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2025 Journal Article Growth crystallography and in-situ imaging of nucleation and growth dynamics of Al8Mn5 solidifying in AZ magnesium alloysWang, D., Zeng, G., Xian, J.W., Nogita, K., Yasuda, H. and Gourlay, C.M. (2025). Growth crystallography and in-situ imaging of nucleation and growth dynamics of Al8Mn5 solidifying in AZ magnesium alloys. Acta Materialia, 296 121168. doi: 10.1016/j.actamat.2025.121168 |
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2025 Journal Article Role of Ag additions on microstructure, phase transformation and thermal reactions of In-35Sn alloysTan, Y. P., Mohd Salleh, M. A. A., Sauli, Z., Somidin, F., Kamonsuangkasem, K., Tancharakorn, S., Tantanuch, W., Nakajima, H. and Nogita, K. (2025). Role of Ag additions on microstructure, phase transformation and thermal reactions of In-35Sn alloys. Journal of Materials Science: Materials in Electronics, 36 (25) 1649, 25. doi: 10.1007/s10854-025-15749-0 |
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2025 Journal Article In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron MicroscopyNogita, Kazuhiro, Tan, Xin Fu, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith, Somidin, Flora, Zeng, Guang, Maeno, Hiroshi, Yasuda, Kazuhiro and Gourlay, Christopher M. (2025). In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy. Materials, 18 (16) 3925, 3925. doi: 10.3390/ma18163925 |
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2025 Journal Article Unlocking Superplasticity and Enhanced Strength in Ultra-Low Temperature In-Sn-Bi Solder Alloys via Dynamic Microstructure EngineeringZhou, Jiye, Tan, Xin F., Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2025). Unlocking Superplasticity and Enhanced Strength in Ultra-Low Temperature In-Sn-Bi Solder Alloys via Dynamic Microstructure Engineering. Materials Science and Engineering: A, 944 148897, 148897-944. doi: 10.1016/j.msea.2025.148897 |
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2025 Journal Article Fast activation of Na micro-alloyed Mg–Ni-Gd-Y-Zn-Cu alloys for solid-state hydrogen storageYao, Hu, Tan, Xin F., Sun, Wei, Gu, Qinfen, Qin, Junjie, Zhang, Yonghong, Zeng, Guang, Guo, Enyu and Nogita, Kazuhiro (2025). Fast activation of Na micro-alloyed Mg–Ni-Gd-Y-Zn-Cu alloys for solid-state hydrogen storage. International Journal of Hydrogen Energy, 118, 237-250. doi: 10.1016/j.ijhydene.2025.03.146 |
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2025 Journal Article The effect of gallium addition on the microstructure and superconducting properties of In-Bi-Sn solder alloysZhou, Jiye, Shahbazi, Mahboobeh, Poitras, Jordan T., Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2025). The effect of gallium addition on the microstructure and superconducting properties of In-Bi-Sn solder alloys. Journal of Electronic Materials, 54 (4), 2628-2637. doi: 10.1007/s11664-024-11584-x |
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2025 Journal Article Effect of Sr addition on the microstructure and fluidity of hypoeutectic Al-Ni alloyHari, Vigneshwar, McDonald, Stuart, Qu, Dongdong, Tan, Xin Fu, Xu, Dong, Tong, Zherui and Nogita, Kazuhiro (2025). Effect of Sr addition on the microstructure and fluidity of hypoeutectic Al-Ni alloy. Journal of Alloys and Compounds, 1016 178842, 1-10. doi: 10.1016/j.jallcom.2025.178842 |
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2025 Journal Article Thermal Stability of Bi in Sn-Cu and Sn-Ag-Cu Based High Strength Pb-free Solder AlloysZhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2025). Thermal Stability of Bi in Sn-Cu and Sn-Ag-Cu Based High Strength Pb-free Solder Alloys. Transactions of The Japan Institute of Electronics Packaging, 18, E24-006. doi: 10.5104/jiepeng.18.e24-006-1 |
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2024 Journal Article Cu-atom locations in rocksalt SnTe thermoelectric alloyKawami, Youichirou, Tran, Xuan Quy, Yamamoto, Tomokazu, Yoshioka, Satoru, Murakami, Yasukazu, Matsumura, Syo, Nogita, Kazuhiro and Zou, Jin (2024). Cu-atom locations in rocksalt SnTe thermoelectric alloy. Advanced Materials, 36 (47) 2410508, 1-16. doi: 10.1002/adma.202410508 |
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2024 Journal Article The effect of in concentration and temperature on dissolution and precipitation in Sn–Bi alloysHao, Qichao, Tan, Xinfu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2024). The effect of in concentration and temperature on dissolution and precipitation in Sn–Bi alloys. Materials, 17 (17) 4372, 1-17. doi: 10.3390/ma17174372 |
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2024 Journal Article Phase transformations and mechanical properties in In–Bi–Sn alloys as a result of low-temperature storageZhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2024). Phase transformations and mechanical properties in In–Bi–Sn alloys as a result of low-temperature storage. Materials, 17 (15) 3669, 3669. doi: 10.3390/ma17153669 |
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2024 Journal Article Characterisation of Fe distribution in the liquid–solid boundary of Al–Zn–Mg–Si alloy using synchrotron X-ray fluorescence microscopyTian, He, Qu, Dongdong, Setargew, Nega, Parker, Daniel J., Paterson, David J., StJohn, David and Nogita, Kazuhiro (2024). Characterisation of Fe distribution in the liquid–solid boundary of Al–Zn–Mg–Si alloy using synchrotron X-ray fluorescence microscopy. Materials, 17 (14) 3583, 1-17. doi: 10.3390/ma17143583 |
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2024 Journal Article Effects of vanadium on the properties of Sn-3wt%Ag-5wt%Cu solder alloyTan, C. Y., Mohd Salleh, M. A.A., Saud, N., Nishimura, T. and Nogita, K. (2024). Effects of vanadium on the properties of Sn-3wt%Ag-5wt%Cu solder alloy. Journal of Materials Science: Materials in Electronics, 35 (20) 1408, 1-12. doi: 10.1007/s10854-024-13164-5 |
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2024 Journal Article Characterization of Solidification and Microstructure of an Al-Zn-Mg-Si AlloyTian, He, Qu, Dongdong, Tong, Zherui, Setargew, Nega, Parker, Daniel J., StJohn, David and Nogita, Kazuhiro (2024). Characterization of Solidification and Microstructure of an Al-Zn-Mg-Si Alloy. Corrosion Science and Technology, 23 (2), 104-112. doi: 10.14773/CST.2024.23.2.104 |
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2024 Journal Article In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloysTan, Xin F., Hao, Qichao, Zhou, Jiye, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Ikeda, Masahiko, Yasuda, Kazuhiro, Bermingham, Michael J. and Nogita, Kazuhiro (2024). In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys. Materialia, 33 101974, 1-12. doi: 10.1016/j.mtla.2023.101974 |
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2024 Journal Article Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloysHao, Qichao, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1223-1238. doi: 10.1007/s11664-023-10850-8 |
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2024 Journal Article Controlling pore position during transient liquid phase bonding for high-temperature soldering processesRazak, N. R. Abdul, Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffrey, Nishimura, Tetsuro and Nogita, Kazuhiro (2024). Controlling pore position during transient liquid phase bonding for high-temperature soldering processes. Transactions of The Japan Institute of Electronics Packaging, 17 E23-009. doi: 10.5104/jiepeng.17.e23-009-1 |
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2024 Journal Article The effect of temperature on the electrical resistivity of Sn-Bi alloysTan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). The effect of temperature on the electrical resistivity of Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1183-1191. doi: 10.1007/s11664-023-10849-1 |
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2023 Journal Article In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiographyHao, Qichao, Tan, Xin Fu, Liu, Shiqian, McDonald, Stuart D., Yasuda, Hideyuki and Nogita, Kazuhiro (2023). In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography. ACS Applied Electronic Materials, 5 (12), 7004-7014. doi: 10.1021/acsaelm.3c01383 |
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2023 Journal Article Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflowsChang, M.S., Mohd Salleh, M.A.A., Halin, D.S.C., Somidin, F., Yasuda, H. and Nogita, K. (2023). Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows. Journal of Materials Research and Technology, 26, 8670-8687. doi: 10.1016/j.jmrt.2023.09.139 |
