Systematic investigations of low temperature Sn-Bi based solder alloys (2023-2025)
Abstract
The project aims to reduce the temperatures used in the manufacture of electronic circuitry through the development of Sn-Bi alloys for low temperature assembly processes without compromising productivity or reliability. The project will use a range of innovative solidification and microstructure development techniques to obtain an understanding of the dynamic processes of precipitation, dissolution and microstructure evolution that occur in these alloys during manufacture and application. The outcomes include a reduction in the energy consumed in electronic assembly processes and a capacity to manufacture advanced circuitry based on nextgeneration temperature-sensitive components and substrates without compromising reliability.
