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2022 Journal Article Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a reviewZeng, Guang, Liu, Shiqian, Gu, Qinfen, Zheng, Zebang, Yasuda, Hideyuki, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a review. Acta Metallurgica Sinica, 35 (1), 49-66. doi: 10.1007/s40195-021-01350-x |
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2021 Journal Article Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regimeMehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart D., Yasuda, Hideyuki and StJohn, David H. (2021). Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime. Acta Materialia, 220 117295, 1-11. doi: 10.1016/j.actamat.2021.117295 |
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2021 Journal Article Rapid fabrication of tin-copper anodes for lithium-ion battery applicationsTan, Xin Fu, Belyakov, Sergey A., Su, Te-Cheng, Gu, Qinfen, Liu, Shiqian, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Hideyuki, Matsumura, Syo and Nogita, Kazuhiro (2021). Rapid fabrication of tin-copper anodes for lithium-ion battery applications. Journal of Alloys and Compounds, 867 159031, 159031. doi: 10.1016/j.jallcom.2021.159031 |
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2021 Journal Article Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi jointsLiu, Shiqian, Tan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2021). Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi joints. Intermetallics, 133 107168, 1-9. doi: 10.1016/j.intermet.2021.107168 |
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2021 Journal Article In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiographyAbdul Razak, N.R., Tan, X.F., Somidin, F., Yasuda, H., McDonald, S.D. and Nogita, K. (2021). In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography. Materials Letters, 291 129520, 1-4. doi: 10.1016/j.matlet.2021.129520 |
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2021 Journal Article Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu3Sn phase in Sn-10 wt.%Cu AlloysMehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart D., Yasuda, Hideyuki and StJohn, David H. (2021). Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu3Sn phase in Sn-10 wt.%Cu Alloys. Journal of Electronic Materials, 50 (3), 881-892. doi: 10.1007/s11664-020-08709-3 |
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2020 Journal Article A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La systemKim, Manjin, McDonald, Stuart D., Abbott, Trevor B., Easton, Mark A., Ali, Yahia, StJohn, David H. and Nogita, Kazuhiro (2020). A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La system. Journal of Alloys and Compounds, 844 156068, 156068. doi: 10.1016/j.jallcom.2020.156068 |
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2020 Journal Article Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applicationsTan, Xin F., Gu, Qinfen, Qu, Dongdong, Yong, Adrian X.B., Yang, Wenhui, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2020). Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications. Acta Materialia, 201, 341-349. doi: 10.1016/j.actamat.2020.10.011 |
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2020 Journal Article The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodesTan, Xin Fu, Yong, Adrian Xiao Bin, Gu, Qinfen, Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2020). The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodes. Journal of Nanoscience and Nanotechnology, 20 (8), 5182-5191. doi: 10.1166/jnn.2020.18538 |
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2020 Journal Article Effect of Na and cooling rate on the activation of Mg-Ni alloys for hydrogen storageKim, Manjin, McDonald, Stuart D., Ali, Yahia, Abbott, Trevor and Nogita, Kazuhiro (2020). Effect of Na and cooling rate on the activation of Mg-Ni alloys for hydrogen storage. Journal of Nanoscience and Nanotechnology, 20 (8), 5192-5200. doi: 10.1166/jnn.2020.18529 |
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2020 Journal Article Intermetallic formation mechanisms and properties in room-temperature Ga solderingLiu, Shiqian, Qu, Dongdong, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Intermetallic formation mechanisms and properties in room-temperature Ga soldering. Journal of Alloys and Compounds, 826 154221, 154221. doi: 10.1016/j.jallcom.2020.154221 |
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2020 Journal Article On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrateQu, D.D., Gear, M., Setargew, N., Renshaw, W., McDonald, S., StJohn, D., Paterson, D.J. and Nogita, K. (2020). On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrate. Materialia, 11 100669, 100669. doi: 10.1016/j.mtla.2020.100669 |
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2020 Journal Article Interfacial reactions between Ga and Cu-10Ni substrate at low temperatureLiu, Shiqian, Zeng, Guang, Yang, Wenhui, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Interfacial reactions between Ga and Cu-10Ni substrate at low temperature. ACS Applied Materials and Interfaces, 12 (18) acsami.0c02032, 21045-21056. doi: 10.1021/acsami.0c02032 |
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2020 Journal Article Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profileSomidin, Flora, McDonald, Stuart David, Ye, Xiaozhou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profile. Japan Institute of Electronics Packaging. Transactions, 13, E19-004. doi: 10.5104/jiepeng.13.e19-004-1 |
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2020 Journal Article Titanium sponge as a source of native nuclei in titanium alloysTedman-Jones, S.N., Bermingham, M.J., McDonald, S.D., StJohn, D.H. and Dargusch, M.S. (2020). Titanium sponge as a source of native nuclei in titanium alloys. Journal of Alloys and Compounds, 818 153353, 153353. doi: 10.1016/j.jallcom.2019.153353 |
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2020 Journal Article Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compoundsSomidin, Flora, Maeno, Hiroshi, Toriyama, Takaaki, McDonald, Stuart D., Yang, Wenhui, Matsumura, Syo and Nogita, Kazuhiro (2020). Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compounds. Materialia, 9 100530, 100530. doi: 10.1016/j.mtla.2019.100530 |
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2020 Journal Article Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room TemperatureLiu, Shiqian, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, Sweatman, Keith, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature. Journal of Electronic Materials, 49 (1), 128-139. doi: 10.1007/s11664-019-07688-4 |
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2019 Journal Article Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodesTan, Xin F., Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodes. ACS Applied Energy Materials, 3 (1) acsaem.9b02014, 141-145. doi: 10.1021/acsaem.9b02014 |
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2019 Journal Article The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodesTan, Xin F., McDonald, Stuart D., Gu, Qinfen, Wang, Lianzhou, Matsumura, Syo and Nogita, Kazuhiro (2019). The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes. Journal of Power Sources, 440 227085, 227085. doi: 10.1016/j.jpowsour.2019.227085 |
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2019 Journal Article Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reactionLiu, Shiqian, Yang, Wenhui, Kawami, Youichirou, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, McDonald, Stuart and Nogita, Kazuhiro (2019). Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reaction. ACS Applied Materials and Interfaces, 11 (35) acsami.9b10630, 32523-32532. doi: 10.1021/acsami.9b10630 |
