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2012 Journal Article Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5Mu, D., Huang, H. and Nogita, K. (2012). Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. Materials Letters, 86, 46-49. doi: 10.1016/j.matlet.2012.07.018 |
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2012 Journal Article Effect of cooling rate on the intermetallic layer in solder jointsSweatman, K., Nishimura, T., McDonald, S. and Nogita, K. (2012). Effect of cooling rate on the intermetallic layer in solder joints. SMT Surface Mount Technology Magazine, 27 (11), 68-77. |
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2012 Journal Article A new phase in stoichiometric Cu6Sn5Wu, Y. Q., Barry, J., Yamamoto, T., Gu, Q. F., McDonald, S. D., Matsumura, S., Huang, H. and Nogita, K. (2012). A new phase in stoichiometric Cu6Sn5. Acta Materialia, 60 (19), 6581-6591. doi: 10.1016/j.actamat.2012.08.024 |
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2012 Journal Article Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallicsZeng, Guang, McDonald, Stuart D., Gu, Qinfen and Nogita, Kazuhiro (2012). Effect of Zn, Au, and In on the polymorphic phase transformation in Cu6Sn5 intermetallics. Journal of Materials Research, 27 (20), 2609-2614. doi: 10.1557/jmr.2012.247 |
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2012 Journal Article Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline CuMu, Dekui, Yasuda, Hideyuki, Huang, Han and Nogita, Kazuhiro (2012). Growth orientations and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds, 536, 38-46. doi: 10.1016/j.jallcom.2012.04.110 |
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2012 Journal Article Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2)Nogita, K., Mu, D., McDonald, S. D., Read, J. and Wu, Y. Q. (2012). Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2). Intermetallics, 26, 78-85. doi: 10.1016/j.intermet.2012.03.047 |
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2012 Journal Article Development of high-temperature solders: ReviewZeng, Guang, McDonald, Stuart and Nogita, Kazuhiro (2012). Development of high-temperature solders: Review. Microelectronics Reliability, 52 (7), 1306-1322. doi: 10.1016/j.microrel.2012.02.018 |
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2012 Conference Publication Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5Mu, Dekui, Huang, Han and Nogita, Kazuhiro (2012). Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. TMS 2012 141st Annual Meeting and Exhibition, Orlando, United States, 11-15 March 2012. |
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2012 Conference Publication Industry-university collaboration and advances in lead-free solder technologyNogita, Kazuhiro (2012). Industry-university collaboration and advances in lead-free solder technology. Proc. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012. |
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2012 Conference Publication The stability of Cu6Sn5 in the formation and performance of lead-free solder jointsSweatman, Keith, Nishimura, T. and Nogita, Kazuhiro (2012). The stability of Cu6Sn5 in the formation and performance of lead-free solder joints. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012. |
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2012 Conference Publication Effect of cooling rate on the intermetallic layer in solder jointsSweatman, Keith, Nishimura, Tetsuro, McDonald, Stuary D. and Nogita, Kazuhiro (2012). Effect of cooling rate on the intermetallic layer in solder joints. IPC APEX Expo 2012, San Diego, United States, 28 February - 1 March 2012. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries. |
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2011 Journal Article Kinetics of the eta-eta' transformation in Cu6Sn5Nogita, K., Gourlay, C. M., McDonald, S. D., Wu, Y. Q., Read, J. and Gu, Q. F. (2011). Kinetics of the eta-eta' transformation in Cu6Sn5. Scripta Materialia, 65 (10), 922-925. doi: 10.1016/j.scriptamat.2011.07.058 |
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2011 Journal Article The influence of topological structure on bulk glass formation in Al-based metallic glassesYan, M, Kohara, S., Wang, J. Q., Nogita, K., Schaffer, G. B. and Qian, M. (2011). The influence of topological structure on bulk glass formation in Al-based metallic glasses. Scripta Materialia, 65 (9), 755-758. doi: 10.1016/j.scriptamat.2011.07.009 |
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2011 Journal Article Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5Mu, Dekui, Read, Jonathan, Yang, Yafeng and Nogita, Kazuhiro (2011). Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5. Journal of Materials Research, 26 (20), 2660-2664. doi: 10.1557/jmr.2011.293 |
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2011 Journal Article Granular deformation mechanisms in semi-solid alloysGourlay, C.M., Dahle, A. K., Nagira, T., Nakatsuka, N., Nogita, K., Uesugi, K. and Yasuda, H. (2011). Granular deformation mechanisms in semi-solid alloys. Acta Materialia, 59 (12), 4933-4943. doi: 10.1016/j.actamat.2011.04.038 |
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2011 Journal Article In-situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06NiGourlay, C. M., Nogita, K., Dahle, A. K., Yamamoto, Y., Uesugi, K., Nagira, T., Yoshiya, M. and Yasuda, H. (2011). In-situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni. Acta Materialia, 59 (10), 4043-4054. doi: 10.1016/j.actamat.2011.03.028 |
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2011 Journal Article The influence of solder composition on the impact strength of lead-free solder ball grid array jointsTsukamoto, H., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. W. and Nogita, K. (2011). The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectronics Reliability, 51 (3), 657-667. doi: 10.1016/j.microrel.2010.10.012 |
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2011 Conference Publication The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free soldersSweatman, Keith, Read, J., Nishimura, T. and Nogita, Kazuhiro (2011). The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free solders. SMTA International, Fort Worth, Texas, United States, 16-20 October 2011. |
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2011 Journal Article A hydrogen storage system utilising as-cast magnesium based alloysNogita, Kazuhiro (2011). A hydrogen storage system utilising as-cast magnesium based alloys. Ceramics Japan (Bulletin of The Ceramic Society of Japan), 46 (3), 196-200. |
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2011 Journal Article Investigation of solidification behaviour in alumnimum alloys by synchrotron radiation X-rayYasuda, H., Nogita, Kazuhiro, Yamamoto, Y., Nagira, T., Yoshiya, M., Uesugi, K., Umetani, K., Takeuchi, A. and Suzuki, Y. (2011). Investigation of solidification behaviour in alumnimum alloys by synchrotron radiation X-ray. Journal of the Japan Institute of Light Metals, 61 (12), 736-742. |
