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2018 Conference Publication Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bondingSomidin, Flora, McDonald, Stuart and Nogita, Kazuhiro (2018). Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bonding. Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1-2 November 2017. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.14 |
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2017 Journal Article Reply to 'Comments on "evidence of the hydrogen release mechanism in bulk MgH2"'Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro and Matsumura, Syo (2017). Reply to 'Comments on "evidence of the hydrogen release mechanism in bulk MgH2"'. Scientific Reports, 7 (1) 43720, 1-3. doi: 10.1038/srep43720 |
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2017 Journal Article Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substratesMohd Salleh, M. A. A., McDonald, S. D. and Nogita, K. (2017). Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates. Journal of Materials Processing Technology, 242, 235-245. doi: 10.1016/j.jmatprotec.2016.11.031 |
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2017 Journal Article In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Yamamoto, Tomokazu, Shigematsu, Koji, Aso, Kohei, Tanaka, Eishi, Matsumura, Syo and Nogita, Kazuhiro (2017). In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4. Journal of Power Sources, 341, 130-138. doi: 10.1016/j.jpowsour.2016.11.105 |
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2017 Journal Article In situ imaging of microstructure formation in electronic interconnectionsSalleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D. and Nogita, K. (2017). In situ imaging of microstructure formation in electronic interconnections. Scientific Reports, 7 (1) 40010, 40010. doi: 10.1038/srep40010 |
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2017 Conference Publication Effects of Bi in Sn-Cu based lead-free solder alloys and interconnectsNogita, K., Salleh, M. A. A. Mohd, Smith, S., Wu, Y. Q., McDonald, S. D., Ab Razak, A. G., Akaiwa, T. and Nishimura, T. (2017). Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects. 2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Japan, 19 - 22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2017.7939399 |
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2017 Conference Publication Real time X-ray imaging of soldering processes at the SPring-8 synchrotronNogita, K., Salleh, M. A. A. Mohd, Zeng, G., McDonald, S. D., Gourlay, C. and Yasuda, H. (2017). Real time X-ray imaging of soldering processes at the SPring-8 synchrotron. International Conference on Electronics Packaging (ICEP), Tendo, Japan, 19-22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers . doi: 10.23919/ICEP.2017.7939343 |
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2017 Conference Publication Real-time observation of AZ91 solidification by synchrotron radiographyZeng, G., Nogita, K., Belyakov, S., Xian, J. W., McDonald, S. D., Yang, K. V., Yasuda, H. and Gourlay, C. M. (2017). Real-time observation of AZ91 solidification by synchrotron radiography. Magnesium Technology 2017, San Diego, CA, United States, 26 February - 2 March 2017. Cham, Switzerland: Springer. doi: 10.1007/978-3-319-52392-7_82 |
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2016 Journal Article The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder jointsZeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen, Salleh, M. A. A. Mohd and Nogita, Kazuhiro (2016). The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints. Journal of Alloys and Compounds, 685, 471-482. doi: 10.1016/j.jallcom.2016.05.263 |
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2016 Journal Article In situ TEM observations of Cu6Sn5 polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substratesNogita, K., Mohd Salleh, M. A. A., Tanaka, E., Zeng, G., McDonald, S. D. and Matsumura, S. (2016). In situ TEM observations of Cu6Sn5 polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substrates. JOM, 68 (11), 2871-2878. doi: 10.1007/s11837-016-2020-0 |
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2016 Journal Article Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloysTran, Xuan Quy, McDonald, Stuart D. , Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016). Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloys. International Journal of Hydrogen Energy, 42 (10), 6851-6861. doi: 10.1016/j.ijhydene.2016.12.007 |
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2016 Journal Article Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cyclesSalleh, M. A. A. Mohd, McDonald, S. D., Gourlay, C. M., Yasuda, H. and Nogita, K. (2016). Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles. Materials and Design, 108, 418-428. doi: 10.1016/j.matdes.2016.06.121 |
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2016 Journal Article Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloysTran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016). Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloys. International Journal of Hydrogen Energy, 42 (1), 366-375. doi: 10.1016/j.ijhydene.2016.08.110 |
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2016 Journal Article Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during solderingMohd Salleh, M. A A, Said, R. M., Saud, N., Yasuda, H., McDonald, S. D. and Nogita, K. (2016). Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering. Key Engineering Materials, 700, 161-169. doi: 10.4028/www.scientific.net/KEM.700.161 |
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2016 Journal Article Effect of trace Na additions on the hydrogen absorption kinetics of Mg2NiTran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2016). Effect of trace Na additions on the hydrogen absorption kinetics of Mg2Ni. Journal of Materials Research, 31 (9), 1316-1327. doi: 10.1557/jmr.2016.123 |
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2016 Journal Article Critical properties of Cu6Sn5 in electronic devices: Recent progress and a reviewMu, D.K., McDonald, S.D., Read, J., Huang, H. and Nogita, K. (2016). Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review. Current Opinion in Solid State and Materials Science, 20 (2), 55-76. doi: 10.1016/j.cossms.2015.08.001 |
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2016 Conference Publication Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloysNogita, K., Kefford, B., Read, J. and McDonald, S. D. (2016). Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.53 |
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2016 Conference Publication Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applicationsSmith, S., Zeng, G., Read, J., McDonald, S. D. and Nogita, K. (2016). Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.58 |
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2016 Conference Publication The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloysDarlapudi, A., McDonald, S.D. and St John, D.H. (2016). The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloys. 4th International Conference on Advances in Solidification Processes, ICASP 2014, Windsor, United Kingdom, July 8-11, 2014. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/117/1/012022 |
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2016 Journal Article The influence of ternary alloying elements on the Al-Si eutectic microstructure and the Si morphologyDarlapudi, A., McDonald, S. D., Terzi, S., Prasad, A., Felberbaum, M. and StJohn, D. H. (2016). The influence of ternary alloying elements on the Al-Si eutectic microstructure and the Si morphology. Journal of Crystal Growth, 433, 63-73. doi: 10.1016/j.jcrysgro.2015.10.002 |
