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2013 Journal Article Hydrogen desorption of Mg-Mg2Ni hypo-eutectic alloys in Air, Ar, C02, N2 and H2Nogita, K., McDonald, S., Duguid, A., Tsubota, M. and Gu, Q. F. (2013). Hydrogen desorption of Mg-Mg2Ni hypo-eutectic alloys in Air, Ar, C02, N2 and H2. Journal of Alloys and Compounds, 580 (SUPPL1), S140-S143. doi: 10.1016/j.jallcom.2013.01.006 |
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2013 Conference Publication Grain refinement for improved lead-Free solder joint reliabilitySweatman, K., Mcdonald, S. D., Whitewick, M., Nishimura, T. and Nogita, K. (2013). Grain refinement for improved lead-Free solder joint reliability. IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013, San Diego, United States, 19-21 February 2013. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries. |
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2013 Conference Publication Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short reviewMohd Salleh, M. A. A., McDonald, Stuart and Nogita, Kazuhiro (2013). Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review. ITMS 2013: 4th International Conference on Information Technology for Manufacturing Systems, Auckland, New Zealand, 27-29 August, 2013. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/AMM.421.260 |
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2013 Conference Publication Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallicsZeng, Guang, McDonald, Stuart, Gu, Qinfen and Nogita, Kazuhiro (2013). Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallics. Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, 3-7 March 2013. |
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2013 Conference Publication Crack formation and propagation mechanisms in interfacial Cu6Sn5Nogita, Kazuhiro, Mu, Dekui, McDonald, Stuart D., Read, Stuart D. and Sweatman, Keith (2013). Crack formation and propagation mechanisms in interfacial Cu6Sn5. ICEP 2013: International Conference on Electronic Packaging 2013, Osaka, Japan, 10-12 April 2013. Osaka, Japan: Japan Institute of Electronics Packaging (JIEP). |
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2013 Journal Article Real time synchrotron X-ray imaging for nucleation and growth of Cu6Sn5 in Sn-7Cu-0.05Ni high temperature lead-free solder alloysNogita, Kazuhiro, Yasuda, Hideyuki, McDonald, Stuart D. and Uesugi, Kentaro (2013). Real time synchrotron X-ray imaging for nucleation and growth of Cu6Sn5 in Sn-7Cu-0.05Ni high temperature lead-free solder alloys. Advanced Materials Research, 626, 200-204. doi: 10.4028/www.scientific.net/AMR.626.200 |
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2013 Conference Publication New phase in stoichiometric Cu6Sn5 and effect of Ni addition on phase stabilization in wide temperature rangeBarry, J., Yamamoto, T., Gu, Q., Huang, Yang, Matsumura, S. and Nogita, Kazuhiro (2013). New phase in stoichiometric Cu6Sn5 and effect of Ni addition on phase stabilization in wide temperature range. Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, 3-7 March 2013. |
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2012 Journal Article Effect of cooling rate on the intermetallic layer in solder jointsSweatman, K., Nishimura, T., McDonald, S. and Nogita, K. (2012). Effect of cooling rate on the intermetallic layer in solder joints. SMT Surface Mount Technology Magazine, 27 (11), 68-77. |
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2012 Journal Article A new phase in stoichiometric Cu6Sn5Wu, Y. Q., Barry, J., Yamamoto, T., Gu, Q. F., McDonald, S. D., Matsumura, S., Huang, H. and Nogita, K. (2012). A new phase in stoichiometric Cu6Sn5. Acta Materialia, 60 (19), 6581-6591. doi: 10.1016/j.actamat.2012.08.024 |
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2012 Journal Article Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5Mu, D., Huang, H. and Nogita, K. (2012). Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. Materials Letters, 86, 46-49. doi: 10.1016/j.matlet.2012.07.018 |
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2012 Journal Article Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallicsZeng, Guang, McDonald, Stuart D., Gu, Qinfen and Nogita, Kazuhiro (2012). Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallics. Journal of Materials Research, 27 (20), 2609-2614. doi: 10.1557/jmr.2012.247 |
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2012 Journal Article Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline CuMu, Dekui, Yasuda, Hideyuki, Huang, Han and Nogita, Kazuhiro (2012). Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds, 536, 38-46. doi: 10.1016/j.jallcom.2012.04.110 |
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2012 Journal Article Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2)Nogita, K., Mu, D., McDonald, S. D., Read, J. and Wu, Y. Q. (2012). Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2). Intermetallics, 26, 78-85. doi: 10.1016/j.intermet.2012.03.047 |
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2012 Journal Article Development of high-temperature solders: ReviewZeng, Guang, McDonald, Stuart and Nogita, Kazuhiro (2012). Development of high-temperature solders: Review. Microelectronics Reliability, 52 (7), 1306-1322. doi: 10.1016/j.microrel.2012.02.018 |
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2012 Conference Publication Effect of cooling rate on the intermetallic layer in solder jointsSweatman, Keith, Nishimura, Tetsuro, McDonald, Stuary D. and Nogita, Kazuhiro (2012). Effect of cooling rate on the intermetallic layer in solder joints. IPC APEX Expo 2012, San Diego, United States, 28 February - 1 March 2012. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries. |
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2012 Conference Publication Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5Mu, Dekui, Huang, Han and Nogita, Kazuhiro (2012). Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. TMS 2012 141st Annual Meeting and Exhibition, Orlando, United States, 11-15 March 2012. |
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2012 Conference Publication Industry-university collaboration and advances in lead-free solder technologyNogita, Kazuhiro (2012). Industry-university collaboration and advances in lead-free solder technology. Proc. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012. |
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2012 Conference Publication The stability of Cu6Sn5 in the formation and performance of lead-free solder jointsSweatman, Keith, Nishimura, T. and Nogita, Kazuhiro (2012). The stability of Cu6Sn5 in the formation and performance of lead-free solder joints. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012. |
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2011 Journal Article Kinetics of the eta-eta' transformation in Cu6Sn5Nogita, K., Gourlay, C. M., McDonald, S. D., Wu, Y. Q., Read, J. and Gu, Q. F. (2011). Kinetics of the eta-eta' transformation in Cu6Sn5. Scripta Materialia, 65 (10), 922-925. doi: 10.1016/j.scriptamat.2011.07.058 |
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2011 Journal Article The influence of topological structure on bulk glass formation in Al-based metallic glassesYan, M, Kohara, S., Wang, J. Q., Nogita, K., Schaffer, G. B. and Qian, M. (2011). The influence of topological structure on bulk glass formation in Al-based metallic glasses. Scripta Materialia, 65 (9), 755-758. doi: 10.1016/j.scriptamat.2011.07.009 |
