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2016 Conference Publication Effects of trace phosphorus in Sn-Cu-Ni wave solder drossNogita, K., Mohd Salleh, M. A. A., Tran, X. Q., Read, J., Smith, S. and McDonald, S. D. (2016). Effects of trace phosphorus in Sn-Cu-Ni wave solder dross. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.49 |
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2015 Journal Article A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloysPrasad, Arvind, Macdonald, Stuart D., Yasuda, Hideyuki, Nogita, Kazuhiro and StJohn, David (2015). A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys. Journal of Crystal Growth, 430, 122-137. doi: 10.1016/j.jcrysgro.2015.06.024 |
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2015 Journal Article Kinetics of the β → α transformation of tin: role of α-tin nucleationZeng, Guang, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2015). Kinetics of the β → α transformation of tin: role of α-tin nucleation. Crystal Growth and Design, 15 (12), 5767-5773. doi: 10.1021/acs.cgd.5b01069 |
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2015 Journal Article Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering ProcessMohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H. and Nogita, K. (2015). Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process. Journal of Electronic Materials, 45 (1), 154-163. doi: 10.1007/s11664-015-4121-x |
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2015 Journal Article The influence of ternary Cu additions on the nucleation of eutectic grains in a hypoeutectic Al-10 wt.%Si alloyDarlapudi, A., McDonald, S. D. and StJohn, D. H. (2015). The influence of ternary Cu additions on the nucleation of eutectic grains in a hypoeutectic Al-10 wt.%Si alloy. Journal of Alloys and Compounds, 646, 699-705. doi: 10.1016/j.jallcom.2015.05.223 |
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2015 Journal Article Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloySalleh, M. A. A. Mohd, McDonald, S. D., Terada, Y., Yasuda, H. and Nogita, K. (2015). Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy. Materials & Design, 82, 136-147. doi: 10.1016/j.matdes.2015.05.077 |
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2015 Journal Article In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg-Ni alloyTran, X. Q., McDonald, S. D., Gu, Q. F. and Nogita, K. (2015). In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg-Ni alloy. Journal of Alloys and Compounds, 636 33418, 249-256. doi: 10.1016/j.jallcom.2015.02.044 |
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2015 Journal Article Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfacesMohd Salleh, M. A. A., McDonald, S. D., Yasuda, H., Sugiyama, A. and Nogita, K. (2015). Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces. Scripta Materialia, 100, 17-20. doi: 10.1016/j.scriptamat.2014.11.039 |
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2015 Journal Article In-situ soldering process technique by synchrotron X-ray imagingMohd Salleh, M. A. A., Sugiyama, A., Yasuda, H., McDonald, S. D. and Nogita, Naz (2015). In-situ soldering process technique by synchrotron X-ray imaging. Applied Mechanics and Materials, 754-755, 508-512. doi: 10.4028/www.scientific.net/AMM.754-755.508 |
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2015 Journal Article Evidence of the hydrogen release mechanism in bulk MgH2Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro and Matsumura, Syo (2015). Evidence of the hydrogen release mechanism in bulk MgH2. Scientific Reports, 5 (8450) 43720, 1-5. doi: 10.1038/srep08450 |
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2015 Journal Article The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder jointsZeng, Guang, McDonald, Stuart D., Gu, Qinfen, Terada, Yasuko, Uesugi, Kentaro, Yasuda, Hideyuki and Nogita, Kazuhiro (2015). The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints. Acta Materialia, 83, 357-371. doi: 10.1016/j.actamat.2014.10.003 |
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2015 Conference Publication Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modellingPrasad, A., Liotti, E., McDonald, S. D., Nogita, K., Yasuda, H., Grant, P. S. and StJohn, D. H. (2015). Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling. 14th International Conference on Modeling of Casting, Welding and Advanced Solidification Processes, Awaji island, Hyogo, Japan, 21-26 June 2015. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/84/1/012014 |
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2015 Conference Publication The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substratesNg, Wayne, Zeng, Guang, Nishimura, Takatoshi, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2015). The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates. 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, Kyoto, Japan, 14-17 April 2015. Japan: IEEE. doi: 10.1109/ICEP-IAAC.2015.7111122 |
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2014 Journal Article Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) jointsZeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen and Nogita, Kazuhiro (2014). Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints. Intermetallics, 54, 20-27. doi: 10.1016/j.intermet.2014.05.004 |
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2014 Journal Article Kinetics of the polymorphic phase transformation of Cu6Sn5Zeng, Guang, McDonald, Stuart David, Read, Jonathan J., Gu, Qinfen and Nogita, Kazuhiro (2014). Kinetics of the polymorphic phase transformation of Cu6Sn5. Acta Materialia, 69, 135-148. doi: 10.1016/j.actamat.2014.01.027 |
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2014 Journal Article Solidification of Sn-0.7Cu-0.15Zn solder: In situ observationZeng, Guang, McDonald, Stuart David, Gourlay, Christopher M., Uesugi, Kentaro, Terada, Yasuko, Yasuda, Hideyuki and Nogita, Kazuhiro (2014). Solidification of Sn-0.7Cu-0.15Zn solder: In situ observation. Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science, 45 (2), 918-926. doi: 10.1007/s11661-013-2008-0 |
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2014 Journal Article Grain refinement for improved lead-free solder joint reliabilitySweatman, K., Nishimura, T., McDonald, S. D., Whitewick, M. and Nogita, K. (2014). Grain refinement for improved lead-free solder joint reliability. SMT Surface Mount Technology Magazine, 29 (1), 30-41. |
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2014 Journal Article Effects of element addition on the beta->alpha transformation in tinZeng, Guang, McDonald, Stuart David, Gu, Qinfen, Sweatman, Keith and Nogita, Kazuhiro (2014). Effects of element addition on the beta->alpha transformation in tin. Philosophical Magazine Letters, 94 (2), 53-62. doi: 10.1080/09500839.2013.860247 |
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2014 Conference Publication Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kineticsZeng, Guang, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2014). Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics. 2014 International Conference on Electronics Packaging (ICEP 2014), Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826677 |
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2013 Journal Article Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and InZeng, Guang, McDonald, Stuart D., Gu, Qinfen, Suenaga, Shoichi, Zhang, Yong, Chen, Jianghua and Nogita, Kazuhiro (2013). Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In. Intermetallics, 43, 85-98. doi: 10.1016/j.intermet.2013.07.012 |
