Dr Stuart McDonald
Dr

Stuart McDonald

Email: 
Phone: 
+61 7 336 57132

Background

Dr McDonald is a graduate of The University of Queensland (UQ) having obtained a Bachelor of Engineering (Manufacturing and Materials) in 1997 and a PhD in Materials Engineering in 2002. He is a currently a Senior Research Fellow in the Nihon Superior Centre for the Manufacture of Electronic Materials (NSCMEM).

His research is in the field of microstructure control through solidification science and in particular on understanding the effect of trace element additions on nucleation and growth phenomena. He has numerous publications and expertise in the areas of:

1. Lead-free Solder Alloys

2. Grain refinement

3. Machining and heat treatment of titanium alloys

4. Mg-based Hydrogen Storage Alloys

5. Casting and Solidification of Al-Si Alloys

6. Eutectic solidification and modification

Availability

Dr Stuart McDonald is:
Available for supervision

Fields of research

Materials engineering

Qualifications

  • Bachelor of Engineering, The University of Queensland
  • Doctor of Philosophy, The University of Queensland

Research interests

  • Eutectic Modification

  • Lead-Free Soldering

  • Grain Refinement

  • Solidification/Casting

Research impacts

Dr McDonald has established the modifying elements, commonly used to alter the eutectic silicon morphology in Al-Si alloys dramatically alter the size and spatial distribution of individual eutectic colonies or ‘eutectic-grains’. It has since become accepted that research into modification mechanisms must consider the growth velocity of the etuectic interface as it relates to the size and number of eutectic grains.

He has been an advocate for the benefits of both eutectic and primary grain refinement, which can benefit many commercial foundry alloys and has contributed to the growing body of theoretical and computational modeling on eutectic and primary grain refinement. Commercially his research has been recognised with the following Patents.

Patents 1. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, G. Zeng, “Low temperature brazing alloys”, Japanese Patent Application No.2013-183232, 04/09/3013.

2. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, C. M. Gourlay, “Process for producing solder joint with improved reliability”, International Patent Application No: WO/2013/002112, 21/6/2012.

3. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, T. Ventura, “Solder alloy”, International Patent Application No: WO 2012/137901-A1, 11/10/2012.

4. A.K. Dahle, L. Lu, K. Nogita and S.D. McDonald, “Aluminium Casting Alloy”, International Patent Application No: WO 2006/058388, 2/12/2005.

Search Professor Stuart McDonald’s works on UQ eSpace

216 works between 1999 and 2025
All (216) Journal Article (142) Conference Publication (72) Other Outputs (2)

21 - 40 of 216 works

2023

Conference Publication

Fluidity and microstructural analysis of Al–Ni alloys with varied Ni concentrations

Hari, Vigneshwar, Xu, Dong, McDonald, Stuart D., Tong, Zherui, Qu, Dongdong and Nogita, Kazuhiro (2023). Fluidity and microstructural analysis of Al–Ni alloys with varied Ni concentrations. TMS 2023 Annual Meeting & Exhibition, San Diego, CA, United States, 19-23 March 2023. Cham, Switzerland: Springer Nature Switzerland. doi: 10.1007/978-3-031-22532-1_62

Fluidity and microstructural analysis of Al–Ni alloys with varied Ni concentrations

2022

Journal Article

Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints

Zhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints. Materials, 15 (23) 8321, 1-12. doi: 10.3390/ma15238321

Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints

2022

Journal Article

Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage

Tan, Xin F., Kim, Manjin, Gu, Qinfen, Pinzon Piraquive, Julio, Zeng, Guang, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage. Journal of Power Sources, 538 231538, 231538. doi: 10.1016/j.jpowsour.2022.231538

Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage

2022

Journal Article

Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint

Abdul Razak, N. R., Tan, X. F., Mohd Salleh, M. A. A., McDonald, S. D., Bermingham, M. J., Yasuda, H. and Nogita, K. (2022). Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint. Materials Today Communications, 31 103248, 103248. doi: 10.1016/j.mtcomm.2022.103248

Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint

2022

Journal Article

Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process

Kim, Manjin, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D., Ali, Yahia, Matsumura, Syo and Nogita, Kazuhiro (2022). Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process. International Journal of Hydrogen Energy, 47 (36), 16132-16143. doi: 10.1016/j.ijhydene.2022.03.102

Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process

2022

Journal Article

Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering

Tan, Xin F., Gu, Qinfen, Bermingham, Michael, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering. Acta Materialia, 226 117661. doi: 10.1016/j.actamat.2022.117661

Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering

2022

Conference Publication

Effect of Microstructural Refinement and Na Addition on Hydrogenation Kinetics of Cast Mg–Al–La Alloy During the First Hydrogen Absorption Process

Kim, Manjin, McDonald, Stuart D., Ali, Yahia, Abbott, Trevor B. and Nogita, Kazuhiro (2022). Effect of Microstructural Refinement and Na Addition on Hydrogenation Kinetics of Cast Mg–Al–La Alloy During the First Hydrogen Absorption Process. 23rd Magnesium Technology Symposium at the 151st TMS Annual Meeting and Exhibition, Anaheim, CA, United States, 27 February - 3 March 2022. Cham, Switzlerland: Springer International Publishing. doi: 10.1007/978-3-030-92533-8_12

Effect of Microstructural Refinement and Na Addition on Hydrogenation Kinetics of Cast Mg–Al–La Alloy During the First Hydrogen Absorption Process

2022

Journal Article

The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys

Hao, Qichao, Tan, Xin F., Gu, Qinfen, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2022). The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys. JOM, 74 (4), 1739-1750. doi: 10.1007/s11837-021-05145-4

The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys

2022

Journal Article

In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy

Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Bermingham, Michael J., Maeno, Hiroshi, Matsumura, Syo and Nogita, Kazuhiro (2022). In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy. Materials, 15 (2) 510, 510. doi: 10.3390/ma15020510

In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy

2022

Conference Publication

Maximum fluidity length of commercial solder alloys and the effects of Ni and Co in Sn-0.7wt%Cu solder alloys

Nogita, Kazuhiro, Read, Jonathan, McDonald, Stuart D., Xu, Dong and Nishimura, Tetsuro (2022). Maximum fluidity length of commercial solder alloys and the effects of Ni and Co in Sn-0.7wt%Cu solder alloys. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795610

Maximum fluidity length of commercial solder alloys and the effects of Ni and Co in Sn-0.7wt%Cu solder alloys

2022

Conference Publication

Investigation of the effects of surface finish and reflow conditions on the microstructure and mechanical properties of Sn-based solders

Somidin, Flora, Akaiwa, Tetsuya, McDonald, Stuart D., Nishimura, Tetsuro, Ye, Xiaozhou, Smith, Anthony, Zhou, Jiye and Nogita, Kazuhiro (2022). Investigation of the effects of surface finish and reflow conditions on the microstructure and mechanical properties of Sn-based solders. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795417

Investigation of the effects of surface finish and reflow conditions on the microstructure and mechanical properties of Sn-based solders

2022

Journal Article

Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a review

Zeng, Guang, Liu, Shiqian, Gu, Qinfen, Zheng, Zebang, Yasuda, Hideyuki, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a review. Acta Metallurgica Sinica, 35 (1), 49-66. doi: 10.1007/s40195-021-01350-x

Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a review

2022

Conference Publication

Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder

Hao, Qichao, Tan, Xin Fu, McDonald, Stuart D., Sweatman, Keith, Nishimura, Takatoshi, Nishimura, Tetsuro and Nogita, Kazuhiro (2022). Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795406

Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder

2021

Journal Article

Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime

Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart D., Yasuda, Hideyuki and StJohn, David H. (2021). Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime. Acta Materialia, 220 117295, 1-11. doi: 10.1016/j.actamat.2021.117295

Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime

2021

Journal Article

Rapid fabrication of tin-copper anodes for lithium-ion battery applications

Tan, Xin Fu, Belyakov, Sergey A., Su, Te-Cheng, Gu, Qinfen, Liu, Shiqian, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Hideyuki, Matsumura, Syo and Nogita, Kazuhiro (2021). Rapid fabrication of tin-copper anodes for lithium-ion battery applications. Journal of Alloys and Compounds, 867 159031, 159031. doi: 10.1016/j.jallcom.2021.159031

Rapid fabrication of tin-copper anodes for lithium-ion battery applications

2021

Journal Article

Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi joints

Liu, Shiqian, Tan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2021). Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi joints. Intermetallics, 133 107168, 1-9. doi: 10.1016/j.intermet.2021.107168

Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi joints

2021

Journal Article

In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography

Abdul Razak, N.R., Tan, X.F., Somidin, F., Yasuda, H., McDonald, S.D. and Nogita, K. (2021). In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography. Materials Letters, 291 129520, 1-4. doi: 10.1016/j.matlet.2021.129520

In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography

2021

Journal Article

Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu3Sn phase in Sn-10 wt.%Cu Alloys

Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart D., Yasuda, Hideyuki and StJohn, David H. (2021). Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu3Sn phase in Sn-10 wt.%Cu Alloys. Journal of Electronic Materials, 50 (3), 881-892. doi: 10.1007/s11664-020-08709-3

Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu3Sn phase in Sn-10 wt.%Cu Alloys

2020

Journal Article

A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La system

Kim, Manjin, McDonald, Stuart D., Abbott, Trevor B., Easton, Mark A., Ali, Yahia, StJohn, David H. and Nogita, Kazuhiro (2020). A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La system. Journal of Alloys and Compounds, 844 156068, 156068. doi: 10.1016/j.jallcom.2020.156068

A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La system

2020

Journal Article

Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications

Tan, Xin F., Gu, Qinfen, Qu, Dongdong, Yong, Adrian X.B., Yang, Wenhui, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2020). Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications. Acta Materialia, 201, 341-349. doi: 10.1016/j.actamat.2020.10.011

Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications

Current funding

  • 2024 - 2027
    Research support for Nihon Superior's commercial solder alloys
    Nihon Superior Co Ltd
    Open grant

Past funding

  • 2021 - 2024
    Research support for TempSave low temperature solder alloys
    Nihon Superior Co Ltd
    Open grant
  • 2016 - 2021
    Development of new lead-free commercial interconnect products
    Nihon Superior Co Ltd
    Open grant
  • 2016 - 2017
    Transient liquid phase high temperature solders through ultrasonic SMAT coatings
    UQ Collaboration and Industry Engagement Fund - FirstLink
    Open grant
  • 2010 - 2011
    Novel Processing of Aluminium-Silicon Alloys for High-Integrity Castings
    UQ FirstLink Scheme
    Open grant

Availability

Dr Stuart McDonald is:
Available for supervision

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Supervision history

Current supervision

Completed supervision

Enquiries

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