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2010 Conference Publication Trace element distribution in solder joints between Sn-based solders and Cu substratesNogita, K., Yasuda, H., Gourlay, C. M., Suenaga, S., Tsukamoto, H., McDonald, S. D., Takeuchi, A., Uesugi, K. and Suzuki, Y. (2010). Trace element distribution in solder joints between Sn-based solders and Cu substrates. International Conference on Electronics Packaging ICEP2010, Sapporo, Hokkaido, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP). |
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2010 Conference Publication Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFSNogita, Kazuhiro, Jenke, Marc, Wood, David, Duguid, Andrew and McDonald, Stuart D. (2010). Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS. 7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2 - 6 August 2010. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2851 |
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2009 Journal Article Latest developments in understanding grain refinement of cast titaniumBermingham, Michael, McDonald, Stuart, Dargusch, Matthew and St John, David (2009). Latest developments in understanding grain refinement of cast titanium. Light Metals Age, 67 (4), 47-49. |
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2009 Journal Article Effects of coolant pressure on chip formation while turning Ti6Al4V alloyPalanisamy, Suresh, McDonald, Stuart D. and Dargusch, Matthew S. (2009). Effects of coolant pressure on chip formation while turning Ti6Al4V alloy. International Journal of Machine Tools and Manufacture, 49 (9), 739-743. doi: 10.1016/j.ijmachtools.2009.02.010 |
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2009 Journal Article Beryllium as a grain refiner in titanium alloysBermingham, M. J., McDonald, S. D., StJohn D. H. and Dargusch, M. S. (2009). Beryllium as a grain refiner in titanium alloys. Journal of Alloys and Compounds, 481 (1-2), L20-L23. doi: 10.1016/j.jallcom.2009.03.016 |
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2009 Journal Article Segregation and grain refinement in cast titanium alloysBermingham, M. J., McDonald, S. D., StJohn, D. H. and Dargusch, M. S. (2009). Segregation and grain refinement in cast titanium alloys. Journal of Materials Research, 24 (4), 1529-1535. doi: 10.1557/JMR.2009.0173 |
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2009 Conference Publication Latest developments in understanding the grain refinement of cast titaniumBermingham, Michael, McDonald, Stuart D., St John, David H. and Dargusch, Matthew S. (2009). Latest developments in understanding the grain refinement of cast titanium. 4th International Light Metals Technology Conference (LMT 2009), Gold Coast, Australia, 29 June - 1 July 2009. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.618-619.315 |
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2009 Journal Article Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free soldersNogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009). Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 (1), 46-54. |
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2009 Conference Publication The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substratesNogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. TMS 2009, San Francisco, California, USA, 15-19 February 2009. |
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2009 Conference Publication Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substratesHideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, 1-16 April 2009. Japan: Japan Institute of Electronics Packaging. |
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2009 Conference Publication The Effect of Ni on Phase Stability in Cu6Sn5Nogita, K., Read, J., Tsukamoto, H., McDonald, S. D., Gourlay, C. M. and Nishimura, T. (2009). The Effect of Ni on Phase Stability in Cu6Sn5. Japan Institute of Metals Autumn Meeting 2009, Kyoto, Japan, 15-17 September 2009. |
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2009 Conference Publication The influence of solder composition on the impact strength of lead-free solder BGA jointsTsukamoto, Hideaki, Nogita, Kazuhiro, McDonald, Stuart, Nishimura, Tetsuro, Suenaga, Shoichi and Sweatman, Keith W. (2009). The influence of solder composition on the impact strength of lead-free solder BGA joints. 2009 TMS Annual Meeting & Exhibition, San Francisco, CA, USA, 15 - 19 February 2009. TMS. |
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2009 Conference Publication Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfacesNogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, 14-16 April, 2009. Kyoto, Japan: Japan Institute of Electronics Packaging. |
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2009 Conference Publication Ball impact behavior of Sn-Cu (-Ni) lead-free solder jointsTsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, 1-3 July 2009. |
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2008 Journal Article Effects of boron on microstructure in cast titanium alloysBermingham, M., McDonald, S.D., Nogita, K., St John, D.H. and Dargusch, M.S. (2008). Effects of boron on microstructure in cast titanium alloys. Scripta Materialia, 59 (5), 538-541. doi: 10.1016/j.scriptamat.2008.05.002 |
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2008 Journal Article The mechanism of grain refinement of titanium by siliconBermingham, M., McDonald, S.D., Dargusch, M.S. and St John, D.H. (2008). The mechanism of grain refinement of titanium by silicon. Scripta Materialia, 58 (12), 1050-1053. doi: 10.1016/j.scriptamat.2008.01.041 |
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2008 Journal Article Modeling of grain refinement: Part I. Effect of the solute titanium for aluminumYao, X., McDonald, S. D., Dahle, A. K., Davidson, C. J. and St John, D. H. (2008). Modeling of grain refinement: Part I. Effect of the solute titanium for aluminum. Journal of Materials Research, 23 (5), 1282-1291. doi: 10.1557/JMR.2008.0153 |
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2008 Journal Article Modeling of grain refinement: Part II. Effect of nucleant particles-TiB2 additions for aluminumYao, X., McDonald, S.D., Dahle, A.K., Davidson, C.J. and St John, D.H. (2008). Modeling of grain refinement: Part II. Effect of nucleant particles-TiB2 additions for aluminum. Journal of Materials Research, 23 (5), 1292-1300. doi: 10.1557/JMR.2008.0154 |
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2008 Journal Article Modeling of grain refinement: Part III. Al-7Si-0.3Mg aluminum alloyYao, X., McDonald, S. D., Dahle, A. K., Davidson, C. J. and St John, D. H. (2008). Modeling of grain refinement: Part III. Al-7Si-0.3Mg aluminum alloy. Journal of Materials Research, 23 (5), 1301-1306. doi: 10.1557/JMR.2008.0155 |
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2008 Journal Article Grain-refinement mechanisms in titanium alloysBermingham, M., McDonald, S.D., Dargusch, M.S. and St John, D.H. (2008). Grain-refinement mechanisms in titanium alloys. Journal of Materials Research, 23 (1), 97-104. doi: 10.1557/JMR.2008.0002 |
