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2015 Conference Publication Hemp hurd flour as an alternative low cost filler in wood plastic compositesHeitzmann, Michael T., Ali, Afifah Md, Legras, Angelica, Vandi, Luigi J. and Milne, John (2015). Hemp hurd flour as an alternative low cost filler in wood plastic composites. International Conference on Performance-based and Life-cycle Structural Engineering, Brisbane, QLD, Australia, 9-11 December 2015. Brisbane, QLD, Australia: School of Civil Engineering, The University of Queensland. doi: 10.14264/uql.2016.419 |
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2015 Conference Publication Generation of a short fibre biocomposite representative volume elementThomas, Kelli L., Bryce, Holly C. A. and Heitzmann, Michael T. (2015). Generation of a short fibre biocomposite representative volume element. International Conference on Performance-based and Life-cycle Structural Engineering, Brisbane, QLD, Australia, 9-11 December 2015. Brisbane, QLD, Australia: School of Civil Engineering, The University of Queensland. doi: 10.14264/uql.2016.500 |
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2015 Conference Publication GFRP-to-timber bonded joints: Adhesive selectionMiao, Chuang, Fernando, Dilum, Bailleres, Henri and Heitzmann, Michael (2015). GFRP-to-timber bonded joints: Adhesive selection. International Institute for FRP in Construction (IIFC). |
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2015 Conference Publication Comparison of experimental and calculated tensile properties of flax fibresSoatthiyanon, Niphaphun, Crosky, Alan and Heitzmann, Michael T. (2015). Comparison of experimental and calculated tensile properties of flax fibres. International Conference on Performance-based and Life-cycle Structural Engineering, Brisbane, QLD, Australia, 9-11 December 2015. Brisbane, QLD, Australia: School of Civil Engineering, The University of Queensland. doi: 10.14264/uql.2016.423 |
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2014 Conference Publication Modelling squeeze flow of viscous polymer meltsShelley, Tristan J., Liu, Xiaolin, Veidt, Martin, Heitzmann, Michael and Paton, Rowan (2014). Modelling squeeze flow of viscous polymer melts. ECFD VI: 6th European Conference on Computational Fluid Dynamics 2014, Barcelona, Spain, 20-25 July, 2014. Barcelona, Spain: International Center for Numerical Methods in Engineering (CIMNE). |
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2014 Conference Publication Optimisation of the twin-screw compounding process for short fibre biocompositesLegras, A., Truss, R., Rao, S., Bhattacharyya, D., Soatthiyanon, N., Crosky, A. and Heitzmann, M. (2014). Optimisation of the twin-screw compounding process for short fibre biocomposites. Composites Australia and CRC-ACS Conference, Newcastle, NSW, Australia, 7-9 April 2014. Hawthorn, VIC, Australia: Composites Australia. |
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2012 Conference Publication Interface diffusion and morphology of aerospace grade epoxy co-cured with thermoplastic polymersVandi, Luigi-Jules, Hou, Meng, Veidt, Martin, Truss, Rowan W., Heitzmann, M. and Paton, R. (2012). Interface diffusion and morphology of aerospace grade epoxy co-cured with thermoplastic polymers. 28th International Congress of the Aeronautical Sciences (ICAS 2012), Brisbane, Australia, 23-28 September 2012. [London], U.K.: International Council of the Aeronautical Sciences (ICAS). |
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2012 Conference Publication Bond surface analysis using Fourier Transform Infrared Spectroscopy (FTIR) and X-Ray Photoelectron Spectroscopy (XPS)Virk, Amandeep, Vandi, Luigi-Jules, Meeuwissen, Marieke and Heitzmann, Michael (2012). Bond surface analysis using Fourier Transform Infrared Spectroscopy (FTIR) and X-Ray Photoelectron Spectroscopy (XPS). Diversity in Composites 2012 Conference, Blue Mountains, NSW, Australia, 15-16 March 2012. Hawthorn, VIC, Australia: Composites Australia. |
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2011 Conference Publication Measurements of interface fracture strength between fiber-reinforced composite laminates and thin surface films using the blister testHeitzmann, Michael T., Hou, Meng, Veidt, Martin and Paton, Rowan (2011). Measurements of interface fracture strength between fiber-reinforced composite laminates and thin surface films using the blister test. 8th International Conference on Composite Science and Technology (ICCST8), Kuala Lumpur, Malaysia, 22-24 March 2011. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/KEM.471-472.315 |
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2010 Conference Publication Numeric analysis of the shaft loaded blister test: Influence of nonlinearities on analytic solutionHeitzmann, Michael, Hou, Meng, Veidt, Martin and Falzon, Paul (2010). Numeric analysis of the shaft loaded blister test: Influence of nonlinearities on analytic solution. 6th Australasian Congress on Applied Mechanics (ACAM 6), Perth, Australia, 12-15 December 2010. Perth, Australia: Engineers Australia. |
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2009 Conference Publication The effect of process parameters on electrical properties of high density through-Si viasLeduc, Patrick, Assous, Myriam, Bouchu, David, Roman, Antonio, Heitzmann, Michel, Charlet, Barbara, Cioccio, Lea Di, Zussy, Marc, Mage, Lucile, Vandroux, Laurent, Deronzier, Emmanuel, Roule, Anne, Haumesser, Paul-Henri and Sillon, Nicolas (2009). The effect of process parameters on electrical properties of high density through-Si vias. |
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1991 Conference Publication Improvement in dry etching of tungsten featuresHeitzmann, Michel, Laporte, Philippe and Tabouret, Evelyne (1991). Improvement in dry etching of tungsten features. Publ by Int Soc for Optical Engineering. |
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1991 Conference Publication A fully scaled 0.5 μm CMOS process for fast random logicLerme, M., Guegan, G., Deléonibus, S., Martin, F., Heitzmann, M., Vinet, F., Jaffard, C., Belleville, M., Guerin, M., Reimbold, G. and Leroux, C. (1991). A fully scaled 0.5 μm CMOS process for fast random logic. IEEE Computer Society. |
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1991 Conference Publication A 0.35 mu m CMOS process for fast random logicGuegan, G., Lerme, M., Deleonibus, S., Martin, F., Heitzmann, M., Tedesco, S., Guerin, M., Reimbold, G., Leroux, C., Jaffard, C. and Belleville, M. (1991). A 0.35 mu m CMOS process for fast random logic. Institute of Electrical and Electronics Engineers Inc.. doi: 10.1109/IEDM.1991.235413 |
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1989 Conference Publication Field transistors electrical behaviour in double level aluminum interconnect processesDeleonibus, S., Arena, C., Heitzmann, M., Martin, F., Lajzerowicz, J. and Vinet, F. (1989). Field transistors electrical behaviour in double level aluminum interconnect processes. Publ by IEEE. |
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1989 Conference Publication Comparison between different intermetallic dielectric processes and consequences on field transistor behaviourDeleonibus, S., Arena, C., Heitzmann, M., Martin, F., Lajzerowicz, J. and Vinet, F. (1989). Comparison between different intermetallic dielectric processes and consequences on field transistor behaviour. IEEE Computer Society. doi: 10.1007/978-3-642-52314-4_139 |
