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2010 Journal Article Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni AlloysGourlay, C. M., Nogita, K., Read, J. and Dahle, A. K. (2010). Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys. Journal of Electronic Materials, 39 (1), 56-69. doi: 10.1007/s11664-009-0962-5 |
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2009 Journal Article Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interfaceTsukamoto, H, Nishimura, T and Nogita, K (2009). Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface. MATERIALS LETTERS, 63 (30), 2687-2690. doi: 10.1016/j.matlet.2009.09.041 |
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2009 Journal Article In-situ observation of Sn alloy solidification at SPring8Yasuda, Hideyuki, Nogita, Kazuhiro, Gourlay, Christopher, Yoshiya, Masato and Nagira, Tomoya (2009). In-situ observation of Sn alloy solidification at SPring8. Journal of the Japan Welding Society, 78 (7), 6-9. doi: 10.2207/jjws.78.600 |
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2009 Journal Article Engineering the Mg-Mg2Ni eutectic transformation to produce improved hydrogen storage alloysNogita, K., Ockert, S., Pierce, J., Greaves, M.C., Gourlay, C.M. and Dahle, A.K. (2009). Engineering the Mg-Mg2Ni eutectic transformation to produce improved hydrogen storage alloys. PERGAMON-ELSEVIER SCIENCE LTD, 34 (18), 7686-7691. doi: 10.1016/j.ijhydene.2009.07.036 |
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2009 Journal Article Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substratesTsukamoto, Hideaki, Dong, Zhigang, Huang, Han, Nishimura, Tetsuro and Nogita, Kazuhiro (2009). Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substrates. Materials Science and Engineering B, 164 (1), 44-50. doi: 10.1016/j.mseb.2009.06.013 |
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2009 Journal Article Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substratesNogita, Kazuhiro, Gourlay, C. M and Nishimura, T (2009). Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates. JOM (A publication of The Minerals, Metals & Materials Society), 61 (6), 45-51. doi: 10.1007/s11837-009-0087-6 |
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2009 Journal Article Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free soldersNogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009). Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 (1), 46-54. |
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2008 Journal Article Copper erosion: The influence of metallurgy on copper dissolution: The rate of copper dissolutionShea, Chrys, Kenny, Jim, Rasmussen, Jean, Wable, Girish, Chu, Quyen, Teng. Shiang, Sweatman, Keith and Nogita, Kazuhiro (2008). Copper erosion: The influence of metallurgy on copper dissolution: The rate of copper dissolution. Printed Circuit Design & Fab, 25 (10), 35-38. |
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2008 Journal Article Effects of boron on microstructure in cast titanium alloysBermingham, M., McDonald, S.D., Nogita, K., St John, D.H. and Dargusch, M.S. (2008). Effects of boron on microstructure in cast titanium alloys. Scripta Materialia, 59 (5), 538-541. doi: 10.1016/j.scriptamat.2008.05.002 |
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2008 Journal Article Nickel-stabilized hexagonal (Cu, Ni)(6)Sn-5 in Sn-Cu-Ni lead-free solder alloysNogita, K. and Nishimura, T. (2008). Nickel-stabilized hexagonal (Cu, Ni)(6)Sn-5 in Sn-Cu-Ni lead-free solder alloys. Scripta Materialia, 59 (2), 191-194. doi: 10.1016/j.scriptamat.2008.03.002 |
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2008 Journal Article Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solderNogita, K., Gourlay, C., Read, J., Nishimura, T., Suenaga, S. and Dahle, A.K. (2008). Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder. Materials Transactions, 49 (3), 443-448. doi: 10.2320/matertrans.MBW200713 |
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2008 Journal Article The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNiVentura, Tina, Gourlay, Christopher M., Nogita, Kazuhiro, Nishimura, Tetsuro, Rappaz, Michel and Dahle, Arne K. (2008). The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi. Journal of Electronic Materials, 37 (1), 32-39. doi: 10.1007/s11664-007-0281-7 |
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2008 Journal Article The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloysGourlay, C., Read, J., Nogita, K. and Dahle, A.K. (2008). The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys. Journal of Electronic Materials, 37 (1), 51-60. doi: 10.1007/s11664-007-0248-8 |
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2007 Journal Article Ultrahigh electron emissive carbon nanotubes with nano-sized RuO2 particles depositionKnibbe, Ruth, Nogita, Kazuhiro, Drennan, John, Noguchi, Tsuneyuki, Tatenuma, Katsuyoshi, Liu, Pou, Arai, Fumihito, Yashima, Eiji, Nishiwaki, Michiru and Kato, Shigeki (2007). Ultrahigh electron emissive carbon nanotubes with nano-sized RuO2 particles deposition. Journal of Nanoparticle Research, 9 (6), 1201-1204. doi: 10.1007/s11051-006-9207-1 |
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2006 Journal Article Influence of calcium on the microstructure and properties of an Al-7Si-0.3Mg-xFe alloyKumari, SSS, Pillai, RM, Nogita, K, Dahle, AK and Pai, BC (2006). Influence of calcium on the microstructure and properties of an Al-7Si-0.3Mg-xFe alloy. Metallurgical And Materials Transactions A-Physical Metallurgy And Materials Science, 37A (8) 2581, 2581-2587. doi: 10.1007/BF02586230 |
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2006 Journal Article A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7CuGourlay, CM, Nogita, K, McDonald, SD, Nishimura, T, Sweatman, K and Dahle, AK (2006). A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu. Scripta Materialia, 54 (9), 1557-1562. doi: 10.1016/j.scriptamat.2006.01.025 |
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2006 Journal Article Determination of strontium segregation in modified hypoeutectic Al-Si alloy by micro X-ray fluorescence analysisNogita, K, Yasuda, H, Yoshida, K, Uesugi, K, Takeuchi, A, Suzuki, Y and Dahle, AK (2006). Determination of strontium segregation in modified hypoeutectic Al-Si alloy by micro X-ray fluorescence analysis. Scripta Materialia, 55 (9), 787-790. doi: 10.1016/j.scriptamat.2006.07.029 |
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2006 Journal Article Eutectic grain size and strontium concentration in hypoeutectic aluminium-silicon alloysMcDonald, S. D., Nogita, K. and Dahle, A. K. (2006). Eutectic grain size and strontium concentration in hypoeutectic aluminium-silicon alloys. Journal of Alloys and Compounds, 422 (1-2), 184-191. doi: 10.1016/j.jallcom.2005.11.070 |
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2006 Journal Article The effect of aluminium content on the mechanical properties and microstructure of die cast binary magnesium-aluminium alloysDargusch, M. S., Pettersen, K., Nogita, K., Nave, M. D. and Dunlop, G. L. (2006). The effect of aluminium content on the mechanical properties and microstructure of die cast binary magnesium-aluminium alloys. Materials Transactions, 47 (4), 977-982. doi: 10.2320/matertrans.47.977 |
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2005 Journal Article Eutectic modification and microstructure development in Al-Si alloysDahle, A. K., Nogita, K., McDonald, S. D., Dinnis, C. M. and Lu, L. (2005). Eutectic modification and microstructure development in Al-Si alloys. Materials Science And Engineering A-structural Materials Properties Microstructure And Processing, 413-414 (International Conference on Advances in Solidification Processes), 243-248. doi: 10.1016/j.msea.2005.09.055 |
