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2023 Journal Article In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiographyHao, Qichao, Tan, Xin Fu, Liu, Shiqian, McDonald, Stuart D., Yasuda, Hideyuki and Nogita, Kazuhiro (2023). In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography. ACS Applied Electronic Materials, 5 (12), 7004-7014. doi: 10.1021/acsaelm.3c01383 |
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2023 Journal Article The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloysTan, Xin F., Hao, Qichao, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Bermingham, Michael and Nogita, Kazuhiro (2023). The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys. Materials Characterization, 201 112934, 1-11. doi: 10.1016/j.matchar.2023.112934 |
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2023 Journal Article The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloysZhou, Jiye, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2023). The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys. JOM, 75 (8), 3149-3161. doi: 10.1007/s11837-023-05870-y |
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2023 Conference Publication Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy studyTan, Xin F., Zhou, Jiye, McDonald, Stuart D., Ikeda, Masahiko and Nogita, Kazuhiro (2023). Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study. International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129743 |
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2023 Conference Publication Controlling porosity during transient liquid phase bonding for high-temperature soldering processesAbdul Razak, Nurul R., Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffery, Nishimura, Tetsuro and Nogita, Kazuhiro (2023). Controlling porosity during transient liquid phase bonding for high-temperature soldering processes. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129722 |
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2023 Conference Publication The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%BiYe, Xiaozhou, Tao, Lei, McDonald, Stuart D., Tan, Xin Fu, Sweatman, Keith and Nogita, Kazuhiro (2023). The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129707 |
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2023 Journal Article Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bathQu, Dongdong, Gear, Matthew, Gu, Qinfen, Setargew, Nega, Renshaw, Wayne, McDonald, Stuart, StJohn, David and Nogita, Kazuhiro (2023). Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bath. Materials, 16 (3) 1211. doi: 10.3390/ma16031211 |
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2023 Conference Publication Fluidity and microstructural analysis of Al–Ni alloys with varied Ni concentrationsHari, Vigneshwar, Xu, Dong, McDonald, Stuart D., Tong, Zherui, Qu, Dongdong and Nogita, Kazuhiro (2023). Fluidity and microstructural analysis of Al–Ni alloys with varied Ni concentrations. TMS 2023 Annual Meeting & Exhibition, San Diego, CA, United States, 19-23 March 2023. Cham, Switzerland: Springer Nature Switzerland. doi: 10.1007/978-3-031-22532-1_62 |
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2022 Journal Article Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic jointsZhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints. Materials, 15 (23) 8321, 1-12. doi: 10.3390/ma15238321 |
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2022 Journal Article Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storageTan, Xin F., Kim, Manjin, Gu, Qinfen, Pinzon Piraquive, Julio, Zeng, Guang, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage. Journal of Power Sources, 538 231538, 231538. doi: 10.1016/j.jpowsour.2022.231538 |
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2022 Journal Article Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder jointAbdul Razak, N. R., Tan, X. F., Mohd Salleh, M. A. A., McDonald, S. D., Bermingham, M. J., Yasuda, H. and Nogita, K. (2022). Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint. Materials Today Communications, 31 103248, 103248. doi: 10.1016/j.mtcomm.2022.103248 |
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2022 Journal Article Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption processKim, Manjin, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D., Ali, Yahia, Matsumura, Syo and Nogita, Kazuhiro (2022). Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process. International Journal of Hydrogen Energy, 47 (36), 16132-16143. doi: 10.1016/j.ijhydene.2022.03.102 |
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2022 Journal Article Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature solderingTan, Xin F., Gu, Qinfen, Bermingham, Michael, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering. Acta Materialia, 226 117661. doi: 10.1016/j.actamat.2022.117661 |
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2022 Conference Publication Effect of Microstructural Refinement and Na Addition on Hydrogenation Kinetics of Cast Mg–Al–La Alloy During the First Hydrogen Absorption ProcessKim, Manjin, McDonald, Stuart D., Ali, Yahia, Abbott, Trevor B. and Nogita, Kazuhiro (2022). Effect of Microstructural Refinement and Na Addition on Hydrogenation Kinetics of Cast Mg–Al–La Alloy During the First Hydrogen Absorption Process. 23rd Magnesium Technology Symposium at the 151st TMS Annual Meeting and Exhibition, Anaheim, CA, United States, 27 February - 3 March 2022. Cham, Switzlerland: Springer International Publishing. doi: 10.1007/978-3-030-92533-8_12 |
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2022 Journal Article The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloysHao, Qichao, Tan, Xin F., Gu, Qinfen, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2022). The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys. JOM, 74 (4), 1739-1750. doi: 10.1007/s11837-021-05145-4 |
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2022 Journal Article In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopyTan, Xin F., Somidin, Flora, McDonald, Stuart D., Bermingham, Michael J., Maeno, Hiroshi, Matsumura, Syo and Nogita, Kazuhiro (2022). In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy. Materials, 15 (2) 510, 510. doi: 10.3390/ma15020510 |
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2022 Journal Article Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a reviewZeng, Guang, Liu, Shiqian, Gu, Qinfen, Zheng, Zebang, Yasuda, Hideyuki, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a review. Acta Metallurgica Sinica, 35 (1), 49-66. doi: 10.1007/s40195-021-01350-x |
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2022 Conference Publication Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solderHao, Qichao, Tan, Xin Fu, McDonald, Stuart D., Sweatman, Keith, Nishimura, Takatoshi, Nishimura, Tetsuro and Nogita, Kazuhiro (2022). Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795406 |
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2022 Conference Publication Maximum fluidity length of commercial solder alloys and the effects of Ni and Co in Sn-0.7wt%Cu solder alloysNogita, Kazuhiro, Read, Jonathan, McDonald, Stuart D., Xu, Dong and Nishimura, Tetsuro (2022). Maximum fluidity length of commercial solder alloys and the effects of Ni and Co in Sn-0.7wt%Cu solder alloys. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795610 |
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2022 Conference Publication Investigation of the effects of surface finish and reflow conditions on the microstructure and mechanical properties of Sn-based soldersSomidin, Flora, Akaiwa, Tetsuya, McDonald, Stuart D., Nishimura, Tetsuro, Ye, Xiaozhou, Smith, Anthony, Zhou, Jiye and Nogita, Kazuhiro (2022). Investigation of the effects of surface finish and reflow conditions on the microstructure and mechanical properties of Sn-based solders. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795417 |
