
Overview
Background
Dr McDonald is a graduate of The University of Queensland (UQ) having obtained a Bachelor of Engineering (Manufacturing and Materials) in 1997 and a PhD in Materials Engineering in 2002. He is a currently a Senior Research Fellow in the Nihon Superior Centre for the Manufacture of Electronic Materials (NSCMEM).
His research is in the field of microstructure control through solidification science and in particular on understanding the effect of trace element additions on nucleation and growth phenomena. He has numerous publications and expertise in the areas of:
1. Lead-free Solder Alloys
2. Grain refinement
3. Machining and heat treatment of titanium alloys
4. Mg-based Hydrogen Storage Alloys
5. Casting and Solidification of Al-Si Alloys
6. Eutectic solidification and modification
Availability
- Dr Stuart McDonald is:
- Available for supervision
Fields of research
Qualifications
- Bachelor of Engineering, The University of Queensland
- Doctor of Philosophy, The University of Queensland
Research interests
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Eutectic Modification
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Lead-Free Soldering
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Grain Refinement
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Solidification/Casting
Research impacts
Dr McDonald has established the modifying elements, commonly used to alter the eutectic silicon morphology in Al-Si alloys dramatically alter the size and spatial distribution of individual eutectic colonies or ‘eutectic-grains’. It has since become accepted that research into modification mechanisms must consider the growth velocity of the etuectic interface as it relates to the size and number of eutectic grains.
He has been an advocate for the benefits of both eutectic and primary grain refinement, which can benefit many commercial foundry alloys and has contributed to the growing body of theoretical and computational modeling on eutectic and primary grain refinement. Commercially his research has been recognised with the following Patents.
Patents 1. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, G. Zeng, “Low temperature brazing alloys”, Japanese Patent Application No.2013-183232, 04/09/3013.
2. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, C. M. Gourlay, “Process for producing solder joint with improved reliability”, International Patent Application No: WO/2013/002112, 21/6/2012.
3. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, T. Ventura, “Solder alloy”, International Patent Application No: WO 2012/137901-A1, 11/10/2012.
4. A.K. Dahle, L. Lu, K. Nogita and S.D. McDonald, “Aluminium Casting Alloy”, International Patent Application No: WO 2006/058388, 2/12/2005.
Works
Search Professor Stuart McDonald’s works on UQ eSpace
2025
Journal Article
The effect of gallium addition on the microstructure and superconducting properties of In-Bi-Sn solder alloys
Zhou, Jiye, Shahbazi, Mahboobeh, Poitras, Jordan T., Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2025). The effect of gallium addition on the microstructure and superconducting properties of In-Bi-Sn solder alloys. Journal of Electronic Materials, 54 (4), 2628-2637. doi: 10.1007/s11664-024-11584-x
2025
Journal Article
Effect of Sr addition on the microstructure and fluidity of hypoeutectic Al-Ni alloy
Hari, Vigneshwar, McDonald, Stuart, Qu, Dongdong, Tan, Xin Fu, Xu, Dong, Tong, Zherui and Nogita, Kazuhiro (2025). Effect of Sr addition on the microstructure and fluidity of hypoeutectic Al-Ni alloy. Journal of Alloys and Compounds, 1016 178842, 178842-1016. doi: 10.1016/j.jallcom.2025.178842
2025
Journal Article
Thermal Stability of Bi in Sn-Cu and Sn-Ag-Cu Based High Strength Pb-free Solder Alloys
Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2025). Thermal Stability of Bi in Sn-Cu and Sn-Ag-Cu Based High Strength Pb-free Solder Alloys. Transactions of The Japan Institute of Electronics Packaging, 18, E24-006. doi: 10.5104/jiepeng.18.e24-006-1
2024
Other Outputs
Tensile properties of hypo-eutectic Sn37Bi and eutectic Sn57Bi
Ye, Xiaozhou, Nogita, Kazuhiro, Tan, Xin Fu and McDonald, Stuart (2024). Tensile properties of hypo-eutectic Sn37Bi and eutectic Sn57Bi. The University of Queensland. (Dataset) doi: 10.48610/20ec053
2024
Journal Article
The effect of in concentration and temperature on dissolution and precipitation in Sn–Bi alloys
Hao, Qichao, Tan, Xinfu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2024). The effect of in concentration and temperature on dissolution and precipitation in Sn–Bi alloys. Materials, 17 (17) 4372, 1-17. doi: 10.3390/ma17174372
2024
Journal Article
Phase transformations and mechanical properties in In–Bi–Sn alloys as a result of low-temperature storage
Zhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2024). Phase transformations and mechanical properties in In–Bi–Sn alloys as a result of low-temperature storage. Materials, 17 (15) 3669. doi: 10.3390/ma17153669
2024
Conference Publication
Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys
Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535619
2024
Conference Publication
Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys
Zhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535431
2024
Conference Publication
In-situ observations of CU<sub>6</sub>Sn<sub>5</sub> mophological changes at the liquid SAC305/ solid OSP-Cu interface
Nogita, Kazuhiro, Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Maeno, Hiroshi and Matsumura, Syo (2024). In-situ observations of CU6Sn5 mophological changes at the liquid SAC305/ solid OSP-Cu interface. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535651
2024
Journal Article
In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys
Tan, Xin F., Hao, Qichao, Zhou, Jiye, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Ikeda, Masahiko, Yasuda, Kazuhiro, Bermingham, Michael J. and Nogita, Kazuhiro (2024). In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys. Materialia, 33 101974, 1-12. doi: 10.1016/j.mtla.2023.101974
2024
Journal Article
Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys
Hao, Qichao, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1223-1238. doi: 10.1007/s11664-023-10850-8
2024
Journal Article
The effect of temperature on the electrical resistivity of Sn-Bi alloys
Tan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). The effect of temperature on the electrical resistivity of Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1183-1191. doi: 10.1007/s11664-023-10849-1
2024
Journal Article
Controlling pore position during transient liquid phase bonding for high-temperature soldering processes
Razak, N. R. Abdul, Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffrey, Nishimura, Tetsuro and Nogita, Kazuhiro (2024). Controlling pore position during transient liquid phase bonding for high-temperature soldering processes. Transactions of The Japan Institute of Electronics Packaging, 17 E23-009. doi: 10.5104/jiepeng.17.e23-009-1
2023
Journal Article
In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography
Hao, Qichao, Tan, Xin Fu, Liu, Shiqian, McDonald, Stuart D., Yasuda, Hideyuki and Nogita, Kazuhiro (2023). In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography. ACS Applied Electronic Materials, 5 (12), 7004-7014. doi: 10.1021/acsaelm.3c01383
2023
Journal Article
The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys
Tan, Xin F., Hao, Qichao, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Bermingham, Michael and Nogita, Kazuhiro (2023). The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys. Materials Characterization, 201 112934, 1-11. doi: 10.1016/j.matchar.2023.112934
2023
Journal Article
The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys
Zhou, Jiye, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2023). The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys. JOM, 75 (8), 3149-3161. doi: 10.1007/s11837-023-05870-y
2023
Conference Publication
The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi
Ye, Xiaozhou, Tao, Lei, McDonald, Stuart D., Tan, Xin Fu, Sweatman, Keith and Nogita, Kazuhiro (2023). The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129707
2023
Conference Publication
Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study
Tan, Xin F., Zhou, Jiye, McDonald, Stuart D., Ikeda, Masahiko and Nogita, Kazuhiro (2023). Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study. International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129743
2023
Conference Publication
Controlling porosity during transient liquid phase bonding for high-temperature soldering processes
Abdul Razak, Nurul R., Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffery, Nishimura, Tetsuro and Nogita, Kazuhiro (2023). Controlling porosity during transient liquid phase bonding for high-temperature soldering processes. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129722
2023
Journal Article
Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bath
Qu, Dongdong, Gear, Matthew, Gu, Qinfen, Setargew, Nega, Renshaw, Wayne, McDonald, Stuart, StJohn, David and Nogita, Kazuhiro (2023). Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bath. Materials, 16 (3) 1211. doi: 10.3390/ma16031211
Supervision
Availability
- Dr Stuart McDonald is:
- Available for supervision
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Supervision history
Current supervision
-
Doctor Philosophy
Structure Development and Stability in Sn-Bi Based Solder Alloys
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
-
Doctor Philosophy
Development of Smart Orthotics for Remote Australia
Associate Advisor
Other advisors: Professor Martin Veidt
-
Doctor Philosophy
Understanding and controlling oxidation of Ga and Ga-based alloys to facilitate electronic assemblies
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
-
Doctor Philosophy
Development of Sn-Bi based low temperature lead-free solder alloys
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
-
Doctor Philosophy
Mechanical properties of Sn-Bi alloys and mechanisms of ductility improvement
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
-
Doctor Philosophy
Characterisation of Foot Biomechanics through Smart Insole and High Speed Camera
Associate Advisor
Other advisors: Professor Martin Veidt
-
Doctor Philosophy
Al-Ni alloys for use as a novel brazing material for joining Al with dissimilar metals
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
-
Doctor Philosophy
Development of Sn-Bi based low temperature lead-free solder alloys
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
Completed supervision
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2020
Doctor Philosophy
The Interfacial Reactions Between Ga-based Alloys and Common Substrates Used in Microelectronics
Joint Principal Advisor
Other advisors: Professor Kazuhiro Nogita
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2023
Doctor Philosophy
Functional Concentration Gradients in Copper-Nickel Substrates for Transient Liquid Phase Soldering
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
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2022
Doctor Philosophy
Development of High-Temperature Sn-Cu Soldering Alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
-
2020
Doctor Philosophy
Phase Transformation Considerations in Manufacturing Reliable Sn-rich Solder Joints
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
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2019
Doctor Philosophy
Mechanisms of Surface Stability in Al-Zn Coated Steel
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
-
2017
Doctor Philosophy
Mechanisms of hydrogen absorption and desorption in Mg-Ni alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
-
2016
Doctor Philosophy
Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
-
2014
Doctor Philosophy
Eutectic Solidification in Hypo-eutectic Aluminium-Silicon Alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
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2014
Doctor Philosophy
Phase Formation, Transformation and Stability in Micro-alloyed Sn-based Lead-free Solder Alloys and Joints
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
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2013
Master Philosophy
Gas evolution and Condensates: Analysis of Gas evolution & Condensates from Greensand Moulds
Associate Advisor
Other advisors: Professor Matthew Dargusch
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2010
Doctor Philosophy
Grain Refinement of Cast Titanium Alloys
Associate Advisor
Other advisors: Professor Matthew Dargusch
Media
Enquiries
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