Design of Planar Microwave Components and Sub-systems for Wideband Applications (2009-2011)
Abstract
This research proposal describes a new technique for designing wideband planar microwave components and subsystems. In order to achieve wideband performance and high density integration, two sides of a dielectric substrate are utilized in the design process. The proposal shows a step-by-step conceptual framework for designing individual wideband components and fully integrated sub-systems using the proposed technique. The research outcomes are expected to be of particular importance to the newly introduced cost-effective Liquid Crystal Polymer technology for developing new generations of packaged microwave sub-systems.
