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Dr Xin Fu Tan
Dr

Xin Fu Tan

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Overview

Background

Dr. Xin Fu Tan is an ARC Early Career Industry Fellow. Their research interests encompass the areas of electronics manufacturing, hydrogen storage materials, synchrotron radiation techniques, and electron microscopy. Dr. Tan is currently employed as a Postdoctoral Research Fellow at The University of Queensland, working on an ARC Discovery Project titled "Intermetallic compounds for high-reliability electronic interconnections" (2020-2024). Additionally, Dr. Tan holds the position of a Japan Society for the Promotion of Science (JSPS) International Research Fellow at Kyushu University, contributing to the project "Improving Metal Hydrides to Diversify Energy Storage and Transportation" (2022-2024), as nominated by the Australian Academy of Science (AAS).

Dr. Tan completed their PhD thesis at The University of Queensland, focusing on the development of novel anode materials for lithium-ion batteries, from 2017 to 2020. Between 2010 and 2016, Dr. Tan worked as a Material Scientist at Hydrexia Pty. Ltd., a start-up company specialising in commercialising solid-state hydrogen storage systems based on lab-developed technology from The University of Queensland. They earned a Bachelor's degree (1st class honours) in Mechanical and Manufacturing Engineering at The University of Melbourne and a Master's degree in Advanced Engineering Materials at Chalmers University of Technology in Sweden. These experiences have endowed Dr. Tan with unique research expertise across various Materials Engineering fields, encompassing both academic and industrial settings.

Availability

Dr Xin Fu Tan is:
Available for supervision

Qualifications

  • Bachelor (Honours) of Engineering, University of Melbourne
  • Masters (Coursework) of Manufacturing and Materials Engineering, Chalmers University of Technology
  • Diploma of Project Management, unknown
  • Doctor of Philosophy, The University of Queensland

Works

Search Professor Xin Fu Tan’s works on UQ eSpace

46 works between 2013 and 2024

1 - 20 of 46 works

2024

Journal Article

The Effect of In Concentration and Temperature on Dissolution and Precipitation in Sn–Bi Alloys

Hao, Qichao, Tan, Xinfu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2024). The Effect of In Concentration and Temperature on Dissolution and Precipitation in Sn–Bi Alloys. Materials, 17 (17) 4372, 4372. doi: 10.3390/ma17174372

The Effect of In Concentration and Temperature on Dissolution and Precipitation in Sn–Bi Alloys

2024

Journal Article

Phase Transformations and Mechanical Properties in In–Bi–Sn Alloys as a Result of Low-Temperature Storage

Zhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2024). Phase Transformations and Mechanical Properties in In–Bi–Sn Alloys as a Result of Low-Temperature Storage. Materials, 17 (15) 3669, 3669. doi: 10.3390/ma17153669

Phase Transformations and Mechanical Properties in In–Bi–Sn Alloys as a Result of Low-Temperature Storage

2024

Conference Publication

In-situ observations of CU<sub>6</sub>Sn<sub>5</sub> mophological changes at the liquid SAC305/ solid OSP-Cu interface

Nogita, Kazuhiro, Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Maeno, Hiroshi and Matsumura, Syo (2024). In-situ observations of CU6Sn5 mophological changes at the liquid SAC305/ solid OSP-Cu interface. IEEE. doi: 10.23919/icep61562.2024.10535651

In-situ observations of CU<sub>6</sub>Sn<sub>5</sub> mophological changes at the liquid SAC305/ solid OSP-Cu interface

2024

Conference Publication

Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys

Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys. IEEE. doi: 10.23919/icep61562.2024.10535619

Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys

2024

Conference Publication

Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys

Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys. IEEE. doi: 10.23919/icep61562.2024.10535431

Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys

2024

Journal Article

Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys

Hao, Qichao, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1223-1238. doi: 10.1007/s11664-023-10850-8

Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys

2024

Journal Article

In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys

Tan, Xin F., Hao, Qichao, Zhou, Jiye, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Ikeda, Masahiko, Yasuda, Kazuhiro, Bermingham, Michael J. and Nogita, Kazuhiro (2024). In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys. Materialia, 33 101974, 1-12. doi: 10.1016/j.mtla.2023.101974

In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys

2024

Journal Article

The effect of temperature on the electrical resistivity of Sn-Bi alloys

Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). The effect of temperature on the electrical resistivity of Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1183-1191. doi: 10.1007/s11664-023-10849-1

The effect of temperature on the electrical resistivity of Sn-Bi alloys

2024

Journal Article

Controlling Pore Position during Transient Liquid Phase Bonding for High-temperature Soldering Processes

Razak, N. R. Abdul, Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffrey, Nishimura, Tetsuro and Nogita, Kazuhiro (2024). Controlling Pore Position during Transient Liquid Phase Bonding for High-temperature Soldering Processes. Transactions of The Japan Institute of Electronics Packaging, 17, E23-009. doi: 10.5104/jiepeng.17.e23-009-1

Controlling Pore Position during Transient Liquid Phase Bonding for High-temperature Soldering Processes

2023

Journal Article

In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography

Hao, Qichao, Tan, Xin Fu, Liu, Shiqian, McDonald, Stuart D., Yasuda, Hideyuki and Nogita, Kazuhiro (2023). In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography. ACS Applied Electronic Materials, 5 (12), 7004-7014. doi: 10.1021/acsaelm.3c01383

In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography

2023

Journal Article

Strategies to enhance hydrogen storage performances in bulk Mg-based hydrides

Tan, Xin F., Kim, Manjin, Yasuda, Kazuhiro and Nogita, Kazuhiro (2023). Strategies to enhance hydrogen storage performances in bulk Mg-based hydrides. Journal of Materials Science and Technology, 153, 139-158. doi: 10.1016/j.jmst.2022.12.054

Strategies to enhance hydrogen storage performances in bulk Mg-based hydrides

2023

Journal Article

Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloys

Yao, Hu, Zeng, Guang, Tan, Xin F., Gu, Qinfen, Nogita, Kazuhiro, Guo, Jing and Li, Qian (2023). Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloys. Journal of Materials Science and Technology, 151, 162-177. doi: 10.1016/j.jmst.2022.12.015

Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloys

2023

Journal Article

The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys

Tan, Xin F., Hao, Qichao, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Bermingham, Michael and Nogita, Kazuhiro (2023). The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys. Materials Characterization, 201 112934, 1-11. doi: 10.1016/j.matchar.2023.112934

The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys

2023

Journal Article

The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys

Zhou, Jiye, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2023). The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys. JOM, 75 (8), 3149-3161. doi: 10.1007/s11837-023-05870-y

The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys

2023

Conference Publication

Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study

Tan, Xin F., Zhou, Jiye, McDonald, Stuart D., Ikeda, Masahiko and Nogita, Kazuhiro (2023). Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study. International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129743

Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study

2023

Conference Publication

The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi

Ye, Xiaozhou, Tao, Lei, McDonald, Stuart D., Tan, Xin Fu, Sweatman, Keith and Nogita, Kazuhiro (2023). The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129707

The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi

2023

Conference Publication

Controlling porosity during transient liquid phase bonding for high-temperature soldering processes

Abdul Razak, Nurul R., Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffery, Nishimura, Tetsuro and Nogita, Kazuhiro (2023). Controlling porosity during transient liquid phase bonding for high-temperature soldering processes. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129722

Controlling porosity during transient liquid phase bonding for high-temperature soldering processes

2022

Journal Article

Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints

Zhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints. Materials, 15 (23) 8321, 1-12. doi: 10.3390/ma15238321

Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints

2022

Journal Article

Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage

Tan, Xin F., Kim, Manjin, Gu, Qinfen, Pinzon Piraquive, Julio, Zeng, Guang, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage. Journal of Power Sources, 538 231538, 231538. doi: 10.1016/j.jpowsour.2022.231538

Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage

2022

Journal Article

Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg

Tan, C. Y., Salleh, M.A.A. Mohd, Tan, X. F., Yasuda, H., Saud, N., Ramli, M. I.I. and Nogita, K. (2022). Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg. Materials Today Communications, 31 103221, 103221. doi: 10.1016/j.mtcomm.2022.103221

Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg

Funding

Current funding

  • 2021 - 2024
    Research support for TempSave low temperature solder alloys
    Nihon Superior Co Ltd
    Open grant

Past funding

  • 2024
    Kinetics of gamma and beta transformation in In-Sn solder alloys
    Australian Nuclear Science and Technology Organisation
    Open grant
  • 2024
    Kinetics of gamma and beta transformation in In-Sn solder alloys
    Australian Nuclear Science and Technology Organisation
    Open grant
  • 2023
    Time-temperature dependent properties of In-Sn solder alloys under cryo-condition
    Australian Nuclear Science and Technology Organisation
    Open grant
  • 2022
    Probing the phase transformations in Mg-Gd-Ni-Y-Zn hydrogen storage alloy with intergranular long period stacking ordered (LPSO) phase
    Australian Nuclear Science and Technology Organisation
    Open grant
  • 2021 - 2022
    Time Dependent Properties of Sn-Bi Solder Alloys
    UQ Knowledge Exchange & Translation Fund
    Open grant
  • 2021
    In-situ diffraction study on improved hydrogen storage properties catalyzed by long period stacking ordered (LPSO) structure in Mg-Gd-Ni System
    Australian Nuclear Science and Technology Organisation
    Open grant

Supervision

Availability

Dr Xin Fu Tan is:
Available for supervision

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Supervision history

Current supervision

Completed supervision

Media

Enquiries

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