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2012 Journal Article Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallicsZeng, Guang, McDonald, Stuart D., Gu, Qinfen and Nogita, Kazuhiro (2012). Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallics. Journal of Materials Research, 27 (20), 2609-2614. doi: 10.1557/jmr.2012.247 |
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2012 Journal Article Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline CuMu, Dekui, Yasuda, Hideyuki, Huang, Han and Nogita, Kazuhiro (2012). Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds, 536, 38-46. doi: 10.1016/j.jallcom.2012.04.110 |
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2012 Journal Article Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2)Nogita, K., Mu, D., McDonald, S. D., Read, J. and Wu, Y. Q. (2012). Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2). Intermetallics, 26, 78-85. doi: 10.1016/j.intermet.2012.03.047 |
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2012 Journal Article Development of high-temperature solders: ReviewZeng, Guang, McDonald, Stuart and Nogita, Kazuhiro (2012). Development of high-temperature solders: Review. Microelectronics Reliability, 52 (7), 1306-1322. doi: 10.1016/j.microrel.2012.02.018 |
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2011 Journal Article The influence of topological structure on bulk glass formation in Al-based metallic glassesYan, M, Kohara, S., Wang, J. Q., Nogita, K., Schaffer, G. B. and Qian, M. (2011). The influence of topological structure on bulk glass formation in Al-based metallic glasses. Scripta Materialia, 65 (9), 755-758. doi: 10.1016/j.scriptamat.2011.07.009 |
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2011 Journal Article Kinetics of the eta-eta' transformation in Cu6Sn5Nogita, K., Gourlay, C. M., McDonald, S. D., Wu, Y. Q., Read, J. and Gu, Q. F. (2011). Kinetics of the eta-eta' transformation in Cu6Sn5. Scripta Materialia, 65 (10), 922-925. doi: 10.1016/j.scriptamat.2011.07.058 |
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2011 Journal Article Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5Mu, Dekui, Read, Jonathan, Yang, Yafeng and Nogita, Kazuhiro (2011). Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5. Journal of Materials Research, 26 (20), 2660-2664. doi: 10.1557/jmr.2011.293 |
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2011 Journal Article Granular deformation mechanisms in semi-solid alloysGourlay, C.M., Dahle, A. K., Nagira, T., Nakatsuka, N., Nogita, K., Uesugi, K. and Yasuda, H. (2011). Granular deformation mechanisms in semi-solid alloys. Acta Materialia, 59 (12), 4933-4943. doi: 10.1016/j.actamat.2011.04.038 |
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2011 Journal Article In-situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06NiGourlay, C. M., Nogita, K., Dahle, A. K., Yamamoto, Y., Uesugi, K., Nagira, T., Yoshiya, M. and Yasuda, H. (2011). In-situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni. Acta Materialia, 59 (10), 4043-4054. doi: 10.1016/j.actamat.2011.03.028 |
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2011 Journal Article The influence of solder composition on the impact strength of lead-free solder ball grid array jointsTsukamoto, H., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. W. and Nogita, K. (2011). The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectronics Reliability, 51 (3), 657-667. doi: 10.1016/j.microrel.2010.10.012 |
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2011 Journal Article Eutectic modification and porosity formation in Al-Si alloysNogita, Kazuhiro (2011). Eutectic modification and porosity formation in Al-Si alloys. Journal of Japan Foundry Engineering Society, 83 (2), 167-175. |
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2011 Journal Article Investigation of solidification behaviour in alumnimum alloys by synchrotron radiation X-rayYasuda, H., Nogita, Kazuhiro, Yamamoto, Y., Nagira, T., Yoshiya, M., Uesugi, K., Umetani, K., Takeuchi, A. and Suzuki, Y. (2011). Investigation of solidification behaviour in alumnimum alloys by synchrotron radiation X-ray. Journal of the Japan Institute of Light Metals, 61 (12), 736-742. |
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2011 Journal Article A hydrogen storage system utilising as-cast magnesium based alloysNogita, Kazuhiro (2011). A hydrogen storage system utilising as-cast magnesium based alloys. Ceramics Japan (Bulletin of The Ceramic Society of Japan), 46 (3), 196-200. |
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2010 Journal Article Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?野北 和宏 [Nogita, Kazuhiro] (2010). Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?. エレクトロニクスの実装技術 (Erekutoronikusu no Jissō-Gijutsu) [Electronic Packaging Technology], 26 (11), 20-26. |
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2010 Journal Article Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substratesTsukamoto, H., Nishimura, T., Suenaga, S. and Nogita, K. (2010). Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates. Materials Science and Engineering B, 171 (1-3), 162-171. doi: 10.1016/j.mseb.2010.03.092 |
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2010 Journal Article The influence of Ni additions on the relative stability of eta and eta(') Cu6Sn5Schwingenschlogl, U., Di Paola, C., Nogita, K. and Gourlay, C. M. (2010). The influence of Ni additions on the relative stability of eta and eta(') Cu6Sn5. Applied Physics Letters, 96 (6) 061908, 061908-1-061908-3. doi: 10.1063/1.3310019 |
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2010 Journal Article The role of trace element segregation in the eutectic modification of hypoeutectic Al-Si alloysNogita, K, Yasuda, H, Yoshiya, M, McDonald, SD, Takeuchi, A and Suzuki, Y (2010). The role of trace element segregation in the eutectic modification of hypoeutectic Al-Si alloys. Journal of Alloys and Compounds, 489 (2), 415-420. doi: 10.1016/j.jallcom.2009.09.138 |
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2010 Journal Article Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloysNogita, Kazuhiro (2010). Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys. Intermetallics, 18 (1), 145-149. doi: 10.1016/j.intermet.2009.07.005 |
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2010 Journal Article Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni AlloysGourlay, C. M., Nogita, K., Read, J. and Dahle, A. K. (2010). Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys. Journal of Electronic Materials, 39 (1), 56-69. doi: 10.1007/s11664-009-0962-5 |
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2010 Journal Article The performance of lead-free solders during a long-distance electric vehicle raceNogita, Kazuhiro, Greaves, Mathew C., Guymer, Benjamin D., Walsh, Bernard B., Kennedy, James M., Duke, Michael D. and Nishimura, Tetsuro (2010). The performance of lead-free solders during a long-distance electric vehicle race. Transactions of The Japan Institute of Electronics Packaging, 3 (1), 104-109. |
