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Dr Stuart McDonald
Dr

Stuart McDonald

Email: 
Phone: 
+61 7 336 57132

Overview

Background

Dr McDonald is a graduate of The University of Queensland (UQ) having obtained a Bachelor of Engineering (Manufacturing and Materials) in 1997 and a PhD in Materials Engineering in 2002. He is a currently a Senior Research Fellow in the Nihon Superior Centre for the Manufacture of Electronic Materials (NSCMEM).

His research is in the field of microstructure control through solidification science and in particular on understanding the effect of trace element additions on nucleation and growth phenomena. He has numerous publications and expertise in the areas of:

1. Lead-free Solder Alloys

2. Grain refinement

3. Machining and heat treatment of titanium alloys

4. Mg-based Hydrogen Storage Alloys

5. Casting and Solidification of Al-Si Alloys

6. Eutectic solidification and modification

Availability

Dr Stuart McDonald is:
Available for supervision

Fields of research

Qualifications

  • Bachelor of Engineering, The University of Queensland
  • Doctor of Philosophy, The University of Queensland

Research interests

  • Eutectic Modification

  • Lead-Free Soldering

  • Grain Refinement

  • Solidification/Casting

Research impacts

Dr McDonald has established the modifying elements, commonly used to alter the eutectic silicon morphology in Al-Si alloys dramatically alter the size and spatial distribution of individual eutectic colonies or ‘eutectic-grains’. It has since become accepted that research into modification mechanisms must consider the growth velocity of the etuectic interface as it relates to the size and number of eutectic grains.

He has been an advocate for the benefits of both eutectic and primary grain refinement, which can benefit many commercial foundry alloys and has contributed to the growing body of theoretical and computational modeling on eutectic and primary grain refinement. Commercially his research has been recognised with the following Patents.

Patents 1. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, G. Zeng, “Low temperature brazing alloys”, Japanese Patent Application No.2013-183232, 04/09/3013.

2. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, C. M. Gourlay, “Process for producing solder joint with improved reliability”, International Patent Application No: WO/2013/002112, 21/6/2012.

3. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, T. Ventura, “Solder alloy”, International Patent Application No: WO 2012/137901-A1, 11/10/2012.

4. A.K. Dahle, L. Lu, K. Nogita and S.D. McDonald, “Aluminium Casting Alloy”, International Patent Application No: WO 2006/058388, 2/12/2005.

Works

Search Professor Stuart McDonald’s works on UQ eSpace

218 works between 1999 and 2025

101 - 120 of 218 works

2016

Conference Publication

Effects of trace phosphorus in Sn-Cu-Ni wave solder dross

Nogita, K., Mohd Salleh, M. A. A., Tran, X. Q., Read, J., Smith, S. and McDonald, S. D. (2016). Effects of trace phosphorus in Sn-Cu-Ni wave solder dross. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.49

Effects of trace phosphorus in Sn-Cu-Ni wave solder dross

2015

Journal Article

A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys

Prasad, Arvind, Macdonald, Stuart D., Yasuda, Hideyuki, Nogita, Kazuhiro and StJohn, David (2015). A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys. Journal of Crystal Growth, 430, 122-137. doi: 10.1016/j.jcrysgro.2015.06.024

A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys

2015

Journal Article

Kinetics of the β → α transformation of tin: role of α-tin nucleation

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2015). Kinetics of the β → α transformation of tin: role of α-tin nucleation. Crystal Growth and Design, 15 (12), 5767-5773. doi: 10.1021/acs.cgd.5b01069

Kinetics of the β → α transformation of tin: role of α-tin nucleation

2015

Journal Article

Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

Mohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H. and Nogita, K. (2015). Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process. Journal of Electronic Materials, 45 (1), 154-163. doi: 10.1007/s11664-015-4121-x

Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

2015

Journal Article

The influence of ternary Cu additions on the nucleation of eutectic grains in a hypoeutectic Al-10 wt.%Si alloy

Darlapudi, A., McDonald, S. D. and StJohn, D. H. (2015). The influence of ternary Cu additions on the nucleation of eutectic grains in a hypoeutectic Al-10 wt.%Si alloy. Journal of Alloys and Compounds, 646, 699-705. doi: 10.1016/j.jallcom.2015.05.223

The influence of ternary Cu additions on the nucleation of eutectic grains in a hypoeutectic Al-10 wt.%Si alloy

2015

Journal Article

Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy

Salleh, M. A. A. Mohd, McDonald, S. D., Terada, Y., Yasuda, H. and Nogita, K. (2015). Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy. Materials & Design, 82, 136-147. doi: 10.1016/j.matdes.2015.05.077

Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy

2015

Journal Article

In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg-Ni alloy

Tran, X. Q., McDonald, S. D., Gu, Q. F. and Nogita, K. (2015). In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg-Ni alloy. Journal of Alloys and Compounds, 636 33418, 249-256. doi: 10.1016/j.jallcom.2015.02.044

In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg-Ni alloy

2015

Journal Article

Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces

Mohd Salleh, M. A. A., McDonald, S. D., Yasuda, H., Sugiyama, A. and Nogita, K. (2015). Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces. Scripta Materialia, 100, 17-20. doi: 10.1016/j.scriptamat.2014.11.039

Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces

2015

Journal Article

In-situ soldering process technique by synchrotron X-ray imaging

Mohd Salleh, M. A. A., Sugiyama, A., Yasuda, H., McDonald, S. D. and Nogita, Naz (2015). In-situ soldering process technique by synchrotron X-ray imaging. Applied Mechanics and Materials, 754-755, 508-512. doi: 10.4028/www.scientific.net/AMM.754-755.508

In-situ soldering process technique by synchrotron X-ray imaging

2015

Journal Article

Evidence of the hydrogen release mechanism in bulk MgH2

Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro and Matsumura, Syo (2015). Evidence of the hydrogen release mechanism in bulk MgH2. Scientific Reports, 5 (8450) 43720, 1-5. doi: 10.1038/srep08450

Evidence of the hydrogen release mechanism in bulk MgH2

2015

Journal Article

The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Terada, Yasuko, Uesugi, Kentaro, Yasuda, Hideyuki and Nogita, Kazuhiro (2015). The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints. Acta Materialia, 83, 357-371. doi: 10.1016/j.actamat.2014.10.003

The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints

2015

Conference Publication

Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling

Prasad, A., Liotti, E., McDonald, S. D., Nogita, K., Yasuda, H., Grant, P. S. and StJohn, D. H. (2015). Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling. 14th International Conference on Modeling of Casting, Welding and Advanced Solidification Processes, Awaji island, Hyogo, Japan, 21-26 June 2015. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/84/1/012014

Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling

2015

Conference Publication

The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates

Ng, Wayne, Zeng, Guang, Nishimura, Takatoshi, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2015). The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates. 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, Kyoto, Japan, 14-17 April 2015. Japan: IEEE. doi: 10.1109/ICEP-IAAC.2015.7111122

The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates

2014

Journal Article

Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints

Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen and Nogita, Kazuhiro (2014). Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints. Intermetallics, 54, 20-27. doi: 10.1016/j.intermet.2014.05.004

Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints

2014

Journal Article

Kinetics of the polymorphic phase transformation of Cu6Sn5

Zeng, Guang, McDonald, Stuart David, Read, Jonathan J., Gu, Qinfen and Nogita, Kazuhiro (2014). Kinetics of the polymorphic phase transformation of Cu6Sn5. Acta Materialia, 69, 135-148. doi: 10.1016/j.actamat.2014.01.027

Kinetics of the polymorphic phase transformation of Cu6Sn5

2014

Journal Article

Solidification of Sn-0.7Cu-0.15Zn solder: In situ observation

Zeng, Guang, McDonald, Stuart David, Gourlay, Christopher M., Uesugi, Kentaro, Terada, Yasuko, Yasuda, Hideyuki and Nogita, Kazuhiro (2014). Solidification of Sn-0.7Cu-0.15Zn solder: In situ observation. Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science, 45 (2), 918-926. doi: 10.1007/s11661-013-2008-0

Solidification of Sn-0.7Cu-0.15Zn solder: In situ observation

2014

Journal Article

Grain refinement for improved lead-free solder joint reliability

Sweatman, K., Nishimura, T., McDonald, S. D., Whitewick, M. and Nogita, K. (2014). Grain refinement for improved lead-free solder joint reliability. SMT Surface Mount Technology Magazine, 29 (1), 30-41.

Grain refinement for improved lead-free solder joint reliability

2014

Journal Article

Effects of element addition on the beta->alpha transformation in tin

Zeng, Guang, McDonald, Stuart David, Gu, Qinfen, Sweatman, Keith and Nogita, Kazuhiro (2014). Effects of element addition on the beta->alpha transformation in tin. Philosophical Magazine Letters, 94 (2), 53-62. doi: 10.1080/09500839.2013.860247

Effects of element addition on the beta->alpha transformation in tin

2014

Conference Publication

Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics

Zeng, Guang, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2014). Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics. 2014 International Conference on Electronics Packaging (ICEP 2014), Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826677

Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics

2013

Journal Article

Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Suenaga, Shoichi, Zhang, Yong, Chen, Jianghua and Nogita, Kazuhiro (2013). Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In. Intermetallics, 43, 85-98. doi: 10.1016/j.intermet.2013.07.012

Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In

Funding

Current funding

  • 2024 - 2027
    Research support for Nihon Superior's commercial solder alloys
    Nihon Superior Co Ltd
    Open grant

Past funding

  • 2021 - 2024
    Research support for TempSave low temperature solder alloys
    Nihon Superior Co Ltd
    Open grant
  • 2016 - 2021
    Development of new lead-free commercial interconnect products
    Nihon Superior Co Ltd
    Open grant
  • 2016 - 2017
    Transient liquid phase high temperature solders through ultrasonic SMAT coatings
    UQ Collaboration and Industry Engagement Fund - FirstLink
    Open grant
  • 2010 - 2011
    Novel Processing of Aluminium-Silicon Alloys for High-Integrity Castings
    UQ FirstLink Scheme
    Open grant

Supervision

Availability

Dr Stuart McDonald is:
Available for supervision

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Supervision history

Current supervision

Completed supervision

Media

Enquiries

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communications@uq.edu.au