
Overview
Background
Dr McDonald is a graduate of The University of Queensland (UQ) having obtained a Bachelor of Engineering (Manufacturing and Materials) in 1997 and a PhD in Materials Engineering in 2002. He is a currently a Senior Research Fellow in the Nihon Superior Centre for the Manufacture of Electronic Materials (NSCMEM).
His research is in the field of microstructure control through solidification science and in particular on understanding the effect of trace element additions on nucleation and growth phenomena. He has numerous publications and expertise in the areas of:
1. Lead-free Solder Alloys
2. Grain refinement
3. Machining and heat treatment of titanium alloys
4. Mg-based Hydrogen Storage Alloys
5. Casting and Solidification of Al-Si Alloys
6. Eutectic solidification and modification
Availability
- Dr Stuart McDonald is:
- Available for supervision
Fields of research
Qualifications
- Bachelor of Engineering, The University of Queensland
- Doctor of Philosophy, The University of Queensland
Research interests
-
Eutectic Modification
-
Lead-Free Soldering
-
Grain Refinement
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Solidification/Casting
Research impacts
Dr McDonald has established the modifying elements, commonly used to alter the eutectic silicon morphology in Al-Si alloys dramatically alter the size and spatial distribution of individual eutectic colonies or ‘eutectic-grains’. It has since become accepted that research into modification mechanisms must consider the growth velocity of the etuectic interface as it relates to the size and number of eutectic grains.
He has been an advocate for the benefits of both eutectic and primary grain refinement, which can benefit many commercial foundry alloys and has contributed to the growing body of theoretical and computational modeling on eutectic and primary grain refinement. Commercially his research has been recognised with the following Patents.
Patents 1. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, G. Zeng, “Low temperature brazing alloys”, Japanese Patent Application No.2013-183232, 04/09/3013.
2. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, C. M. Gourlay, “Process for producing solder joint with improved reliability”, International Patent Application No: WO/2013/002112, 21/6/2012.
3. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, T. Ventura, “Solder alloy”, International Patent Application No: WO 2012/137901-A1, 11/10/2012.
4. A.K. Dahle, L. Lu, K. Nogita and S.D. McDonald, “Aluminium Casting Alloy”, International Patent Application No: WO 2006/058388, 2/12/2005.
Works
Search Professor Stuart McDonald’s works on UQ eSpace
2010
Conference Publication
Trace element distribution in solder joints between Sn-based solders and Cu substrates
Nogita, K., Yasuda, H., Gourlay, C. M., Suenaga, S., Tsukamoto, H., McDonald, S. D., Takeuchi, A., Uesugi, K. and Suzuki, Y. (2010). Trace element distribution in solder joints between Sn-based solders and Cu substrates. International Conference on Electronics Packaging ICEP2010, Sapporo, Hokkaido, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP).
2010
Conference Publication
Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS
Nogita, Kazuhiro, Jenke, Marc, Wood, David, Duguid, Andrew and McDonald, Stuart D. (2010). Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS. 7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2 - 6 August 2010. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2851
2009
Journal Article
Latest developments in understanding grain refinement of cast titanium
Bermingham, Michael, McDonald, Stuart, Dargusch, Matthew and St John, David (2009). Latest developments in understanding grain refinement of cast titanium. Light Metals Age, 67 (4), 47-49.
2009
Journal Article
Effects of coolant pressure on chip formation while turning Ti6Al4V alloy
Palanisamy, Suresh, McDonald, Stuart D. and Dargusch, Matthew S. (2009). Effects of coolant pressure on chip formation while turning Ti6Al4V alloy. International Journal of Machine Tools and Manufacture, 49 (9), 739-743. doi: 10.1016/j.ijmachtools.2009.02.010
2009
Journal Article
Beryllium as a grain refiner in titanium alloys
Bermingham, M. J., McDonald, S. D., StJohn D. H. and Dargusch, M. S. (2009). Beryllium as a grain refiner in titanium alloys. Journal of Alloys and Compounds, 481 (1-2), L20-L23. doi: 10.1016/j.jallcom.2009.03.016
2009
Journal Article
Segregation and grain refinement in cast titanium alloys
Bermingham, M. J., McDonald, S. D., StJohn, D. H. and Dargusch, M. S. (2009). Segregation and grain refinement in cast titanium alloys. Journal of Materials Research, 24 (4), 1529-1535. doi: 10.1557/JMR.2009.0173
2009
Conference Publication
Latest developments in understanding the grain refinement of cast titanium
Bermingham, Michael, McDonald, Stuart D., St John, David H. and Dargusch, Matthew S. (2009). Latest developments in understanding the grain refinement of cast titanium. 4th International Light Metals Technology Conference (LMT 2009), Gold Coast, Australia, 29 June - 1 July 2009. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.618-619.315
2009
Journal Article
Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders
Nogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009). Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 (1), 46-54.
2009
Conference Publication
The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates
Nogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. TMS 2009, San Francisco, California, USA, 15-19 February 2009.
2009
Conference Publication
Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates
Hideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, 1-16 April 2009. Japan: Japan Institute of Electronics Packaging.
2009
Conference Publication
The Effect of Ni on Phase Stability in Cu6Sn5
Nogita, K., Read, J., Tsukamoto, H., McDonald, S. D., Gourlay, C. M. and Nishimura, T. (2009). The Effect of Ni on Phase Stability in Cu6Sn5. Japan Institute of Metals Autumn Meeting 2009, Kyoto, Japan, 15-17 September 2009.
2009
Conference Publication
The influence of solder composition on the impact strength of lead-free solder BGA joints
Tsukamoto, Hideaki, Nogita, Kazuhiro, McDonald, Stuart, Nishimura, Tetsuro, Suenaga, Shoichi and Sweatman, Keith W. (2009). The influence of solder composition on the impact strength of lead-free solder BGA joints. 2009 TMS Annual Meeting & Exhibition, San Francisco, CA, USA, 15 - 19 February 2009. TMS.
2009
Conference Publication
Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces
Nogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, 14-16 April, 2009. Kyoto, Japan: Japan Institute of Electronics Packaging.
2009
Conference Publication
Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints
Tsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, 1-3 July 2009.
2008
Journal Article
Effects of boron on microstructure in cast titanium alloys
Bermingham, M., McDonald, S.D., Nogita, K., St John, D.H. and Dargusch, M.S. (2008). Effects of boron on microstructure in cast titanium alloys. Scripta Materialia, 59 (5), 538-541. doi: 10.1016/j.scriptamat.2008.05.002
2008
Journal Article
The mechanism of grain refinement of titanium by silicon
Bermingham, M., McDonald, S.D., Dargusch, M.S. and St John, D.H. (2008). The mechanism of grain refinement of titanium by silicon. Scripta Materialia, 58 (12), 1050-1053. doi: 10.1016/j.scriptamat.2008.01.041
2008
Journal Article
Modeling of grain refinement: Part I. Effect of the solute titanium for aluminum
Yao, X., McDonald, S. D., Dahle, A. K., Davidson, C. J. and St John, D. H. (2008). Modeling of grain refinement: Part I. Effect of the solute titanium for aluminum. Journal of Materials Research, 23 (5), 1282-1291. doi: 10.1557/JMR.2008.0153
2008
Journal Article
Modeling of grain refinement: Part II. Effect of nucleant particles-TiB2 additions for aluminum
Yao, X., McDonald, S.D., Dahle, A.K., Davidson, C.J. and St John, D.H. (2008). Modeling of grain refinement: Part II. Effect of nucleant particles-TiB2 additions for aluminum. Journal of Materials Research, 23 (5), 1292-1300. doi: 10.1557/JMR.2008.0154
2008
Journal Article
Modeling of grain refinement: Part III. Al-7Si-0.3Mg aluminum alloy
Yao, X., McDonald, S. D., Dahle, A. K., Davidson, C. J. and St John, D. H. (2008). Modeling of grain refinement: Part III. Al-7Si-0.3Mg aluminum alloy. Journal of Materials Research, 23 (5), 1301-1306. doi: 10.1557/JMR.2008.0155
2008
Journal Article
Grain-refinement mechanisms in titanium alloys
Bermingham, M., McDonald, S.D., Dargusch, M.S. and St John, D.H. (2008). Grain-refinement mechanisms in titanium alloys. Journal of Materials Research, 23 (1), 97-104. doi: 10.1557/JMR.2008.0002
Supervision
Availability
- Dr Stuart McDonald is:
- Available for supervision
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Supervision history
Current supervision
-
Doctor Philosophy
Development of Al-Ni alloys for use as a novel brazing material for joining Al with Cu
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
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Doctor Philosophy
Characterisation of Foot Biomechanics through Smart Insole and High Speed Camera
Associate Advisor
Other advisors: Professor Martin Veidt
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Doctor Philosophy
Mechanical properties of Sn-Bi alloys and mechanisms of ductility improvement
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
-
Doctor Philosophy
Development of ultra low-temperature lead free solder alloys
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
-
Doctor Philosophy
Development of Smart Orthotics for Remote Australia
Associate Advisor
Other advisors: Professor Martin Veidt
-
Doctor Philosophy
Reliable intermetallic bonding for high power and temperature electronics
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
Completed supervision
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2020
Doctor Philosophy
The Interfacial Reactions Between Ga-based Alloys and Common Substrates Used in Microelectronics
Joint Principal Advisor
Other advisors: Professor Kazuhiro Nogita
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2025
Doctor Philosophy
Structure Development and Stability in Sn-Bi Based Solder Alloys
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
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2023
Doctor Philosophy
Functional Concentration Gradients in Copper-Nickel Substrates for Transient Liquid Phase Soldering
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
-
2022
Doctor Philosophy
Development of High-Temperature Sn-Cu Soldering Alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
-
2020
Doctor Philosophy
Phase Transformation Considerations in Manufacturing Reliable Sn-rich Solder Joints
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
-
2019
Doctor Philosophy
Mechanisms of Surface Stability in Al-Zn Coated Steel
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
-
2017
Doctor Philosophy
Mechanisms of hydrogen absorption and desorption in Mg-Ni alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
-
2016
Doctor Philosophy
Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
-
2014
Doctor Philosophy
Phase Formation, Transformation and Stability in Micro-alloyed Sn-based Lead-free Solder Alloys and Joints
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
-
2014
Doctor Philosophy
Eutectic Solidification in Hypo-eutectic Aluminium-Silicon Alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
-
2013
Master Philosophy
Gas evolution and Condensates: Analysis of Gas evolution & Condensates from Greensand Moulds
Associate Advisor
Other advisors: Professor Matthew Dargusch
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2010
Doctor Philosophy
Grain Refinement of Cast Titanium Alloys
Associate Advisor
Other advisors: Professor Matthew Dargusch
Media
Enquiries
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