
Overview
Background
Dr. Xin Fu Tan is an ARC Early Career Industry Fellow. Their research interests encompass the areas of electronics manufacturing, hydrogen storage materials, synchrotron radiation techniques, and electron microscopy. Dr. Tan is currently employed as a Postdoctoral Research Fellow at The University of Queensland, working on an ARC Discovery Project titled "Intermetallic compounds for high-reliability electronic interconnections" (2020-2024). Additionally, Dr. Tan holds the position of a Japan Society for the Promotion of Science (JSPS) International Research Fellow at Kyushu University, contributing to the project "Improving Metal Hydrides to Diversify Energy Storage and Transportation" (2022-2024), as nominated by the Australian Academy of Science (AAS).
Dr. Tan completed their PhD thesis at The University of Queensland, focusing on the development of novel anode materials for lithium-ion batteries, from 2017 to 2020. Between 2010 and 2016, Dr. Tan worked as a Material Scientist at Hydrexia Pty. Ltd., a start-up company specialising in commercialising solid-state hydrogen storage systems based on lab-developed technology from The University of Queensland. They earned a Bachelor's degree (1st class honours) in Mechanical and Manufacturing Engineering at The University of Melbourne and a Master's degree in Advanced Engineering Materials at Chalmers University of Technology in Sweden. These experiences have endowed Dr. Tan with unique research expertise across various Materials Engineering fields, encompassing both academic and industrial settings.
Availability
- Dr Xin Fu Tan is:
- Available for supervision
Fields of research
Qualifications
- Bachelor (Honours) of Engineering, University of Melbourne
- Masters (Coursework) of Manufacturing and Materials Engineering, Chalmers University of Technology
- Diploma of Project Management, The Moreland Group Pty Ltd
- Doctor of Philosophy, The University of Queensland
Works
Search Professor Xin Fu Tan’s works on UQ eSpace
2025
Journal Article
The effect of gallium addition on the microstructure and superconducting properties of In-Bi-Sn solder alloys
Zhou, Jiye, Shahbazi, Mahboobeh, Poitras, Jordan T., Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2025). The effect of gallium addition on the microstructure and superconducting properties of In-Bi-Sn solder alloys. Journal of Electronic Materials, 54 (4), 2628-2637. doi: 10.1007/s11664-024-11584-x
2025
Journal Article
Effect of Sr addition on the microstructure and fluidity of hypoeutectic Al-Ni alloy
Hari, Vigneshwar, McDonald, Stuart, Qu, Dongdong, Tan, Xin Fu, Xu, Dong, Tong, Zherui and Nogita, Kazuhiro (2025). Effect of Sr addition on the microstructure and fluidity of hypoeutectic Al-Ni alloy. Journal of Alloys and Compounds, 1016 178842, 178842-1016. doi: 10.1016/j.jallcom.2025.178842
2025
Conference Publication
In-situ gas atmosphere transmission electron microscopy observation of hydrogen De/absorption in metal hydrides
Tan, Xin Fu, Kawami, Youichirou, Hamano, Yuma, Yamamoto, Tomokazu, Nogita, Kazuhiro and Yasuda, Kazuhiro (2025). In-situ gas atmosphere transmission electron microscopy observation of hydrogen De/absorption in metal hydrides. 13th Asia Pacific Microscopy Congress, Brisbane, QLD, Australia, 2-7 February 2025. ScienceOpen. doi: 10.14293/apmc13-2025-0105
2025
Journal Article
Thermal Stability of Bi in Sn-Cu and Sn-Ag-Cu Based High Strength Pb-free Solder Alloys
Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2025). Thermal Stability of Bi in Sn-Cu and Sn-Ag-Cu Based High Strength Pb-free Solder Alloys. Transactions of The Japan Institute of Electronics Packaging, 18, E24-006. doi: 10.5104/jiepeng.18.e24-006-1
2024
Other Outputs
Tensile properties of hypo-eutectic Sn37Bi and eutectic Sn57Bi
Ye, Xiaozhou, Nogita, Kazuhiro, Tan, Xin Fu and McDonald, Stuart (2024). Tensile properties of hypo-eutectic Sn37Bi and eutectic Sn57Bi. The University of Queensland. (Dataset) doi: 10.48610/20ec053
2024
Journal Article
The effect of in concentration and temperature on dissolution and precipitation in Sn–Bi alloys
Hao, Qichao, Tan, Xinfu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2024). The effect of in concentration and temperature on dissolution and precipitation in Sn–Bi alloys. Materials, 17 (17) 4372, 1-17. doi: 10.3390/ma17174372
2024
Journal Article
Phase transformations and mechanical properties in In–Bi–Sn alloys as a result of low-temperature storage
Zhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2024). Phase transformations and mechanical properties in In–Bi–Sn alloys as a result of low-temperature storage. Materials, 17 (15) 3669. doi: 10.3390/ma17153669
2024
Conference Publication
Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys
Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535619
2024
Conference Publication
Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys
Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535431
2024
Conference Publication
In-situ observations of CU<sub>6</sub>Sn<sub>5</sub> mophological changes at the liquid SAC305/ solid OSP-Cu interface
Nogita, Kazuhiro, Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Maeno, Hiroshi and Matsumura, Syo (2024). In-situ observations of CU6Sn5 mophological changes at the liquid SAC305/ solid OSP-Cu interface. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535651
2024
Journal Article
In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys
Tan, Xin F., Hao, Qichao, Zhou, Jiye, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Ikeda, Masahiko, Yasuda, Kazuhiro, Bermingham, Michael J. and Nogita, Kazuhiro (2024). In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys. Materialia, 33 101974, 1-12. doi: 10.1016/j.mtla.2023.101974
2024
Journal Article
Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys
Hao, Qichao, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1223-1238. doi: 10.1007/s11664-023-10850-8
2024
Journal Article
Controlling pore position during transient liquid phase bonding for high-temperature soldering processes
Razak, N. R. Abdul, Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffrey, Nishimura, Tetsuro and Nogita, Kazuhiro (2024). Controlling pore position during transient liquid phase bonding for high-temperature soldering processes. Transactions of The Japan Institute of Electronics Packaging, 17 E23-009. doi: 10.5104/jiepeng.17.e23-009-1
2024
Journal Article
The effect of temperature on the electrical resistivity of Sn-Bi alloys
Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). The effect of temperature on the electrical resistivity of Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1183-1191. doi: 10.1007/s11664-023-10849-1
2023
Journal Article
In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography
Hao, Qichao, Tan, Xin Fu, Liu, Shiqian, McDonald, Stuart D., Yasuda, Hideyuki and Nogita, Kazuhiro (2023). In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography. ACS Applied Electronic Materials, 5 (12), 7004-7014. doi: 10.1021/acsaelm.3c01383
2023
Journal Article
Strategies to enhance hydrogen storage performances in bulk Mg-based hydrides
Tan, Xin F., Kim, Manjin, Yasuda, Kazuhiro and Nogita, Kazuhiro (2023). Strategies to enhance hydrogen storage performances in bulk Mg-based hydrides. Journal of Materials Science and Technology, 153, 139-158. doi: 10.1016/j.jmst.2022.12.054
2023
Journal Article
Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloys
Yao, Hu, Zeng, Guang, Tan, Xin F., Gu, Qinfen, Nogita, Kazuhiro, Guo, Jing and Li, Qian (2023). Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloys. Journal of Materials Science and Technology, 151, 162-177. doi: 10.1016/j.jmst.2022.12.015
2023
Journal Article
The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys
Tan, Xin F., Hao, Qichao, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Bermingham, Michael and Nogita, Kazuhiro (2023). The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys. Materials Characterization, 201 112934, 1-11. doi: 10.1016/j.matchar.2023.112934
2023
Journal Article
The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys
Zhou, Jiye, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2023). The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys. JOM, 75 (8), 3149-3161. doi: 10.1007/s11837-023-05870-y
2023
Conference Publication
Controlling porosity during transient liquid phase bonding for high-temperature soldering processes
Abdul Razak, Nurul R., Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffery, Nishimura, Tetsuro and Nogita, Kazuhiro (2023). Controlling porosity during transient liquid phase bonding for high-temperature soldering processes. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129722
Funding
Current funding
Past funding
Supervision
Availability
- Dr Xin Fu Tan is:
- Available for supervision
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Available projects
-
Low Temperature Solders for Energy-Efficient Electronics Manufacturing
Project summary: Develop low-melting-point solders based on the tin-bismuth (Sn-Bi) system, to reduced process temperatures in electronics manufacturing.
Supervision history
Current supervision
-
Doctor Philosophy
Development of Sn-Bi based low temperature lead-free solder alloys
Associate Advisor
Other advisors: Dr Stuart McDonald, Professor Kazuhiro Nogita
-
Doctor Philosophy
Al-Ni alloys for use as a novel brazing material for joining Al with dissimilar metals
Associate Advisor
Other advisors: Dr Stuart McDonald, Professor Kazuhiro Nogita
-
Doctor Philosophy
Development of Sn-Bi based low temperature lead-free solder alloys
Associate Advisor
Other advisors: Dr Stuart McDonald, Professor Kazuhiro Nogita
-
Doctor Philosophy
Understanding and controlling oxidation of Ga and Ga-based alloys to facilitate electronic assemblies
Associate Advisor
Other advisors: Dr Stuart McDonald, Professor Kazuhiro Nogita
-
Doctor Philosophy
Large scale solid-state hydrogen storage for transportation and grid integration
Associate Advisor
Other advisors: Dr Zhiliang Wang, Professor Kazuhiro Nogita
-
Doctor Philosophy
Mechanical properties of Sn-Bi alloys and mechanisms of ductility improvement
Associate Advisor
Other advisors: Dr Stuart McDonald, Professor Kazuhiro Nogita
-
Doctor Philosophy
Structure Development and Stability in Sn-Bi Based Solder Alloys
Associate Advisor
Other advisors: Dr Stuart McDonald, Professor Kazuhiro Nogita
Completed supervision
-
2023
Doctor Philosophy
Functional Concentration Gradients in Copper-Nickel Substrates for Transient Liquid Phase Soldering
Associate Advisor
Other advisors: Dr Stuart McDonald, Professor Kazuhiro Nogita
Media
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