Dr Stuart McDonald
Dr

Stuart McDonald

Email: 
Phone: 
+61 7 336 57132

Background

Dr McDonald is a graduate of The University of Queensland (UQ) having obtained a Bachelor of Engineering (Manufacturing and Materials) in 1997 and a PhD in Materials Engineering in 2002. He is a currently a Senior Research Fellow in the Nihon Superior Centre for the Manufacture of Electronic Materials (NSCMEM).

His research is in the field of microstructure control through solidification science and in particular on understanding the effect of trace element additions on nucleation and growth phenomena. He has numerous publications and expertise in the areas of:

1. Lead-free Solder Alloys

2. Grain refinement

3. Machining and heat treatment of titanium alloys

4. Mg-based Hydrogen Storage Alloys

5. Casting and Solidification of Al-Si Alloys

6. Eutectic solidification and modification

Availability

Dr Stuart McDonald is:
Available for supervision

Fields of research

Materials engineering

Qualifications

  • Bachelor of Engineering, The University of Queensland
  • Doctor of Philosophy, The University of Queensland

Research interests

  • Eutectic Modification

  • Lead-Free Soldering

  • Grain Refinement

  • Solidification/Casting

Research impacts

Dr McDonald has established the modifying elements, commonly used to alter the eutectic silicon morphology in Al-Si alloys dramatically alter the size and spatial distribution of individual eutectic colonies or ‘eutectic-grains’. It has since become accepted that research into modification mechanisms must consider the growth velocity of the etuectic interface as it relates to the size and number of eutectic grains.

He has been an advocate for the benefits of both eutectic and primary grain refinement, which can benefit many commercial foundry alloys and has contributed to the growing body of theoretical and computational modeling on eutectic and primary grain refinement. Commercially his research has been recognised with the following Patents.

Patents 1. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, G. Zeng, “Low temperature brazing alloys”, Japanese Patent Application No.2013-183232, 04/09/3013.

2. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, C. M. Gourlay, “Process for producing solder joint with improved reliability”, International Patent Application No: WO/2013/002112, 21/6/2012.

3. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, T. Ventura, “Solder alloy”, International Patent Application No: WO 2012/137901-A1, 11/10/2012.

4. A.K. Dahle, L. Lu, K. Nogita and S.D. McDonald, “Aluminium Casting Alloy”, International Patent Application No: WO 2006/058388, 2/12/2005.

Search Professor Stuart McDonald’s works on UQ eSpace

216 works between 1999 and 2025
All (216) Journal Article (142) Conference Publication (72) Other Outputs (2)

81 - 100 of 216 works

2017

Journal Article

Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

Mohd Salleh, M. A. A., McDonald, S. D. and Nogita, K. (2017). Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates. Journal of Materials Processing Technology, 242, 235-245. doi: 10.1016/j.jmatprotec.2016.11.031

Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

2017

Journal Article

In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4

Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Yamamoto, Tomokazu, Shigematsu, Koji, Aso, Kohei, Tanaka, Eishi, Matsumura, Syo and Nogita, Kazuhiro (2017). In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4. Journal of Power Sources, 341, 130-138. doi: 10.1016/j.jpowsour.2016.11.105

In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4

2017

Journal Article

In situ imaging of microstructure formation in electronic interconnections

Salleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D. and Nogita, K. (2017). In situ imaging of microstructure formation in electronic interconnections. Scientific Reports, 7 (1) 40010, 40010. doi: 10.1038/srep40010

In situ imaging of microstructure formation in electronic interconnections

2017

Conference Publication

Real time X-ray imaging of soldering processes at the SPring-8 synchrotron

Nogita, K., Salleh, M. A. A. Mohd, Zeng, G., McDonald, S. D., Gourlay, C. and Yasuda, H. (2017). Real time X-ray imaging of soldering processes at the SPring-8 synchrotron. International Conference on Electronics Packaging (ICEP), Tendo, Japan, 19-22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers . doi: 10.23919/ICEP.2017.7939343

Real time X-ray imaging of soldering processes at the SPring-8 synchrotron

2017

Conference Publication

Real-time observation of AZ91 solidification by synchrotron radiography

Zeng, G., Nogita, K., Belyakov, S., Xian, J. W., McDonald, S. D., Yang, K. V., Yasuda, H. and Gourlay, C. M. (2017). Real-time observation of AZ91 solidification by synchrotron radiography. Magnesium Technology 2017, San Diego, CA, United States, 26 February - 2 March 2017. Cham, Switzerland: Springer. doi: 10.1007/978-3-319-52392-7_82

Real-time observation of AZ91 solidification by synchrotron radiography

2017

Conference Publication

Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects

Nogita, K., Salleh, M. A. A. Mohd, Smith, S., Wu, Y. Q., McDonald, S. D., Ab Razak, A. G., Akaiwa, T. and Nishimura, T. (2017). Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects. 2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Japan, 19 - 22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2017.7939399

Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects

2016

Journal Article

The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints

Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen, Salleh, M. A. A. Mohd and Nogita, Kazuhiro (2016). The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints. Journal of Alloys and Compounds, 685, 471-482. doi: 10.1016/j.jallcom.2016.05.263

The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints

2016

Journal Article

In situ TEM observations of Cu6Sn5 polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substrates

Nogita, K., Mohd Salleh, M. A. A., Tanaka, E., Zeng, G., McDonald, S. D. and Matsumura, S. (2016). In situ TEM observations of Cu6Sn5 polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substrates. JOM, 68 (11), 2871-2878. doi: 10.1007/s11837-016-2020-0

In situ TEM observations of Cu6Sn5 polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substrates

2016

Journal Article

Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloys

Tran, Xuan Quy, McDonald, Stuart D. , Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016). Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloys. International Journal of Hydrogen Energy, 42 (10), 6851-6861. doi: 10.1016/j.ijhydene.2016.12.007

Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloys

2016

Journal Article

Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles

Salleh, M. A. A. Mohd, McDonald, S. D., Gourlay, C. M., Yasuda, H. and Nogita, K. (2016). Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles. Materials and Design, 108, 418-428. doi: 10.1016/j.matdes.2016.06.121

Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles

2016

Journal Article

Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloys

Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016). Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloys. International Journal of Hydrogen Energy, 42 (1), 366-375. doi: 10.1016/j.ijhydene.2016.08.110

Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloys

2016

Journal Article

Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering

Mohd Salleh, M. A A, Said, R. M., Saud, N., Yasuda, H., McDonald, S. D. and Nogita, K. (2016). Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering. Key Engineering Materials, 700, 161-169. doi: 10.4028/www.scientific.net/KEM.700.161

Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering

2016

Journal Article

Effect of trace Na additions on the hydrogen absorption kinetics of Mg2Ni

Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2016). Effect of trace Na additions on the hydrogen absorption kinetics of Mg2Ni. Journal of Materials Research, 31 (9), 1316-1327. doi: 10.1557/jmr.2016.123

Effect of trace Na additions on the hydrogen absorption kinetics of Mg2Ni

2016

Journal Article

Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review

Mu, D.K., McDonald, S.D., Read, J., Huang, H. and Nogita, K. (2016). Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review. Current Opinion in Solid State and Materials Science, 20 (2), 55-76. doi: 10.1016/j.cossms.2015.08.001

Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review

2016

Conference Publication

Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys

Nogita, K., Kefford, B., Read, J. and McDonald, S. D. (2016). Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.53

Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys

2016

Conference Publication

Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications

Smith, S., Zeng, G., Read, J., McDonald, S. D. and Nogita, K. (2016). Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.58

Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications

2016

Conference Publication

The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloys

Darlapudi, A., McDonald, S.D. and St John, D.H. (2016). The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloys. 4th International Conference on Advances in Solidification Processes, ICASP 2014, Windsor, United Kingdom, July 8-11, 2014. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/117/1/012022

The influence of Cu, Mg and Ni on the solidification and microstructure of Al-Si alloys

2016

Journal Article

The influence of ternary alloying elements on the Al-Si eutectic microstructure and the Si morphology

Darlapudi, A., McDonald, S. D., Terzi, S., Prasad, A., Felberbaum, M. and StJohn, D. H. (2016). The influence of ternary alloying elements on the Al-Si eutectic microstructure and the Si morphology. Journal of Crystal Growth, 433, 63-73. doi: 10.1016/j.jcrysgro.2015.10.002

The influence of ternary alloying elements on the Al-Si eutectic microstructure and the Si morphology

2016

Conference Publication

Effects of trace phosphorus in Sn-Cu-Ni wave solder dross

Nogita, K., Mohd Salleh, M. A. A., Tran, X. Q., Read, J., Smith, S. and McDonald, S. D. (2016). Effects of trace phosphorus in Sn-Cu-Ni wave solder dross. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.49

Effects of trace phosphorus in Sn-Cu-Ni wave solder dross

2015

Journal Article

A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys

Prasad, Arvind, Macdonald, Stuart D., Yasuda, Hideyuki, Nogita, Kazuhiro and StJohn, David (2015). A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys. Journal of Crystal Growth, 430, 122-137. doi: 10.1016/j.jcrysgro.2015.06.024

A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys

Current funding

  • 2024 - 2027
    Research support for Nihon Superior's commercial solder alloys
    Nihon Superior Co Ltd
    Open grant

Past funding

  • 2021 - 2024
    Research support for TempSave low temperature solder alloys
    Nihon Superior Co Ltd
    Open grant
  • 2016 - 2021
    Development of new lead-free commercial interconnect products
    Nihon Superior Co Ltd
    Open grant
  • 2016 - 2017
    Transient liquid phase high temperature solders through ultrasonic SMAT coatings
    UQ Collaboration and Industry Engagement Fund - FirstLink
    Open grant
  • 2010 - 2011
    Novel Processing of Aluminium-Silicon Alloys for High-Integrity Castings
    UQ FirstLink Scheme
    Open grant

Availability

Dr Stuart McDonald is:
Available for supervision

Before you email them, read our advice on how to contact a supervisor.

Supervision history

Current supervision

Completed supervision

Enquiries

For media enquiries about Dr Stuart McDonald's areas of expertise, story ideas and help finding experts, contact our Media team:

communications@uq.edu.au