Development of mechanically strong, ultrasonically processed, nanoparticle-embedded Pb-free soldered electronic interconnects and Al-Si brazed joints (2014-2019)
Abstract
This project will combine recent advances in understanding grain refinement during solidification with novel techniques of microstructure control through the application of external stimuli during processing and the addition of nanoparticle master alloys. This approach will enable the manufacture of fine-grained high performance products. The research will be applied to soldering and brazing operations for improved behaviour during manufacturing and increased reliability. The involvement of a major global supplier of alloys to the electronics sector will facilitate the application of the research in the development of advanced products suitable for incorporation into next-generation electrical devices.
