDonald, Stuart D. and Nogita, Kazuhiro (2025). In-Situ Observation of Failure in Pb-Free Solder Joints in Tensile Strain. SMTA International, 27 (1), 536-541. doi: 10.37665/smzjxln46586 |
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2025 Journal Article In situ observation of deformation in a Sn-3Ag-0.5Cu/Cu solder joint using high-voltage transmission electron microscopyNogita, Kazuhiro, Tan, Xin Fu, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith, Somidin, Flora, Zeng, Guang, Maeno, Hiroshi, Yasuda, Kazuhiro and Gourlay, Christopher M. (2025). In situ observation of deformation in a Sn-3Ag-0.5Cu/Cu solder joint using high-voltage transmission electron microscopy. Materials, 18 (16) 3925, 1-11. doi: 10.3390/ma18163925 |
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2025 Journal Article A review of gait analysis using gyroscopes and inertial measurement unitsLin, Sheng, Evans, Kerrie, Hartley, Dean, Morrison, Scott, McDonald, Stuart, Veidt, Martin and Wang, Gui (2025). A review of gait analysis using gyroscopes and inertial measurement units. Sensors, 25 (11) 3481, 3481. doi: 10.3390/s25113481 |
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2025 Conference Publication Development of Indium-based low temperature solder alloys for Martian conditionsZhou, Jiye, Tan, Xin F., McDonald, Stuart D., Nishimura, Tetsuro and Nogita, Kazuhiro (2025). Development of Indium-based low temperature solder alloys for Martian conditions. 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Nagano, Japan, 15-19 April 2025. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep-iaac64884.2025.11002990 |
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2025 Conference Publication In-Situ Observations of Crack Propagation and Microstructure Evolution in a SAC305/ Cu Solder Joint Using High-Voltage Electron MicroscopyNogita, Kazuhiro, Tan, Xin F., Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith, Somidin, Flora, Maeno, Hiroshi and Yasuda, Kazuhiro (2025). In-Situ Observations of Crack Propagation and Microstructure Evolution in a SAC305/ Cu Solder Joint Using High-Voltage Electron Microscopy. 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Nagano, Japan, 15-19 April 2025. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep-iaac64884.2025.11002927 |
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2025 Conference Publication Nanoindentation study of phases in near-eutectic Sn-Bi alloyTan, Xin Fu, Paul, Viola, Ohmura, Takahito, McDonald, Stuart D. and Nogita, Kazuhiro (2025). Nanoindentation study of phases in near-eutectic Sn-Bi alloy. 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Nagano, Japan, 15 - 19 April 2025. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep-iaac64884.2025.11002920 |
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2025 Conference Publication Tensile properties of Sn-37wt%Bi and Sn-57wt%Bi at temperatures below 0°CYe, Xiaozhou, McDonald, Stuart D., Tan, Xin Fu and Nogita, Kazuhiro (2025). Tensile properties of Sn-37wt%Bi and Sn-57wt%Bi at temperatures below 0°C. 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Nagano, Japan, 15 - 19 April 2025. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep-iaac64884.2025.11002926 |
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2025 Journal Article The effect of gallium addition on the microstructure and superconducting properties of In-Bi-Sn solder alloysZhou, Jiye, Shahbazi, Mahboobeh, Poitras, Jordan T., Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2025). The effect of gallium addition on the microstructure and superconducting properties of In-Bi-Sn solder alloys. Journal of Electronic Materials, 54 (4), 2628-2637. doi: 10.1007/s11664-024-11584-x |
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2025 Journal Article Effect of Sr addition on the microstructure and fluidity of hypoeutectic Al-Ni alloyHari, Vigneshwar, McDonald, Stuart, Qu, Dongdong, Tan, Xin Fu, Xu, Dong, Tong, Zherui and Nogita, Kazuhiro (2025). Effect of Sr addition on the microstructure and fluidity of hypoeutectic Al-Ni alloy. Journal of Alloys and Compounds, 1016 178842, 1-10. doi: 10.1016/j.jallcom.2025.178842 |
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2025 Conference Publication Solution hardening effect of Bi additions to the β-In3Sn phase in In-Sn-Bi low temperature solder alloys via alloy design and heat treatmentZhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2025). Solution hardening effect of Bi additions to the β-In3Sn phase in In-Sn-Bi low temperature solder alloys via alloy design and heat treatment. Green Materials and Electronic Packaging Interconnect Technology Symposium (EPITS 2024), Ho Chi Minh City, Vietnam, 26-27 August 2024. New York, NY, United States: Springer New York. doi: 10.1007/978-981-96-2871-1_10 |
