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2009 Conference Publication The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substratesNogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. TMS 2009, San Francisco, California, USA, 15-19 February 2009. |
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2009 Conference Publication Ball impact behavior of Sn-Cu (-Ni) lead-free solder jointsTsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, 1-3 July 2009. |
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2009 Conference Publication Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfacesNogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, 14-16 April, 2009. Kyoto, Japan: Japan Institute of Electronics Packaging. |
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2008 Journal Article Copper erosion: The influence of metallurgy on copper dissolution: The rate of copper dissolutionShea, Chrys, Kenny, Jim, Rasmussen, Jean, Wable, Girish, Chu, Quyen, Teng. Shiang, Sweatman, Keith and Nogita, Kazuhiro (2008). Copper erosion: The influence of metallurgy on copper dissolution: The rate of copper dissolution. Printed Circuit Design & Fab, 25 (10), 35-38. |
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2008 Journal Article Effects of boron on microstructure in cast titanium alloysBermingham, M., McDonald, S.D., Nogita, K., St John, D.H. and Dargusch, M.S. (2008). Effects of boron on microstructure in cast titanium alloys. Scripta Materialia, 59 (5), 538-541. doi: 10.1016/j.scriptamat.2008.05.002 |
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2008 Journal Article Nickel-stabilized hexagonal (Cu, Ni)(6)Sn-5 in Sn-Cu-Ni lead-free solder alloysNogita, K. and Nishimura, T. (2008). Nickel-stabilized hexagonal (Cu, Ni)(6)Sn-5 in Sn-Cu-Ni lead-free solder alloys. Scripta Materialia, 59 (2), 191-194. doi: 10.1016/j.scriptamat.2008.03.002 |
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2008 Journal Article Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solderNogita, K., Gourlay, C., Read, J., Nishimura, T., Suenaga, S. and Dahle, A.K. (2008). Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder. Materials Transactions, 49 (3), 443-448. doi: 10.2320/matertrans.MBW200713 |
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2008 Journal Article The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloysGourlay, C., Read, J., Nogita, K. and Dahle, A.K. (2008). The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys. Journal of Electronic Materials, 37 (1), 51-60. doi: 10.1007/s11664-007-0248-8 |
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2008 Conference Publication Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfacesTsukamoto, H., Dong, Z., Huang, H., Nishimura, T. and Nogita, K. (2008). Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces. Materials and AustCeram Conference (MAC 2009), Gold Coast, Queensland, 1-3 July 2009. |
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2008 Journal Article The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNiVentura, Tina, Gourlay, Christopher M., Nogita, Kazuhiro, Nishimura, Tetsuro, Rappaz, Michel and Dahle, Arne K. (2008). The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi. Journal of Electronic Materials, 37 (1), 32-39. doi: 10.1007/s11664-007-0281-7 |
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2008 Conference Publication Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloysNogita, K., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. and Tsukamoto, H. (2008). Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys. Japanese Institute of Metals Annual Autumn Meeting 2008, Kumamoto, Japan, 23-25 September 2008. |
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2007 Journal Article Ultrahigh electron emissive carbon nanotubes with nano-sized RuO2 particles depositionKnibbe, Ruth, Nogita, Kazuhiro, Drennan, John, Noguchi, Tsuneyuki, Tatenuma, Katsuyoshi, Liu, Pou, Arai, Fumihito, Yashima, Eiji, Nishiwaki, Michiru and Kato, Shigeki (2007). Ultrahigh electron emissive carbon nanotubes with nano-sized RuO2 particles deposition. Journal of Nanoparticle Research, 9 (6), 1201-1204. doi: 10.1007/s11051-006-9207-1 |
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2007 Conference Publication Microstructure and solidification of hypoeutectic, eutectic, and hypereutectic Mg-Mg2Ni alloysNogita, K. and Dahle, A.K. (2007). Microstructure and solidification of hypoeutectic, eutectic, and hypereutectic Mg-Mg2Ni alloys. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July, 2007. Sheffield, United Kingdom: Department of Engineering Materials, University of Sheffield. |
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2007 Conference Publication Solidification characteristics of lead-free solder Sn-0.7Cu-0.06NiVentura, T., Nogita, K., Gourlay, C., Nishimura, T., Rappaz, M. and Dahle, A.K. (2007). Solidification characteristics of lead-free solder Sn-0.7Cu-0.06Ni. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. United Kingdom: Department of Engineering Materials, University of Sheffield. |
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2007 Conference Publication Refinement of Al-Si Eutectic Grains - A Novel method to produce high integrity Al-Si Alloy CastingsLu, L., Nogita, K. and Dahle, A.K. (2007). Refinement of Al-Si Eutectic Grains - A Novel method to produce high integrity Al-Si Alloy Castings. Light Metals 2007, Orlando, Florida, USA, February 25 - March 1 2007. USA: The Minerals, Metals and Materials Society. |
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2007 Conference Publication Engineering eutectic solidification in Al-Si AlloysDahle, A.K., Nogita, K. and McDonald, S.D. (2007). Engineering eutectic solidification in Al-Si Alloys. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. Sheffield, United Kingdom: University of Sheffield. |
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2007 Conference Publication Analysis of trace elements in Na-modified Al-10 wt%Si using EMPA and NanoSIMSSimensen, C.J., Hillion, F., Nielsen, O., Nogita, K. and Dahle, A.K. (2007). Analysis of trace elements in Na-modified Al-10 wt%Si using EMPA and NanoSIMS. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. Great Britain: Department of Engineering Materials, University of Sheffield. |
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2007 Conference Publication New approaches to understand modification and nucleation mechanisms of hypoeutectic Al-Si AlloysNogita, K., McDonald, S.D. and Dahle, A.K. (2007). New approaches to understand modification and nucleation mechanisms of hypoeutectic Al-Si Alloys. TMS Annual Meeting, Orlando, Florida, USA, February 25 - March 1 2007. United Stated: The Minerals, Metals and Materials Society. |
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2006 Journal Article Eutectic grain size and strontium concentration in hypoeutectic aluminium-silicon alloysMcDonald, S. D., Nogita, K. and Dahle, A. K. (2006). Eutectic grain size and strontium concentration in hypoeutectic aluminium-silicon alloys. Journal of Alloys and Compounds, 422 (1-2), 184-191. doi: 10.1016/j.jallcom.2005.11.070 |
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2006 Journal Article The effect of aluminium content on the mechanical properties and microstructure of die cast binary magnesium-aluminium alloysDargusch, M. S., Pettersen, K., Nogita, K., Nave, M. D. and Dunlop, G. L. (2006). The effect of aluminium content on the mechanical properties and microstructure of die cast binary magnesium-aluminium alloys. Materials Transactions, 47 (4), 977-982. doi: 10.2320/matertrans.47.977 |
