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2023 Journal Article Strategies to enhance hydrogen storage performances in bulk Mg-based hydridesTan, Xin F., Kim, Manjin, Yasuda, Kazuhiro and Nogita, Kazuhiro (2023). Strategies to enhance hydrogen storage performances in bulk Mg-based hydrides. Journal of Materials Science and Technology, 153, 139-158. doi: 10.1016/j.jmst.2022.12.054 |
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2023 Journal Article Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloysYao, Hu, Zeng, Guang, Tan, Xin F., Gu, Qinfen, Nogita, Kazuhiro, Guo, Jing and Li, Qian (2023). Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloys. Journal of Materials Science and Technology, 151, 162-177. doi: 10.1016/j.jmst.2022.12.015 |
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2023 Journal Article The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloysTan, Xin F., Hao, Qichao, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Bermingham, Michael and Nogita, Kazuhiro (2023). The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys. Materials Characterization, 201 112934, 1-11. doi: 10.1016/j.matchar.2023.112934 |
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2023 Journal Article The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloysZhou, Jiye, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2023). The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys. JOM, 75 (8), 3149-3161. doi: 10.1007/s11837-023-05870-y |
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2023 Conference Publication Controlling porosity during transient liquid phase bonding for high-temperature soldering processesAbdul Razak, Nurul R., Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffery, Nishimura, Tetsuro and Nogita, Kazuhiro (2023). Controlling porosity during transient liquid phase bonding for high-temperature soldering processes. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129722 |
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2023 Conference Publication Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy studyTan, Xin F., Zhou, Jiye, McDonald, Stuart D., Ikeda, Masahiko and Nogita, Kazuhiro (2023). Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study. International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129743 |
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2023 Conference Publication The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%BiYe, Xiaozhou, Tao, Lei, McDonald, Stuart D., Tan, Xin Fu, Sweatman, Keith and Nogita, Kazuhiro (2023). The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129707 |
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2022 Journal Article Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic jointsZhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints. Materials, 15 (23) 8321, 1-12. doi: 10.3390/ma15238321 |
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2022 Journal Article Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storageTan, Xin F., Kim, Manjin, Gu, Qinfen, Pinzon Piraquive, Julio, Zeng, Guang, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage. Journal of Power Sources, 538 231538, 231538. doi: 10.1016/j.jpowsour.2022.231538 |
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2022 Journal Article Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by MgTan, C. Y., Salleh, M.A.A. Mohd, Tan, X. F., Yasuda, H., Saud, N., Ramli, M. I.I. and Nogita, K. (2022). Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg. Materials Today Communications, 31 103221, 103221. doi: 10.1016/j.mtcomm.2022.103221 |
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2022 Journal Article Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder jointAbdul Razak, N. R., Tan, X. F., Mohd Salleh, M. A. A., McDonald, S. D., Bermingham, M. J., Yasuda, H. and Nogita, K. (2022). Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint. Materials Today Communications, 31 103248, 103248. doi: 10.1016/j.mtcomm.2022.103248 |
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2022 Journal Article Cobalt‐doped Cu6Sn5 lithium‐ion battery anodes with enhanced electrochemical propertiesTan, Xin F., Tao, Shiwei, Ran, Lingbing, Knibbe, Ruth and Nogita, Kazuhiro (2022). Cobalt‐doped Cu6Sn5 lithium‐ion battery anodes with enhanced electrochemical properties. Nano Select, 3 (8), 1264-1276. doi: 10.1002/nano.202200056 |
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2022 Journal Article Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption processKim, Manjin, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D., Ali, Yahia, Matsumura, Syo and Nogita, Kazuhiro (2022). Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process. International Journal of Hydrogen Energy, 47 (36), 16132-16143. doi: 10.1016/j.ijhydene.2022.03.102 |
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2022 Journal Article Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature solderingTan, Xin F., Gu, Qinfen, Bermingham, Michael, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering. Acta Materialia, 226 117661. doi: 10.1016/j.actamat.2022.117661 |
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2022 Journal Article Evaluation of silicon effects on abrasion performance, microstructure and crystalline structure of NiHard-4 white cast iron using synchrotron X-ray diffractionJokari-Sheshdeh, Maziar, Ali, Yahia, Nué, Charline Le, Gallo, Santiago Corujeira, Tan, Xin Fu, Lin, Weikang and Gates, J.D. (2022). Evaluation of silicon effects on abrasion performance, microstructure and crystalline structure of NiHard-4 white cast iron using synchrotron X-ray diffraction. Materialia, 21 101332, 101332. doi: 10.1016/j.mtla.2022.101332 |
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2022 Journal Article The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloysHao, Qichao, Tan, Xin F., Gu, Qinfen, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2022). The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys. JOM, 74 (4), 1739-1750. doi: 10.1007/s11837-021-05145-4 |
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2022 Journal Article Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5Yang, Wenhui, Tran, Xuan Quy, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Tan, Xin Fu, Kawami, Youichirou, Nogita, Kazuhiro and Matsumura, Syo (2022). Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5. Acta Materialia, 224 117513, 117513. doi: 10.1016/j.actamat.2021.117513 |
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2022 Journal Article In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopyTan, Xin F., Somidin, Flora, McDonald, Stuart D., Bermingham, Michael J., Maeno, Hiroshi, Matsumura, Syo and Nogita, Kazuhiro (2022). In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy. Materials, 15 (2) 510, 510. doi: 10.3390/ma15020510 |
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2022 Conference Publication Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solderHao, Qichao, Tan, Xin Fu, McDonald, Stuart D., Sweatman, Keith, Nishimura, Takatoshi, Nishimura, Tetsuro and Nogita, Kazuhiro (2022). Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795406 |
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2021 Journal Article Rapid fabrication of tin-copper anodes for lithium-ion battery applicationsTan, Xin Fu, Belyakov, Sergey A., Su, Te-Cheng, Gu, Qinfen, Liu, Shiqian, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Hideyuki, Matsumura, Syo and Nogita, Kazuhiro (2021). Rapid fabrication of tin-copper anodes for lithium-ion battery applications. Journal of Alloys and Compounds, 867 159031, 159031. doi: 10.1016/j.jallcom.2021.159031 |
