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2019 Journal Article Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodesTan, Xin F., Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodes. ACS Applied Energy Materials, 3 (1) acsaem.9b02014, 141-145. doi: 10.1021/acsaem.9b02014 |
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2019 Journal Article The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodesTan, Xin F., McDonald, Stuart D., Gu, Qinfen, Wang, Lianzhou, Matsumura, Syo and Nogita, Kazuhiro (2019). The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes. Journal of Power Sources, 440 227085, 227085. doi: 10.1016/j.jpowsour.2019.227085 |
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2019 Journal Article Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reactionLiu, Shiqian, Yang, Wenhui, Kawami, Youichirou, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, McDonald, Stuart and Nogita, Kazuhiro (2019). Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reaction. ACS Applied Materials and Interfaces, 11 (35) acsami.9b10630, 32523-32532. doi: 10.1021/acsami.9b10630 |
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2019 Journal Article In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloyZeng, G., Callaghan, M. D., McDonald, S. D., Yasuda, H. and Nogita, K. (2019). In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloy. Journal of Alloys and Compounds, 797, 804-810. doi: 10.1016/j.jallcom.2019.04.153 |
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2019 Journal Article A new approach to nuclei identification and grain refinement in titanium alloysTedman-Jones, S. N., McDonald, S. D., Bermingham, M. J., StJohn, D. H. and Dargusch, M. S. (2019). A new approach to nuclei identification and grain refinement in titanium alloys. Journal of Alloys and Compounds, 794, 268-284. doi: 10.1016/j.jallcom.2019.04.224 |
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2019 Journal Article Solidification path and microstructure evolution of Mg-3Al-14La alloy: implications for the Mg-rich corner of the Mg-Al-La phase diagramWong, Charlotte, Nogita, Kazuhiro, Styles, Mark J., Zhu, Suming, Qiu, Dong, McDonald, Stuart D., Gibson, Mark A., Abbott, Trevor B. and Easton, Mark A. (2019). Solidification path and microstructure evolution of Mg-3Al-14La alloy: implications for the Mg-rich corner of the Mg-Al-La phase diagram. Journal of Alloys and Compounds, 784, 527-534. doi: 10.1016/j.jallcom.2019.01.029 |
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2019 Journal Article Investigating the morphological effects of solute on the β-phase in as-cast titanium alloysTedman-Jones, S.N., McDonald, S.D., Bermingham, M.J., St John, D.H. and Dargusch, M.S. (2019). Investigating the morphological effects of solute on the β-phase in as-cast titanium alloys. Journal of Alloys and Compounds, 778, 204-214. doi: 10.1016/j.jallcom.2018.11.063 |
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2019 Journal Article Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collectorTan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Hu, Yuxiang, Wang, Lianzhou, Matsumura, Syo, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collector. Journal of Power Sources, 415, 50-61. doi: 10.1016/j.jpowsour.2019.01.034 |
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2019 Conference Publication Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substratesAbdul Razak, Nurul Razliana, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012008 |
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2019 Conference Publication Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloysMehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart and Stjohn, David (2019). Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloys. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012009 |
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2019 Conference Publication Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substratesTan, Xin Fu, Abdul Razak, Nurul Razliana, Husain, Muhammad Hafiz, McDonald, Stuart and Nogita, Kazuhiro (2019). Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019, Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012007 |
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2019 Conference Publication Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditionsSomidin, Flora, McDonald, Stuart D., Ye, Xiaozou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions. 2019 International Conference on Electronics Packaging (ICEP2019), Niigata, Japan, 17-20 April 2019. NEW YORK: Institute of Electrical and Electronics Engineers (IEEE). doi: 10.23919/ICEP.2019.8733594 |
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2019 Journal Article A new perspective on the nucleation, growth morphology and modification of the silicon phase during the formation of eutectic Al-Si grainsStJohn, David, McDonald, Stuart and Darlapudi, Anilajaram (2019). A new perspective on the nucleation, growth morphology and modification of the silicon phase during the formation of eutectic Al-Si grains. JOM, 71 (1), 391-396. doi: 10.1007/s11837-018-3124-5 |
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2019 Conference Publication Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflowSomidin, Flora, McDonald, Stuart, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflow. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012006 |
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2018 Journal Article Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder jointSomidin, Flora, Maeno, Hiroshi, Tran, Xuan, McDonald, Stuart D., Mohd Salleh, Mohd, Matsumura, Syo and Nogita, Kazuhiro (2018). Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint. Materials, 11 (11) 2229, 2229. doi: 10.3390/ma11112229 |
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2018 Journal Article Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of NiMehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart, Yasuda, Hideyuki and St John, David (2018). Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni. Journal of Alloys and Compounds, 766, 1003-1013. doi: 10.1016/j.jallcom.2018.06.251 |
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2018 Journal Article (Al,Mg)3La: a new phase in the Mg-Al-La systemWong, Charlotte, Styles, Mark J., Zhu, Suming, Qiu, Dong, McDonald, Stuart D., Zhu, Yuman, Gibson, Mark A., Abbott, Trevor B. and Easton, Mark A. (2018). (Al,Mg)3La: a new phase in the Mg-Al-La system. Acta Crystallographica Section B-Structural Science Crystal Engineering and Materials, 74 (4), 370-375. doi: 10.1107/S205252061800834X |
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2018 Journal Article Ga-based alloys in microelectronic interconnects: a reviewLiu, Shiqian, Sweatman, Keith, McDonald, Stuart and Nogita, Kazuhiro (2018). Ga-based alloys in microelectronic interconnects: a review. Materials, 11 (8) 1384, 1384. doi: 10.3390/ma11081384 |
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2018 Journal Article The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: reviewLiu, Shiqian, McDonald, Stuart, Sweatman, Keith and Nogita, Kazuhiro (2018). The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: review. Microelectronics Reliability, 84, 170-180. doi: 10.1016/j.microrel.2018.03.038 |
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2018 Journal Article Effect of trace lanthanum hexaboride and boron additions on microstructure, tensile properties and anisotropy of Ti-6Al-4V produced by additive manufacturingBermingham, M. J., McDonald, S. D. and Dargusch, M. S. (2018). Effect of trace lanthanum hexaboride and boron additions on microstructure, tensile properties and anisotropy of Ti-6Al-4V produced by additive manufacturing. Materials Science and Engineering A, 719, 1-11. doi: 10.1016/j.msea.2018.02.012 |
