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2018 Conference Publication Experimental study of the solidification microstructure in the Mg-Rich corner of Mg–Al–Ce systemWong, Charlotte, Styles, Mark J., Zhu, Suming, Abbott, Trevor, Nogita, Kazuhiro, McDonald, Stuart D., StJohn, David H., Gibson, Mark A. and Easton, Mark A. (2018). Experimental study of the solidification microstructure in the Mg-Rich corner of Mg–Al–Ce system. International Symposium on Magnesium Technology, 2018, Phoenix, AZ, USA, March 11, 2018-March 15, 2018. CHAM: Springer International Publishing. doi: 10.1007/978-3-319-72332-7_13 |
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2018 Conference Publication Effect of reflow conditions on the intermetallic layer in solder jointsNogita, K., Somidin, F., Mohd Salleh, M. A.A., Sweatman, K., Nishimura, T., McDonald, S. D., Maeno, H. and Matsumura, S. (2018). Effect of reflow conditions on the intermetallic layer in solder joints. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kuwana, Mie, Japan, 17 - 21 April 2018. Japan: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2018.8374678 |
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2018 Conference Publication Influence of Bi addition on wettability and mechanical properties of Sn-0.7Cu solder alloyRamli, M. I.I., Yusof, M. S.S., Mohd Salleh, M. A.A., Said, R. M. and Nogita, K. (2018). Influence of Bi addition on wettability and mechanical properties of Sn-0.7Cu solder alloy. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.27 |
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2018 Conference Publication Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffractionQu, Dong Dong, McDonald, Stuart D., Yasuda, Hideyuki, Ohara, Koji, Kohara, Shinji and Nogita, Kazuhiro (2018). Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.101 |
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2018 Conference Publication Optimization of Ni and Bi levels in Sn-0.7Cu-xNi-yBi solders for improved interconnection reliabilityBelyakov, S. A., Nishimura, T., Akaiwa, T., Sweatman, K., Nogita, K. and Gourlay, C. M. (2018). Optimization of Ni and Bi levels in Sn-0.7Cu-xNi-yBi solders for improved interconnection reliability. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, Kuwana, Mie, Japan, 17-21 April 2018. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2018.8374705 |
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2018 Conference Publication Stem analysis of atom location in (Cu, Au, Ni)6Sn5 intermetallic compoundsYang, Wen Hui, Yamamoto, Tomokazu, Nogita, Kazuhiro and Matsumura, Syo (2018). Stem analysis of atom location in (Cu, Au, Ni)6Sn5 intermetallic compounds. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan , 1-2 November 2017 . Zurich, Switzerland : Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.95 |
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2018 Conference Publication The interaction of Sn-Ga alloys and Au coated Cu substratesLiu, Shi Qian, Qu, Dong Dong, McDonald, Stuart D. and Nogita, Kazuhiro (2018). The interaction of Sn-Ga alloys and Au coated Cu substrates. 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1 - 2 November 2017. Pfaffikon, Switzerland: Scientific.Net. doi: 10.4028/www.scientific.net/SSP.273.3 |
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2018 Conference Publication Synchrotron radiography of Sn-0.7Cu-0.05Ni solder solidificationXian, J. W., Mohd Salleh, M. A.A., Zeng, G., Belyakov, S. A., Yasuda, H., Nogita, K. and Gourlay, C. M. (2018). Synchrotron radiography of Sn-0.7Cu-0.05Ni solder solidification. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.66 |
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2018 Conference Publication Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloysTan, Xin Fu, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart and Nogita, Kazuhiro (2018). Grain refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu high temperature solder alloys. Electronic Packaging Interconnect Technology Symposium, Fukuoka, Japan, 1-2 November 2017. Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/SSP.273.20 |
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2018 Conference Publication Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solderXuan, Quy Tran, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart D. and Nogita, Kazuhiro (2018). Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solder. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan , 1-2 November 2017 . Zurich, Switzerland : Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.9 |
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2018 Journal Article PrefaceNogita, Kazuhiro, Mohd Salleh, Mohd Arif Anuar, Abdullah, Mohd Mustafa Al Bakri, Jamaludin, Liyana and Mohd Tahir, Muhammad Faheem (2018). Preface. Solid State Phenomena, 273 SSP |
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2018 Conference Publication Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bondingSomidin, Flora, McDonald, Stuart and Nogita, Kazuhiro (2018). Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bonding. Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1-2 November 2017. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.14 |
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2017 Journal Article Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and beta SnXian, J. W., Zeng, G., Belyakov, S. A., Gu, Q., Nogita, K. and Gourlay, C. M. (2017). Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and beta Sn. Intermetallics, 91, 50-64. doi: 10.1016/j.intermet.2017.08.002 |
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2017 Journal Article Reply to 'Comments on "evidence of the hydrogen release mechanism in bulk MgH2"'Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro and Matsumura, Syo (2017). Reply to 'Comments on "evidence of the hydrogen release mechanism in bulk MgH2"'. Scientific Reports, 7 (1) 43720, 1-3. doi: 10.1038/srep43720 |
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2017 Journal Article Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substratesMohd Salleh, M. A. A., McDonald, S. D. and Nogita, K. (2017). Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates. Journal of Materials Processing Technology, 242, 235-245. doi: 10.1016/j.jmatprotec.2016.11.031 |
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2017 Journal Article Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnectionsXian, J. W., Belyakov, S. A., Ollivier, M., Nogita, K., Yasuda, H. and Gourlay, C. M. (2017). Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections. Acta Materialia, 126, 540-551. doi: 10.1016/j.actamat.2016.12.043 |
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2017 Journal Article In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Yamamoto, Tomokazu, Shigematsu, Koji, Aso, Kohei, Tanaka, Eishi, Matsumura, Syo and Nogita, Kazuhiro (2017). In-situ investigation of the hydrogen release mechanism in bulk Mg2NiH4. Journal of Power Sources, 341, 130-138. doi: 10.1016/j.jpowsour.2016.11.105 |
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2017 Journal Article In situ imaging of microstructure formation in electronic interconnectionsSalleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D. and Nogita, K. (2017). In situ imaging of microstructure formation in electronic interconnections. Scientific Reports, 7 (1) 40010, 40010. doi: 10.1038/srep40010 |
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2017 Conference Publication Effects of Bi in Sn-Cu based lead-free solder alloys and interconnectsNogita, K., Salleh, M. A. A. Mohd, Smith, S., Wu, Y. Q., McDonald, S. D., Ab Razak, A. G., Akaiwa, T. and Nishimura, T. (2017). Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects. 2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Japan, 19 - 22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2017.7939399 |
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2017 Conference Publication Real time X-ray imaging of soldering processes at the SPring-8 synchrotronNogita, K., Salleh, M. A. A. Mohd, Zeng, G., McDonald, S. D., Gourlay, C. and Yasuda, H. (2017). Real time X-ray imaging of soldering processes at the SPring-8 synchrotron. International Conference on Electronics Packaging (ICEP), Tendo, Japan, 19-22 April 2017. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers . doi: 10.23919/ICEP.2017.7939343 |
