Low Temperature Solders for Energy-Efficient Electronics Manufacturing (2025-2027)
Abstract
Electronics manufacturing consumes substantial energy, heating assemblies above the melting point of solder alloys to form mechanical and electrical connections. The project aims to develop low-melting-point solders based on the tin-bismuth (Sn-Bi) system, the only affordable alloys with suitable melting temperatures. The project expects to overcome limitations related to the atypical electrical and mechanical properties of these alloys through innovative analytical methods. The expected outcomes include reduced process temperatures in electronics manufacturing. This provides significant benefits such as lower energy consumption and the ability to manufacture advanced circuitry incorporating temperature-sensitive components and substrates.
