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2016 Journal Article Critical properties of Cu6Sn5 in electronic devices: Recent progress and a reviewMu, D.K., McDonald, S.D., Read, J., Huang, H. and Nogita, K. (2016). Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review. Current Opinion in Solid State and Materials Science, 20 (2), 55-76. doi: 10.1016/j.cossms.2015.08.001 |
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2016 Conference Publication Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloysNogita, K., Kefford, B., Read, J. and McDonald, S. D. (2016). Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.53 |
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2016 Conference Publication Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applicationsSmith, S., Zeng, G., Read, J., McDonald, S. D. and Nogita, K. (2016). Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.58 |
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2016 Conference Publication The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloysDarlapudi, A., McDonald, S.D. and St John, D.H. (2016). The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloys. 4th International Conference on Advances in Solidification Processes, ICASP 2014, Windsor, United Kingdom, July 8-11, 2014. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/117/1/012022 |
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2016 Journal Article The influence of ternary alloying elements on the Al-Si eutectic microstructure and the Si morphologyDarlapudi, A., McDonald, S. D., Terzi, S., Prasad, A., Felberbaum, M. and StJohn, D. H. (2016). The influence of ternary alloying elements on the Al-Si eutectic microstructure and the Si morphology. Journal of Crystal Growth, 433, 63-73. doi: 10.1016/j.jcrysgro.2015.10.002 |
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2016 Conference Publication Effects of trace phosphorus in Sn-Cu-Ni wave solder drossNogita, K., Mohd Salleh, M. A. A., Tran, X. Q., Read, J., Smith, S. and McDonald, S. D. (2016). Effects of trace phosphorus in Sn-Cu-Ni wave solder dross. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.49 |
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2015 Journal Article A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloysPrasad, Arvind, Macdonald, Stuart D., Yasuda, Hideyuki, Nogita, Kazuhiro and StJohn, David (2015). A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys. Journal of Crystal Growth, 430, 122-137. doi: 10.1016/j.jcrysgro.2015.06.024 |
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2015 Journal Article Kinetics of the β → α transformation of tin: role of α-tin nucleationZeng, Guang, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2015). Kinetics of the β → α transformation of tin: role of α-tin nucleation. Crystal Growth and Design, 15 (12), 5767-5773. doi: 10.1021/acs.cgd.5b01069 |
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2015 Journal Article Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering ProcessMohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H. and Nogita, K. (2015). Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process. Journal of Electronic Materials, 45 (1), 154-163. doi: 10.1007/s11664-015-4121-x |
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2015 Journal Article The influence of ternary Cu additions on the nucleation of eutectic grains in a hypoeutectic Al-10 wt.%Si alloyDarlapudi, A., McDonald, S. D. and StJohn, D. H. (2015). The influence of ternary Cu additions on the nucleation of eutectic grains in a hypoeutectic Al-10 wt.%Si alloy. Journal of Alloys and Compounds, 646, 699-705. doi: 10.1016/j.jallcom.2015.05.223 |
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2015 Journal Article Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloySalleh, M. A. A. Mohd, McDonald, S. D., Terada, Y., Yasuda, H. and Nogita, K. (2015). Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy. Materials & Design, 82, 136-147. doi: 10.1016/j.matdes.2015.05.077 |
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2015 Journal Article In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg-Ni alloyTran, X. Q., McDonald, S. D., Gu, Q. F. and Nogita, K. (2015). In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg-Ni alloy. Journal of Alloys and Compounds, 636 33418, 249-256. doi: 10.1016/j.jallcom.2015.02.044 |
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2015 Journal Article Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfacesMohd Salleh, M. A. A., McDonald, S. D., Yasuda, H., Sugiyama, A. and Nogita, K. (2015). Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces. Scripta Materialia, 100, 17-20. doi: 10.1016/j.scriptamat.2014.11.039 |
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2015 Journal Article In-situ soldering process technique by synchrotron X-ray imagingMohd Salleh, M. A. A., Sugiyama, A., Yasuda, H., McDonald, S. D. and Nogita, Naz (2015). In-situ soldering process technique by synchrotron X-ray imaging. Applied Mechanics and Materials, 754-755, 508-512. doi: 10.4028/www.scientific.net/AMM.754-755.508 |
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2015 Journal Article Evidence of the hydrogen release mechanism in bulk MgH2Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro and Matsumura, Syo (2015). Evidence of the hydrogen release mechanism in bulk MgH2. Scientific Reports, 5 (8450) 43720, 1-5. doi: 10.1038/srep08450 |
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2015 Journal Article The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder jointsZeng, Guang, McDonald, Stuart D., Gu, Qinfen, Terada, Yasuko, Uesugi, Kentaro, Yasuda, Hideyuki and Nogita, Kazuhiro (2015). The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints. Acta Materialia, 83, 357-371. doi: 10.1016/j.actamat.2014.10.003 |
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2015 Conference Publication The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substratesNg, Wayne, Zeng, Guang, Nishimura, Takatoshi, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2015). The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates. 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, Kyoto, Japan, 14-17 April 2015. Japan: IEEE. doi: 10.1109/ICEP-IAAC.2015.7111122 |
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2015 Conference Publication Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modellingPrasad, A., Liotti, E., McDonald, S. D., Nogita, K., Yasuda, H., Grant, P. S. and StJohn, D. H. (2015). Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling. 14th International Conference on Modeling of Casting, Welding and Advanced Solidification Processes, Awaji island, Hyogo, Japan, 21-26 June 2015. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/84/1/012014 |
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2014 Journal Article Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) jointsZeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen and Nogita, Kazuhiro (2014). Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints. Intermetallics, 54, 20-27. doi: 10.1016/j.intermet.2014.05.004 |
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2014 Journal Article Kinetics of the polymorphic phase transformation of Cu6Sn5Zeng, Guang, McDonald, Stuart David, Read, Jonathan J., Gu, Qinfen and Nogita, Kazuhiro (2014). Kinetics of the polymorphic phase transformation of Cu6Sn5. Acta Materialia, 69, 135-148. doi: 10.1016/j.actamat.2014.01.027 |
