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2009 Conference Publication The influence of solder composition on the impact strength of lead-free solder BGA jointsTsukamoto, Hideaki, Nogita, Kazuhiro, McDonald, Stuart, Nishimura, Tetsuro, Suenaga, Shoichi and Sweatman, Keith W. (2009). The influence of solder composition on the impact strength of lead-free solder BGA joints. 2009 TMS Annual Meeting & Exhibition, San Francisco, CA, USA, 15 - 19 February 2009. TMS. |
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2009 Conference Publication Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfacesNogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, 14-16 April, 2009. Kyoto, Japan: Japan Institute of Electronics Packaging. |
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2009 Conference Publication Ball impact behavior of Sn-Cu (-Ni) lead-free solder jointsTsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, 1-3 July 2009. |
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2009 Conference Publication Latest developments in understanding the grain refinement of cast titaniumBermingham, Michael, McDonald, Stuart D., St John, David H. and Dargusch, Matthew S. (2009). Latest developments in understanding the grain refinement of cast titanium. 4th International Light Metals Technology Conference (LMT 2009), Gold Coast, Australia, 29 June - 1 July 2009. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.618-619.315 |
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2009 Journal Article Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free soldersNogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009). Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 (1), 46-54. |
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2009 Conference Publication The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substratesNogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. TMS 2009, San Francisco, California, USA, 15-19 February 2009. |
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2009 Conference Publication Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substratesHideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, 1-16 April 2009. Japan: Japan Institute of Electronics Packaging. |
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2008 Journal Article Effects of boron on microstructure in cast titanium alloysBermingham, M., McDonald, S.D., Nogita, K., St John, D.H. and Dargusch, M.S. (2008). Effects of boron on microstructure in cast titanium alloys. Scripta Materialia, 59 (5), 538-541. doi: 10.1016/j.scriptamat.2008.05.002 |
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2008 Journal Article The mechanism of grain refinement of titanium by siliconBermingham, M., McDonald, S.D., Dargusch, M.S. and St John, D.H. (2008). The mechanism of grain refinement of titanium by silicon. Scripta Materialia, 58 (12), 1050-1053. doi: 10.1016/j.scriptamat.2008.01.041 |
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2008 Journal Article Modeling of grain refinement: Part III. Al-7Si-0.3Mg aluminum alloyYao, X., McDonald, S. D., Dahle, A. K., Davidson, C. J. and St John, D. H. (2008). Modeling of grain refinement: Part III. Al-7Si-0.3Mg aluminum alloy. Journal of Materials Research, 23 (5), 1301-1306. doi: 10.1557/JMR.2008.0155 |
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2008 Journal Article Modeling of grain refinement: Part I. Effect of the solute titanium for aluminumYao, X., McDonald, S. D., Dahle, A. K., Davidson, C. J. and St John, D. H. (2008). Modeling of grain refinement: Part I. Effect of the solute titanium for aluminum. Journal of Materials Research, 23 (5), 1282-1291. doi: 10.1557/JMR.2008.0153 |
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2008 Journal Article Modeling of grain refinement: Part II. Effect of nucleant particles-TiB2 additions for aluminumYao, X., McDonald, S.D., Dahle, A.K., Davidson, C.J. and St John, D.H. (2008). Modeling of grain refinement: Part II. Effect of nucleant particles-TiB2 additions for aluminum. Journal of Materials Research, 23 (5), 1292-1300. doi: 10.1557/JMR.2008.0154 |
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2008 Journal Article Grain-refinement mechanisms in titanium alloysBermingham, M., McDonald, S.D., Dargusch, M.S. and St John, D.H. (2008). Grain-refinement mechanisms in titanium alloys. Journal of Materials Research, 23 (1), 97-104. doi: 10.1557/JMR.2008.0002 |
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2008 Conference Publication Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloysNogita, K., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. and Tsukamoto, H. (2008). Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys. Japanese Institute of Metals Annual Autumn Meeting 2008, Kumamoto, Japan, 23-25 September 2008. |
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2007 Conference Publication Unintentional effects of Sr additions in Al-Si foundry alloysMcDonald, Stuart, Dargusch, Matthew, Song, Guangling and StJohn, David (2007). Unintentional effects of Sr additions in Al-Si foundry alloys. |
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2007 Journal Article A rationale for the acoustic monitoring of surface deformation in Ti6Al4V alloys during machiningPalanisamy, S., Dargusch, M. S., McDonald, S., St John, D. H. and Brandt, M. (2007). A rationale for the acoustic monitoring of surface deformation in Ti6Al4V alloys during machining. Advanced Engineering Materials, 9 (11), 1000-1004. doi: 10.1002/adem.200700117 |
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2007 Conference Publication New approaches to understand modification and nucleation mechanisms of hypoeutectic Al-Si AlloysNogita, K., McDonald, S.D. and Dahle, A.K. (2007). New approaches to understand modification and nucleation mechanisms of hypoeutectic Al-Si Alloys. TMS Annual Meeting, Orlando, Florida, USA, February 25 - March 1 2007. United Stated: The Minerals, Metals and Materials Society. |
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2007 Conference Publication Machining of titanium alloys with and without coolantPalanisamy, S., Dargusch, M. S., McDonald, S. D., Dowey, S. J. and Doyle, E. D. (2007). Machining of titanium alloys with and without coolant. 16th International Federation for Heat Treatment and Surface Engineering Congress, , , October 30, 2007-November 2, 2007. International Federation for Heat Treatment and Surface Engineering, IFHTSE. |
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2007 Conference Publication Vibration and surface deformation during machining of Ti6Al4V alloysPalanisamy, S., McDonald, S.D., Dargusch, M.S. and St John, D.H. (2007). Vibration and surface deformation during machining of Ti6Al4V alloys. Light Metals Technology Conference 2007, Canada, 24-26 September, 2007. Canada: Public Works and Government Services Canada. |
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2007 Conference Publication Engineering eutectic solidification in Al-Si AlloysDahle, A.K., Nogita, K. and McDonald, S.D. (2007). Engineering eutectic solidification in Al-Si Alloys. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. Sheffield, United Kingdom: University of Sheffield. |
