Dr Stuart McDonald
Dr

Stuart McDonald

Email: 
Phone: 
+61 7 336 57132

Background

Dr McDonald is a graduate of The University of Queensland (UQ) having obtained a Bachelor of Engineering (Manufacturing and Materials) in 1997 and a PhD in Materials Engineering in 2002. He is a currently a Senior Research Fellow in the Nihon Superior Centre for the Manufacture of Electronic Materials (NSCMEM).

His research is in the field of microstructure control through solidification science and in particular on understanding the effect of trace element additions on nucleation and growth phenomena. He has numerous publications and expertise in the areas of:

1. Lead-free Solder Alloys

2. Grain refinement

3. Machining and heat treatment of titanium alloys

4. Mg-based Hydrogen Storage Alloys

5. Casting and Solidification of Al-Si Alloys

6. Eutectic solidification and modification

Availability

Dr Stuart McDonald is:
Available for supervision

Fields of research

Materials engineering

Qualifications

  • Bachelor of Engineering, The University of Queensland
  • Doctor of Philosophy, The University of Queensland

Research interests

  • Eutectic Modification

  • Lead-Free Soldering

  • Grain Refinement

  • Solidification/Casting

Research impacts

Dr McDonald has established the modifying elements, commonly used to alter the eutectic silicon morphology in Al-Si alloys dramatically alter the size and spatial distribution of individual eutectic colonies or ‘eutectic-grains’. It has since become accepted that research into modification mechanisms must consider the growth velocity of the etuectic interface as it relates to the size and number of eutectic grains.

He has been an advocate for the benefits of both eutectic and primary grain refinement, which can benefit many commercial foundry alloys and has contributed to the growing body of theoretical and computational modeling on eutectic and primary grain refinement. Commercially his research has been recognised with the following Patents.

Patents 1. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, G. Zeng, “Low temperature brazing alloys”, Japanese Patent Application No.2013-183232, 04/09/3013.

2. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, C. M. Gourlay, “Process for producing solder joint with improved reliability”, International Patent Application No: WO/2013/002112, 21/6/2012.

3. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, T. Ventura, “Solder alloy”, International Patent Application No: WO 2012/137901-A1, 11/10/2012.

4. A.K. Dahle, L. Lu, K. Nogita and S.D. McDonald, “Aluminium Casting Alloy”, International Patent Application No: WO 2006/058388, 2/12/2005.

Search Professor Stuart McDonald’s works on UQ eSpace

218 works between 1999 and 2025
All (218) Journal Article (142) Conference Publication (74) Other Outputs (2)

1 - 20 of 218 works

2025

Journal Article

The effect of gallium addition on the microstructure and superconducting properties of In-Bi-Sn solder alloys

Zhou, Jiye, Shahbazi, Mahboobeh, Poitras, Jordan T., Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2025). The effect of gallium addition on the microstructure and superconducting properties of In-Bi-Sn solder alloys. Journal of Electronic Materials, 54 (4), 2628-2637. doi: 10.1007/s11664-024-11584-x

The effect of gallium addition on the microstructure and superconducting properties of In-Bi-Sn solder alloys

2025

Journal Article

Effect of Sr addition on the microstructure and fluidity of hypoeutectic Al-Ni alloy

Hari, Vigneshwar, McDonald, Stuart, Qu, Dongdong, Tan, Xin Fu, Xu, Dong, Tong, Zherui and Nogita, Kazuhiro (2025). Effect of Sr addition on the microstructure and fluidity of hypoeutectic Al-Ni alloy. Journal of Alloys and Compounds, 1016 178842, 178842-1016. doi: 10.1016/j.jallcom.2025.178842

Effect of Sr addition on the microstructure and fluidity of hypoeutectic Al-Ni alloy

2025

Conference Publication

Solution Hardening Effect of Bi Additions to the β-In3Sn Phase in In-Sn-Bi Low Temperature Solder Alloys via Alloy Design and Heat Treatment

Zhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2025). Solution Hardening Effect of Bi Additions to the β-In3Sn Phase in In-Sn-Bi Low Temperature Solder Alloys via Alloy Design and Heat Treatment. Springer Science and Business Media Deutschland GmbH. doi: 10.1007/978-981-96-2871-1_10

Solution Hardening Effect of Bi Additions to the β-In3Sn Phase in In-Sn-Bi Low Temperature Solder Alloys via Alloy Design and Heat Treatment

2025

Journal Article

Thermal Stability of Bi in Sn-Cu and Sn-Ag-Cu Based High Strength Pb-free Solder Alloys

Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2025). Thermal Stability of Bi in Sn-Cu and Sn-Ag-Cu Based High Strength Pb-free Solder Alloys. Transactions of The Japan Institute of Electronics Packaging, 18, E24-006. doi: 10.5104/jiepeng.18.e24-006-1

Thermal Stability of Bi in Sn-Cu and Sn-Ag-Cu Based High Strength Pb-free Solder Alloys

2025

Conference Publication

Temperature Dependent Crystallographic Changes in Hypoeutectic Sn-Bi Alloys

Hao, Qichao, Tan, Xin F., McDonald, Stuart D. and Nogita, Kazuhiro (2025). Temperature Dependent Crystallographic Changes in Hypoeutectic Sn-Bi Alloys. Springer Science and Business Media Deutschland GmbH. doi: 10.1007/978-981-96-2871-1_11

Temperature Dependent Crystallographic Changes in Hypoeutectic Sn-Bi Alloys

2024

Other Outputs

Tensile properties of hypo-eutectic Sn37Bi and eutectic Sn57Bi

Ye, Xiaozhou, Nogita, Kazuhiro, Tan, Xin Fu and McDonald, Stuart (2024). Tensile properties of hypo-eutectic Sn37Bi and eutectic Sn57Bi. The University of Queensland. (Dataset) doi: 10.48610/20ec053

Tensile properties of hypo-eutectic Sn37Bi and eutectic Sn57Bi

2024

Journal Article

The effect of in concentration and temperature on dissolution and precipitation in Sn–Bi alloys

Hao, Qichao, Tan, Xinfu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2024). The effect of in concentration and temperature on dissolution and precipitation in Sn–Bi alloys. Materials, 17 (17) 4372, 1-17. doi: 10.3390/ma17174372

The effect of in concentration and temperature on dissolution and precipitation in Sn–Bi alloys

2024

Journal Article

Phase transformations and mechanical properties in In–Bi–Sn alloys as a result of low-temperature storage

Zhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2024). Phase transformations and mechanical properties in In–Bi–Sn alloys as a result of low-temperature storage. Materials, 17 (15) 3669. doi: 10.3390/ma17153669

Phase transformations and mechanical properties in In–Bi–Sn alloys as a result of low-temperature storage

2024

Conference Publication

Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys

Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535431

Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys

2024

Conference Publication

In-situ observations of CU<sub>6</sub>Sn<sub>5</sub> mophological changes at the liquid SAC305/ solid OSP-Cu interface

Nogita, Kazuhiro, Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Maeno, Hiroshi and Matsumura, Syo (2024). In-situ observations of CU6Sn5 mophological changes at the liquid SAC305/ solid OSP-Cu interface. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535651

In-situ observations of CU<sub>6</sub>Sn<sub>5</sub> mophological changes at the liquid SAC305/ solid OSP-Cu interface

2024

Conference Publication

Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys

Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535619

Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys

2024

Journal Article

In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys

Tan, Xin F., Hao, Qichao, Zhou, Jiye, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Ikeda, Masahiko, Yasuda, Kazuhiro, Bermingham, Michael J. and Nogita, Kazuhiro (2024). In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys. Materialia, 33 101974, 1-12. doi: 10.1016/j.mtla.2023.101974

In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys

2024

Journal Article

Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys

Hao, Qichao, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1223-1238. doi: 10.1007/s11664-023-10850-8

Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys

2024

Journal Article

Controlling pore position during transient liquid phase bonding for high-temperature soldering processes

Razak, N. R. Abdul, Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffrey, Nishimura, Tetsuro and Nogita, Kazuhiro (2024). Controlling pore position during transient liquid phase bonding for high-temperature soldering processes. Transactions of The Japan Institute of Electronics Packaging, 17 E23-009. doi: 10.5104/jiepeng.17.e23-009-1

Controlling pore position during transient liquid phase bonding for high-temperature soldering processes

2024

Journal Article

The effect of temperature on the electrical resistivity of Sn-Bi alloys

Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). The effect of temperature on the electrical resistivity of Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1183-1191. doi: 10.1007/s11664-023-10849-1

The effect of temperature on the electrical resistivity of Sn-Bi alloys

2023

Journal Article

In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography

Hao, Qichao, Tan, Xin Fu, Liu, Shiqian, McDonald, Stuart D., Yasuda, Hideyuki and Nogita, Kazuhiro (2023). In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography. ACS Applied Electronic Materials, 5 (12), 7004-7014. doi: 10.1021/acsaelm.3c01383

In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography

2023

Journal Article

The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys

Tan, Xin F., Hao, Qichao, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Bermingham, Michael and Nogita, Kazuhiro (2023). The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys. Materials Characterization, 201 112934, 1-11. doi: 10.1016/j.matchar.2023.112934

The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys

2023

Journal Article

The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys

Zhou, Jiye, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2023). The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys. JOM, 75 (8), 3149-3161. doi: 10.1007/s11837-023-05870-y

The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys

2023

Conference Publication

Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study

Tan, Xin F., Zhou, Jiye, McDonald, Stuart D., Ikeda, Masahiko and Nogita, Kazuhiro (2023). Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study. International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129743

Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study

2023

Conference Publication

Controlling porosity during transient liquid phase bonding for high-temperature soldering processes

Abdul Razak, Nurul R., Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffery, Nishimura, Tetsuro and Nogita, Kazuhiro (2023). Controlling porosity during transient liquid phase bonding for high-temperature soldering processes. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129722

Controlling porosity during transient liquid phase bonding for high-temperature soldering processes

Current funding

  • 2024 - 2027
    Research support for Nihon Superior's commercial solder alloys
    Nihon Superior Co Ltd
    Open grant

Past funding

  • 2021 - 2024
    Research support for TempSave low temperature solder alloys
    Nihon Superior Co Ltd
    Open grant
  • 2016 - 2021
    Development of new lead-free commercial interconnect products
    Nihon Superior Co Ltd
    Open grant
  • 2016 - 2017
    Transient liquid phase high temperature solders through ultrasonic SMAT coatings
    UQ Collaboration and Industry Engagement Fund - FirstLink
    Open grant
  • 2010 - 2011
    Novel Processing of Aluminium-Silicon Alloys for High-Integrity Castings
    UQ FirstLink Scheme
    Open grant

Availability

Dr Stuart McDonald is:
Available for supervision

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Supervision history

Current supervision

Completed supervision

Enquiries

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