
Overview
Background
Dr McDonald is a graduate of The University of Queensland (UQ) having obtained a Bachelor of Engineering (Manufacturing and Materials) in 1997 and a PhD in Materials Engineering in 2002. He is a currently a Senior Research Fellow in the Nihon Superior Centre for the Manufacture of Electronic Materials (NSCMEM).
His research is in the field of microstructure control through solidification science and in particular on understanding the effect of trace element additions on nucleation and growth phenomena. He has numerous publications and expertise in the areas of:
1. Lead-free Solder Alloys
2. Grain refinement
3. Machining and heat treatment of titanium alloys
4. Mg-based Hydrogen Storage Alloys
5. Casting and Solidification of Al-Si Alloys
6. Eutectic solidification and modification
Availability
- Dr Stuart McDonald is:
- Available for supervision
Fields of research
Qualifications
- Bachelor of Engineering, The University of Queensland
- Doctor of Philosophy, The University of Queensland
Research interests
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Eutectic Modification
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Lead-Free Soldering
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Grain Refinement
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Solidification/Casting
Research impacts
Dr McDonald has established the modifying elements, commonly used to alter the eutectic silicon morphology in Al-Si alloys dramatically alter the size and spatial distribution of individual eutectic colonies or ‘eutectic-grains’. It has since become accepted that research into modification mechanisms must consider the growth velocity of the etuectic interface as it relates to the size and number of eutectic grains.
He has been an advocate for the benefits of both eutectic and primary grain refinement, which can benefit many commercial foundry alloys and has contributed to the growing body of theoretical and computational modeling on eutectic and primary grain refinement. Commercially his research has been recognised with the following Patents.
Patents 1. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, G. Zeng, “Low temperature brazing alloys”, Japanese Patent Application No.2013-183232, 04/09/3013.
2. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, C. M. Gourlay, “Process for producing solder joint with improved reliability”, International Patent Application No: WO/2013/002112, 21/6/2012.
3. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, T. Ventura, “Solder alloy”, International Patent Application No: WO 2012/137901-A1, 11/10/2012.
4. A.K. Dahle, L. Lu, K. Nogita and S.D. McDonald, “Aluminium Casting Alloy”, International Patent Application No: WO 2006/058388, 2/12/2005.
Works
Search Professor Stuart McDonald’s works on UQ eSpace
2016
Conference Publication
Effects of trace phosphorus in Sn-Cu-Ni wave solder dross
Nogita, K., Mohd Salleh, M. A. A., Tran, X. Q., Read, J., Smith, S. and McDonald, S. D. (2016). Effects of trace phosphorus in Sn-Cu-Ni wave solder dross. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.49
2015
Journal Article
A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys
Prasad, Arvind, Macdonald, Stuart D., Yasuda, Hideyuki, Nogita, Kazuhiro and StJohn, David (2015). A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys. Journal of Crystal Growth, 430, 122-137. doi: 10.1016/j.jcrysgro.2015.06.024
2015
Journal Article
Kinetics of the β → α transformation of tin: role of α-tin nucleation
Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2015). Kinetics of the β → α transformation of tin: role of α-tin nucleation. Crystal Growth and Design, 15 (12), 5767-5773. doi: 10.1021/acs.cgd.5b01069
2015
Journal Article
Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process
Mohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H. and Nogita, K. (2015). Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process. Journal of Electronic Materials, 45 (1), 154-163. doi: 10.1007/s11664-015-4121-x
2015
Journal Article
The influence of ternary Cu additions on the nucleation of eutectic grains in a hypoeutectic Al-10 wt.%Si alloy
Darlapudi, A., McDonald, S. D. and StJohn, D. H. (2015). The influence of ternary Cu additions on the nucleation of eutectic grains in a hypoeutectic Al-10 wt.%Si alloy. Journal of Alloys and Compounds, 646, 699-705. doi: 10.1016/j.jallcom.2015.05.223
2015
Journal Article
Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy
Salleh, M. A. A. Mohd, McDonald, S. D., Terada, Y., Yasuda, H. and Nogita, K. (2015). Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy. Materials & Design, 82, 136-147. doi: 10.1016/j.matdes.2015.05.077
2015
Journal Article
In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg-Ni alloy
Tran, X. Q., McDonald, S. D., Gu, Q. F. and Nogita, K. (2015). In-situ synchrotron X-ray diffraction investigation of the hydriding and dehydriding properties of a cast Mg-Ni alloy. Journal of Alloys and Compounds, 636 33418, 249-256. doi: 10.1016/j.jallcom.2015.02.044
2015
Journal Article
Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces
Mohd Salleh, M. A. A., McDonald, S. D., Yasuda, H., Sugiyama, A. and Nogita, K. (2015). Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces. Scripta Materialia, 100, 17-20. doi: 10.1016/j.scriptamat.2014.11.039
2015
Journal Article
In-situ soldering process technique by synchrotron X-ray imaging
Mohd Salleh, M. A. A., Sugiyama, A., Yasuda, H., McDonald, S. D. and Nogita, Naz (2015). In-situ soldering process technique by synchrotron X-ray imaging. Applied Mechanics and Materials, 754-755, 508-512. doi: 10.4028/www.scientific.net/AMM.754-755.508
2015
Journal Article
Evidence of the hydrogen release mechanism in bulk MgH2
Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro and Matsumura, Syo (2015). Evidence of the hydrogen release mechanism in bulk MgH2. Scientific Reports, 5 (8450) 43720, 1-5. doi: 10.1038/srep08450
2015
Journal Article
The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints
Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Terada, Yasuko, Uesugi, Kentaro, Yasuda, Hideyuki and Nogita, Kazuhiro (2015). The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints. Acta Materialia, 83, 357-371. doi: 10.1016/j.actamat.2014.10.003
2015
Conference Publication
Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling
Prasad, A., Liotti, E., McDonald, S. D., Nogita, K., Yasuda, H., Grant, P. S. and StJohn, D. H. (2015). Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling. 14th International Conference on Modeling of Casting, Welding and Advanced Solidification Processes, Awaji island, Hyogo, Japan, 21-26 June 2015. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/84/1/012014
2015
Conference Publication
The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates
Ng, Wayne, Zeng, Guang, Nishimura, Takatoshi, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2015). The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates. 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, Kyoto, Japan, 14-17 April 2015. Japan: IEEE. doi: 10.1109/ICEP-IAAC.2015.7111122
2014
Journal Article
Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints
Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen and Nogita, Kazuhiro (2014). Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints. Intermetallics, 54, 20-27. doi: 10.1016/j.intermet.2014.05.004
2014
Journal Article
Kinetics of the polymorphic phase transformation of Cu6Sn5
Zeng, Guang, McDonald, Stuart David, Read, Jonathan J., Gu, Qinfen and Nogita, Kazuhiro (2014). Kinetics of the polymorphic phase transformation of Cu6Sn5. Acta Materialia, 69, 135-148. doi: 10.1016/j.actamat.2014.01.027
2014
Journal Article
Solidification of Sn-0.7Cu-0.15Zn solder: In situ observation
Zeng, Guang, McDonald, Stuart David, Gourlay, Christopher M., Uesugi, Kentaro, Terada, Yasuko, Yasuda, Hideyuki and Nogita, Kazuhiro (2014). Solidification of Sn-0.7Cu-0.15Zn solder: In situ observation. Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science, 45 (2), 918-926. doi: 10.1007/s11661-013-2008-0
2014
Journal Article
Grain refinement for improved lead-free solder joint reliability
Sweatman, K., Nishimura, T., McDonald, S. D., Whitewick, M. and Nogita, K. (2014). Grain refinement for improved lead-free solder joint reliability. SMT Surface Mount Technology Magazine, 29 (1), 30-41.
2014
Journal Article
Effects of element addition on the beta->alpha transformation in tin
Zeng, Guang, McDonald, Stuart David, Gu, Qinfen, Sweatman, Keith and Nogita, Kazuhiro (2014). Effects of element addition on the beta->alpha transformation in tin. Philosophical Magazine Letters, 94 (2), 53-62. doi: 10.1080/09500839.2013.860247
2014
Conference Publication
Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics
Zeng, Guang, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2014). Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics. 2014 International Conference on Electronics Packaging (ICEP 2014), Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826677
2013
Journal Article
Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In
Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Suenaga, Shoichi, Zhang, Yong, Chen, Jianghua and Nogita, Kazuhiro (2013). Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In. Intermetallics, 43, 85-98. doi: 10.1016/j.intermet.2013.07.012
Supervision
Availability
- Dr Stuart McDonald is:
- Available for supervision
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Supervision history
Current supervision
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Doctor Philosophy
Development of Smart Orthotics for Remote Australia
Associate Advisor
Other advisors: Professor Martin Veidt
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Doctor Philosophy
Mechanical properties of Sn-Bi alloys and mechanisms of ductility improvement
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
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Doctor Philosophy
Development of Sn-Bi based low temperature lead-free solder alloys
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
-
Doctor Philosophy
Characterisation of Foot Biomechanics through Smart Insole and High Speed Camera
Associate Advisor
Other advisors: Professor Martin Veidt
-
Doctor Philosophy
Al-Ni alloys for use as a novel brazing material for joining Al with dissimilar metals
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
-
Doctor Philosophy
Development of Sn-Bi based low temperature lead-free solder alloys
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
-
Doctor Philosophy
Structure Development and Stability in Sn-Bi Based Solder Alloys
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
-
Doctor Philosophy
Understanding and controlling oxidation of Ga and Ga-based alloys to facilitate electronic assemblies
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
Completed supervision
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2020
Doctor Philosophy
The Interfacial Reactions Between Ga-based Alloys and Common Substrates Used in Microelectronics
Joint Principal Advisor
Other advisors: Professor Kazuhiro Nogita
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2023
Doctor Philosophy
Functional Concentration Gradients in Copper-Nickel Substrates for Transient Liquid Phase Soldering
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
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2022
Doctor Philosophy
Development of High-Temperature Sn-Cu Soldering Alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
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2020
Doctor Philosophy
Phase Transformation Considerations in Manufacturing Reliable Sn-rich Solder Joints
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
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2019
Doctor Philosophy
Mechanisms of Surface Stability in Al-Zn Coated Steel
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
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2017
Doctor Philosophy
Mechanisms of hydrogen absorption and desorption in Mg-Ni alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
-
2016
Doctor Philosophy
Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
-
2014
Doctor Philosophy
Eutectic Solidification in Hypo-eutectic Aluminium-Silicon Alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
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2014
Doctor Philosophy
Phase Formation, Transformation and Stability in Micro-alloyed Sn-based Lead-free Solder Alloys and Joints
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
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2013
Master Philosophy
Gas evolution and Condensates: Analysis of Gas evolution & Condensates from Greensand Moulds
Associate Advisor
Other advisors: Professor Matthew Dargusch
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2010
Doctor Philosophy
Grain Refinement of Cast Titanium Alloys
Associate Advisor
Other advisors: Professor Matthew Dargusch
Media
Enquiries
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