Overview
Background
Dr McDonald is a graduate of The University of Queensland (UQ) having obtained a Bachelor of Engineering (Manufacturing and Materials) in 1997 and a PhD in Materials Engineering in 2002. He is a currently a Senior Research Fellow in the Nihon Superior Centre for the Manufacture of Electronic Materials (NSCMEM).
His research is in the field of microstructure control through solidification science and in particular on understanding the effect of trace element additions on nucleation and growth phenomena. He has numerous publications and expertise in the areas of:
1. Lead-free Solder Alloys
2. Grain refinement
3. Machining and heat treatment of titanium alloys
4. Mg-based Hydrogen Storage Alloys
5. Casting and Solidification of Al-Si Alloys
6. Eutectic solidification and modification
Availability
- Dr Stuart McDonald is:
- Available for supervision
Fields of research
Qualifications
- Bachelor of Engineering, The University of Queensland
- Doctor of Philosophy, The University of Queensland
Research interests
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Eutectic Modification
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Lead-Free Soldering
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Grain Refinement
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Solidification/Casting
Research impacts
Dr McDonald has established the modifying elements, commonly used to alter the eutectic silicon morphology in Al-Si alloys dramatically alter the size and spatial distribution of individual eutectic colonies or ‘eutectic-grains’. It has since become accepted that research into modification mechanisms must consider the growth velocity of the etuectic interface as it relates to the size and number of eutectic grains.
He has been an advocate for the benefits of both eutectic and primary grain refinement, which can benefit many commercial foundry alloys and has contributed to the growing body of theoretical and computational modeling on eutectic and primary grain refinement. Commercially his research has been recognised with the following Patents.
Patents 1. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, G. Zeng, “Low temperature brazing alloys”, Japanese Patent Application No.2013-183232, 04/09/3013.
2. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, C. M. Gourlay, “Process for producing solder joint with improved reliability”, International Patent Application No: WO/2013/002112, 21/6/2012.
3. T. Nishimura, K. Nogita, S. D. McDonald, J. Read, T. Ventura, “Solder alloy”, International Patent Application No: WO 2012/137901-A1, 11/10/2012.
4. A.K. Dahle, L. Lu, K. Nogita and S.D. McDonald, “Aluminium Casting Alloy”, International Patent Application No: WO 2006/058388, 2/12/2005.
Works
Search Professor Stuart McDonald’s works on UQ eSpace
2019
Journal Article
A new perspective on the nucleation, growth morphology and modification of the silicon phase during the formation of eutectic Al-Si grains
StJohn, David, McDonald, Stuart and Darlapudi, Anilajaram (2019). A new perspective on the nucleation, growth morphology and modification of the silicon phase during the formation of eutectic Al-Si grains. JOM, 71 (1), 391-396. doi: 10.1007/s11837-018-3124-5
2019
Conference Publication
Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflow
Somidin, Flora, McDonald, Stuart, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflow. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012006
2019
Conference Publication
Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates
Abdul Razak, Nurul Razliana, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012008
2019
Conference Publication
Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloys
Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart and Stjohn, David (2019). Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloys. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012009
2019
Conference Publication
Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates
Tan, Xin Fu, Abdul Razak, Nurul Razliana, Husain, Muhammad Hafiz, McDonald, Stuart and Nogita, Kazuhiro (2019). Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019, Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012007
2019
Conference Publication
Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions
Somidin, Flora, McDonald, Stuart D., Ye, Xiaozou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions. 2019 International Conference on Electronics Packaging (ICEP2019), Niigata, Japan, 17-20 April 2019. NEW YORK: Institute of Electrical and Electronics Engineers (IEEE). doi: 10.23919/ICEP.2019.8733594
2018
Journal Article
Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint
Somidin, Flora, Maeno, Hiroshi, Tran, Xuan, McDonald, Stuart D., Mohd Salleh, Mohd, Matsumura, Syo and Nogita, Kazuhiro (2018). Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint. Materials, 11 (11) 2229, 2229. doi: 10.3390/ma11112229
2018
Journal Article
Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni
Mehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart, Yasuda, Hideyuki and St John, David (2018). Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni. Journal of Alloys and Compounds, 766, 1003-1013. doi: 10.1016/j.jallcom.2018.06.251
2018
Journal Article
(Al,Mg)3La: a new phase in the Mg-Al-La system
Wong, Charlotte, Styles, Mark J., Zhu, Suming, Qiu, Dong, McDonald, Stuart D., Zhu, Yuman, Gibson, Mark A., Abbott, Trevor B. and Easton, Mark A. (2018). (Al,Mg)3La: a new phase in the Mg-Al-La system. Acta Crystallographica Section B-Structural Science Crystal Engineering and Materials, 74 (4), 370-375. doi: 10.1107/S205252061800834X
2018
Journal Article
Ga-based alloys in microelectronic interconnects: a review
Liu, Shiqian, Sweatman, Keith, McDonald, Stuart and Nogita, Kazuhiro (2018). Ga-based alloys in microelectronic interconnects: a review. Materials, 11 (8) 1384, 1384. doi: 10.3390/ma11081384
2018
Journal Article
The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: review
Liu, Shiqian, McDonald, Stuart, Sweatman, Keith and Nogita, Kazuhiro (2018). The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: review. Microelectronics Reliability, 84, 170-180. doi: 10.1016/j.microrel.2018.03.038
2018
Journal Article
Effect of trace lanthanum hexaboride and boron additions on microstructure, tensile properties and anisotropy of Ti-6Al-4V produced by additive manufacturing
Bermingham, M. J., McDonald, S. D. and Dargusch, M. S. (2018). Effect of trace lanthanum hexaboride and boron additions on microstructure, tensile properties and anisotropy of Ti-6Al-4V produced by additive manufacturing. Materials Science and Engineering A, 719, 1-11. doi: 10.1016/j.msea.2018.02.012
2018
Journal Article
Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain
Somidin, Flora, Maeno, Hiroshi, Mohd Salleh, M. A.A., Tran, Xuan Quy, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2018). Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain. Materials Characterization, 138, 113-119. doi: 10.1016/j.matchar.2018.02.006
2018
Conference Publication
Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solder
Xuan, Quy Tran, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart D. and Nogita, Kazuhiro (2018). Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solder. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan , 1-2 November 2017 . Zurich, Switzerland : Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.9
2018
Conference Publication
Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bonding
Somidin, Flora, McDonald, Stuart and Nogita, Kazuhiro (2018). Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bonding. Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1-2 November 2017. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.14
2018
Conference Publication
Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction
Qu, Dong Dong, McDonald, Stuart D., Yasuda, Hideyuki, Ohara, Koji, Kohara, Shinji and Nogita, Kazuhiro (2018). Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.101
2018
Conference Publication
Experimental study of the solidification microstructure in the Mg-Rich corner of Mg–Al–Ce system
Wong, Charlotte, Styles, Mark J., Zhu, Suming, Abbott, Trevor, Nogita, Kazuhiro, McDonald, Stuart D., StJohn, David H., Gibson, Mark A. and Easton, Mark A. (2018). Experimental study of the solidification microstructure in the Mg-Rich corner of Mg–Al–Ce system. International Symposium on Magnesium Technology, 2018, Phoenix, AZ, USA, March 11, 2018-March 15, 2018. Springer International Publishing. doi: 10.1007/978-3-319-72332-7_13
2018
Conference Publication
The interaction of Sn-Ga alloys and Au coated Cu substrates
Liu, Shi Qian, Qu, Dong Dong, McDonald, Stuart D. and Nogita, Kazuhiro (2018). The interaction of Sn-Ga alloys and Au coated Cu substrates. 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1 - 2 November 2017. Pfaffikon, Switzerland: Scientific.Net. doi: 10.4028/www.scientific.net/SSP.273.3
2018
Conference Publication
The challenges associated with the formation of equiaxed grains during additive manufacturing of titanium alloys
StJohn, David H., McDonald, Stuart D., Bermingham, Michael J., Mereddy, Sri, Prasad, Arvind and Dargusch, Matthew (2018). The challenges associated with the formation of equiaxed grains during additive manufacturing of titanium alloys. 4th International Conference on Powder Metallurgy of Titanium, PMTi 2017, Xian, China, 8-10 September 2017. Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/KEM.770.155
2018
Conference Publication
Effect of reflow conditions on the intermetallic layer in solder joints
Nogita, K., Somidin, F., Mohd Salleh, M. A.A., Sweatman, K., Nishimura, T., McDonald, S. D., Maeno, H. and Matsumura, S. (2018). Effect of reflow conditions on the intermetallic layer in solder joints. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kuwana, Mie, Japan, 17 - 21 April 2018. Japan: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2018.8374678
Supervision
Availability
- Dr Stuart McDonald is:
- Available for supervision
Before you email them, read our advice on how to contact a supervisor.
Supervision history
Current supervision
-
Doctor Philosophy
Development of Sn-Bi based low temperature lead-free solder alloys
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
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Doctor Philosophy
Development of Smart Orthotics for Remote Australia
Associate Advisor
Other advisors: Professor Martin Veidt
-
Doctor Philosophy
Characterisation of Foot Biomechanics through Smart Insole and High Speed Camera
Associate Advisor
Other advisors: Professor Martin Veidt
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Doctor Philosophy
Al-Ni alloys for use as a novel brazing material for joining Al with dissimilar metals
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
-
Doctor Philosophy
Mechanical properties of Sn-Bi alloys and mechanisms of ductility improvement
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
Completed supervision
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2020
Doctor Philosophy
The Interfacial Reactions Between Ga-based Alloys and Common Substrates Used in Microelectronics
Joint Principal Advisor
Other advisors: Professor Kazuhiro Nogita
-
2025
Doctor Philosophy
Structure Development and Stability in Sn-Bi Based Solder Alloys
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
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2023
Doctor Philosophy
Functional Concentration Gradients in Copper-Nickel Substrates for Transient Liquid Phase Soldering
Associate Advisor
Other advisors: Dr Xin Fu Tan, Professor Kazuhiro Nogita
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2022
Doctor Philosophy
Development of High-Temperature Sn-Cu Soldering Alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
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2020
Doctor Philosophy
Phase Transformation Considerations in Manufacturing Reliable Sn-rich Solder Joints
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
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2019
Doctor Philosophy
Mechanisms of Surface Stability in Al-Zn Coated Steel
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
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2017
Doctor Philosophy
Mechanisms of hydrogen absorption and desorption in Mg-Ni alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
-
2016
Doctor Philosophy
Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
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2014
Doctor Philosophy
Eutectic Solidification in Hypo-eutectic Aluminium-Silicon Alloys
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
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2014
Doctor Philosophy
Phase Formation, Transformation and Stability in Micro-alloyed Sn-based Lead-free Solder Alloys and Joints
Associate Advisor
Other advisors: Professor Kazuhiro Nogita
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2013
Master Philosophy
Gas evolution and Condensates: Analysis of Gas evolution & Condensates from Greensand Moulds
Associate Advisor
Other advisors: Professor Matthew Dargusch
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2010
Doctor Philosophy
Grain Refinement of Cast Titanium Alloys
Associate Advisor
Other advisors: Professor Matthew Dargusch
Media
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