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2019 Journal Article Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collectorTan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Hu, Yuxiang, Wang, Lianzhou, Matsumura, Syo, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collector. Journal of Power Sources, 415, 50-61. doi: 10.1016/j.jpowsour.2019.01.034 |
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2019 Journal Article Experimental determination of the Sn-Cu-Ni phase diagram for Pb-free solder applicationsHenao, Hector M., Chu, Ching-shun, Solis, Juan P. and Nogita, Kazuhiro (2019). Experimental determination of the Sn-Cu-Ni phase diagram for Pb-free solder applications. Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science, 50 (1), 502-516. doi: 10.1007/s11663-018-1456-8 |
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2019 Journal Article Relationship between free solder thickness to the solderability of Sn–0.7Cu–0.05Ni solder coating during solderingRamli, M.I.I., Mohd Salleh, M.A.A., Mohd Sobri, F. A., Narayanan, P., Sweatman, K. and Nogita, K. (2019). Relationship between free solder thickness to the solderability of Sn–0.7Cu–0.05Ni solder coating during soldering. Journal of Materials Science: Materials in Electronics, 30 (4), 3669-3677. doi: 10.1007/s10854-018-00647-5 |
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2019 Journal Article Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compoundYang, Wenhui, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Nogita, Kazuhiro and Matsumura, Syo (2019). Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compound. Scripta Materialia, 158, 1-5. doi: 10.1016/j.scriptamat.2018.08.020 |
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2019 Journal Article Al8Mn5 particle settling and interactions with oxide films in liquid AZ91 magnesium alloysPeng, L., Zeng, G., Su, T. C., Yasuda, H., Nogita, K. and Gourlay, C. M. (2019). Al8Mn5 particle settling and interactions with oxide films in liquid AZ91 magnesium alloys. JOM, 71 (7), 2235-2244. doi: 10.1007/s11837-019-03471-2 |
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2018 Journal Article Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder jointSomidin, Flora, Maeno, Hiroshi, Tran, Xuan, McDonald, Stuart D., Mohd Salleh, Mohd, Matsumura, Syo and Nogita, Kazuhiro (2018). Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint. Materials, 11 (11) 2229, 2229. doi: 10.3390/ma11112229 |
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2018 Journal Article Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05NiXian, J. W., Mohd Salleh, M. A.A., Belyakov, S. A., Su, T. C., Zeng, G., Nogita, K., Yasuda, H. and Gourlay, C. M. (2018). Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni. Intermetallics, 102, 34-45. doi: 10.1016/j.intermet.2018.08.002 |
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2018 Journal Article Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of NiMehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart, Yasuda, Hideyuki and St John, David (2018). Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni. Journal of Alloys and Compounds, 766, 1003-1013. doi: 10.1016/j.jallcom.2018.06.251 |
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2018 Journal Article The Role of Nickel in Solder Alloys - Part 1. The Effect of Ni on The Behaviour of Sn-0.7Cu in Soldering and Coating ProcessesNogita, Kazuhiro, Sweatman, Keith and Nishimura, Tetsuro (2018). The Role of Nickel in Solder Alloys - Part 1. The Effect of Ni on The Behaviour of Sn-0.7Cu in Soldering and Coating Processes. SMTA International, 20 (1). doi: 10.37665/smfzlxt20496 |
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2018 Journal Article The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial Intermetallic in Sn-Based/Cu Substrate Solder JointsNogita, Kazuhiro, Sweatman, Keith and Nishimura, Tetsuro (2018). The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial Intermetallic in Sn-Based/Cu Substrate Solder Joints. SMTA International, 20 (1). doi: 10.37665/smpgqbo13686 |
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2018 Journal Article Ga-based alloys in microelectronic interconnects: a reviewLiu, Shiqian, Sweatman, Keith, McDonald, Stuart and Nogita, Kazuhiro (2018). Ga-based alloys in microelectronic interconnects: a review. Materials, 11 (8) 1384, 1384. doi: 10.3390/ma11081384 |
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2018 Journal Article The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: reviewLiu, Shiqian, McDonald, Stuart, Sweatman, Keith and Nogita, Kazuhiro (2018). The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: review. Microelectronics Reliability, 84, 170-180. doi: 10.1016/j.microrel.2018.03.038 |
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2018 Journal Article Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grainSomidin, Flora, Maeno, Hiroshi, Mohd Salleh, M. A.A., Tran, Xuan Quy, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2018). Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain. Materials Characterization, 138, 113-119. doi: 10.1016/j.matchar.2018.02.006 |
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2018 Journal Article PrefaceNogita, Kazuhiro, Mohd Salleh, Mohd Arif Anuar, Abdullah, Mohd Mustafa Al Bakri, Jamaludin, Liyana and Mohd Tahir, Muhammad Faheem (2018). Preface. Solid State Phenomena, 273 SSP |
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2017 Journal Article Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and beta SnXian, J. W., Zeng, G., Belyakov, S. A., Gu, Q., Nogita, K. and Gourlay, C. M. (2017). Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and beta Sn. Intermetallics, 91, 50-64. doi: 10.1016/j.intermet.2017.08.002 |
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2017 Journal Article Reply to 'Comments on "evidence of the hydrogen release mechanism in bulk MgH2"'Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro and Matsumura, Syo (2017). Reply to 'Comments on "evidence of the hydrogen release mechanism in bulk MgH2"'. Scientific Reports, 7 (1) 43720, 1-3. doi: 10.1038/srep43720 |
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2017 Journal Article Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substratesMohd Salleh, M. A. A., McDonald, S. D. and Nogita, K. (2017). Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates. Journal of Materials Processing Technology, 242, 235-245. doi: 10.1016/j.jmatprotec.2016.11.031 |
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2017 Journal Article Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnectionsXian, J. W., Belyakov, S. A., Ollivier, M., Nogita, K., Yasuda, H. and Gourlay, C. M. (2017). Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections. Acta Materialia, 126, 540-551. doi: 10.1016/j.actamat.2016.12.043 |
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2017 Journal Article In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Yamamoto, Tomokazu, Shigematsu, Koji, Aso, Kohei, Tanaka, Eishi, Matsumura, Syo and Nogita, Kazuhiro (2017). In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4. Journal of Power Sources, 341, 130-138. doi: 10.1016/j.jpowsour.2016.11.105 |
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2017 Journal Article In situ imaging of microstructure formation in electronic interconnectionsSalleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D. and Nogita, K. (2017). In situ imaging of microstructure formation in electronic interconnections. Scientific Reports, 7 (1) 40010, 40010. doi: 10.1038/srep40010 |
