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2013 Journal Article Real time synchrotron X-ray observations of solidification in hypoeutectic Al-Si alloysNogita, Kazuhiro, Yasuda, Hideyuki, Prasad, Arvind, McDonald, Stuart D., Nagira, Tomoya, Nakatsuka, Noriaki, Uesugi, Kentaro and StJohn, David H. (2013). Real time synchrotron X-ray observations of solidification in hypoeutectic Al-Si alloys. Materials Characterization, 85, 134-140. doi: 10.1016/j.matchar.2013.08.015 |
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2013 Journal Article XRD study of the kinetics of transformations in tinNogita, K., Gourlay, C. M., McDonald, S. D., Suenaga, S., Read, J., Zeng, G. and Gu, Q. F. (2013). XRD study of the kinetics of transformations in tin. Philosophical Magazine, 93 (27), 3627-3647. doi: 10.1080/14786435.2013.820381 |
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2013 Journal Article A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methodsSalleh, Mohd Arif Anuar Mohd, Al Bakri, Abdullah Mohd Mustafa, Somidin, Flora, Sandu, Andrei Victor, Saud, Norainiza, Kamaruddin, Hussin, McDonald, Stuart D. and Nogita, Kazuhiro (2013). A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods. Revista De Chimie, 64 (7), 725-728. |
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2013 Journal Article Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5Wu, Y. Q., McDonald, S. D., Read, J., Huang, H. and Nogita, K. (2013). Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5. Scripta Materialia, 68 (8), 595-598. doi: 10.1016/j.scriptamat.2012.12.012 |
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2013 Journal Article Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planesMu, D., Huang, H., McDonald, S. D., Read, J. and Nogita, K. (2013). Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 566, 126-133. doi: 10.1016/j.msea.2012.12.057 |
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2013 Journal Article Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperaturesMu, Dekui, Huang, Han, McDonald, Stuart D. and Nogita, Kazuhiro (2013). Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperatures. Journal of Electronic Materials, 42 (2), 304-311. doi: 10.1007/s11664-012-2227-y |
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2013 Journal Article Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloysMcDonald, Stuart, Nogita, Kazuhiro, Read, Jonathan, Ventura, Tina and Nishimura, Tetsuro (2013). Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloys. Journal of Electronic Materials, 42 (2), 256-262. doi: 10.1007/s11664-012-2222-3 |
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2013 Journal Article Hydrogen desorption of Mg-Mg2Ni hypo-eutectic alloys in Air, Ar, C02, N2 and H2Nogita, K., McDonald, S., Duguid, A., Tsubota, M. and Gu, Q. F. (2013). Hydrogen desorption of Mg-Mg2Ni hypo-eutectic alloys in Air, Ar, C02, N2 and H2. Journal of Alloys and Compounds, 580 (SUPPL1), S140-S143. doi: 10.1016/j.jallcom.2013.01.006 |
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2013 Conference Publication Crack formation and propagation mechanisms in interfacial Cu6Sn5Nogita, Kazuhiro, Mu, Dekui, McDonald, Stuart D., Read, Stuart D. and Sweatman, Keith (2013). Crack formation and propagation mechanisms in interfacial Cu6Sn5. ICEP 2013: International Conference on Electronic Packaging 2013, Osaka, Japan, 10-12 April 2013. Osaka, Japan: Japan Institute of Electronics Packaging (JIEP). |
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2013 Conference Publication Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallicsZeng, Guang, McDonald, Stuart, Gu, Qinfen and Nogita, Kazuhiro (2013). Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallics. Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, 3-7 March 2013. |
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2013 Conference Publication Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short reviewMohd Salleh, M. A. A., McDonald, Stuart and Nogita, Kazuhiro (2013). Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review. ITMS 2013: 4th International Conference on Information Technology for Manufacturing Systems, Auckland, New Zealand, 27-29 August, 2013. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/AMM.421.260 |
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2013 Conference Publication Grain refinement for improved lead-Free solder joint reliabilitySweatman, K., Mcdonald, S. D., Whitewick, M., Nishimura, T. and Nogita, K. (2013). Grain refinement for improved lead-Free solder joint reliability. IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013, San Diego, United States, 19-21 February 2013. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries. |
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2013 Journal Article Real time synchrotron X-ray imaging for nucleation and growth of Cu6Sn5 in Sn-7Cu-0.05Ni high temperature lead-free solder alloysNogita, Kazuhiro, Yasuda, Hideyuki, McDonald, Stuart D. and Uesugi, Kentaro (2013). Real time synchrotron X-ray imaging for nucleation and growth of Cu6Sn5 in Sn-7Cu-0.05Ni high temperature lead-free solder alloys. Advanced Materials Research, 626, 200-204. doi: 10.4028/www.scientific.net/AMR.626.200 |
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2012 Journal Article A new phase in stoichiometric Cu6Sn5Wu, Y. Q., Barry, J., Yamamoto, T., Gu, Q. F., McDonald, S. D., Matsumura, S., Huang, H. and Nogita, K. (2012). A new phase in stoichiometric Cu6Sn5. Acta Materialia, 60 (19), 6581-6591. doi: 10.1016/j.actamat.2012.08.024 |
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2012 Journal Article Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallicsZeng, Guang, McDonald, Stuart D., Gu, Qinfen and Nogita, Kazuhiro (2012). Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallics. Journal of Materials Research, 27 (20), 2609-2614. doi: 10.1557/jmr.2012.247 |
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2012 Journal Article Development of high-temperature solders: ReviewZeng, Guang, McDonald, Stuart and Nogita, Kazuhiro (2012). Development of high-temperature solders: Review. Microelectronics Reliability, 52 (7), 1306-1322. doi: 10.1016/j.microrel.2012.02.018 |
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2012 Journal Article Determination of minimum machining depth after heat treatment of ASTM grade 2 titanium alloyDobeson, Richard G., McDonald, Stuart D. and Dargusch, Matthew S. (2012). Determination of minimum machining depth after heat treatment of ASTM grade 2 titanium alloy. Advanced Engineering Materials, 14 (7), 473-476. doi: 10.1002/adem.201200106 |
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2012 Journal Article Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2)Nogita, K., Mu, D., McDonald, S. D., Read, J. and Wu, Y. Q. (2012). Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2). Intermetallics, 26, 78-85. doi: 10.1016/j.intermet.2012.03.047 |
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2012 Conference Publication Effect of cooling rate on the intermetallic layer in solder jointsSweatman, Keith, Nishimura, Tetsuro, McDonald, Stuary D. and Nogita, Kazuhiro (2012). Effect of cooling rate on the intermetallic layer in solder joints. IPC APEX Expo 2012, San Diego, United States, 28 February - 1 March 2012. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries. |
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2011 Journal Article Kinetics of the eta-eta' transformation in Cu6Sn5Nogita, K., Gourlay, C. M., McDonald, S. D., Wu, Y. Q., Read, J. and Gu, Q. F. (2011). Kinetics of the eta-eta' transformation in Cu6Sn5. Scripta Materialia, 65 (10), 922-925. doi: 10.1016/j.scriptamat.2011.07.058 |
