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2017 Conference Publication Real-time observation of AZ91 solidification by synchrotron radiographyZeng, G., Nogita, K., Belyakov, S., Xian, J. W., McDonald, S. D., Yang, K. V., Yasuda, H. and Gourlay, C. M. (2017). Real-time observation of AZ91 solidification by synchrotron radiography. Magnesium Technology 2017, San Diego, CA, United States, 26 February - 2 March 2017. Cham, Switzerland: Springer. doi: 10.1007/978-3-319-52392-7_82 |
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2017 Journal Article Time-resolved and in-situ observation of solidification phenomenaYasuda, Hideyuki, Nagira, Tomoya, Yoshiya, Masato, Morishita, Kohei and Nogita, Kazuhiro (2017). Time-resolved and in-situ observation of solidification phenomena. Journal of the Japan Welding Society, 86 (5), 362-363. |
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2016 Journal Article The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder jointsZeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen, Salleh, M. A. A. Mohd and Nogita, Kazuhiro (2016). The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints. Journal of Alloys and Compounds, 685, 471-482. doi: 10.1016/j.jallcom.2016.05.263 |
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2016 Journal Article In situ TEM observations of Cu6Sn5 polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substratesNogita, K., Mohd Salleh, M. A. A., Tanaka, E., Zeng, G., McDonald, S. D. and Matsumura, S. (2016). In situ TEM observations of Cu6Sn5 polymorphic transformations in reaction layers between Sn-0.7Cu solders and Cu substrates. JOM, 68 (11), 2871-2878. doi: 10.1007/s11837-016-2020-0 |
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2016 Journal Article Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloysTran, Xuan Quy, McDonald, Stuart D. , Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016). Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloys. International Journal of Hydrogen Energy, 42 (10), 6851-6861. doi: 10.1016/j.ijhydene.2016.12.007 |
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2016 Journal Article Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cyclesSalleh, M. A. A. Mohd, McDonald, S. D., Gourlay, C. M., Yasuda, H. and Nogita, K. (2016). Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles. Materials and Design, 108, 418-428. doi: 10.1016/j.matdes.2016.06.121 |
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2016 Journal Article Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloysTran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016). Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloys. International Journal of Hydrogen Energy, 42 (1), 366-375. doi: 10.1016/j.ijhydene.2016.08.110 |
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2016 Journal Article Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during solderingMohd Salleh, M. A A, Said, R. M., Saud, N., Yasuda, H., McDonald, S. D. and Nogita, K. (2016). Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering. Key Engineering Materials, 700, 161-169. doi: 10.4028/www.scientific.net/KEM.700.161 |
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2016 Journal Article Effect of trace Na additions on the hydrogen absorption kinetics of Mg2NiTran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2016). Effect of trace Na additions on the hydrogen absorption kinetics of Mg2Ni. Journal of Materials Research, 31 (9), 1316-1327. doi: 10.1557/jmr.2016.123 |
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2016 Journal Article Critical properties of Cu6Sn5 in electronic devices: Recent progress and a reviewMu, D.K., McDonald, S.D., Read, J., Huang, H. and Nogita, K. (2016). Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review. Current Opinion in Solid State and Materials Science, 20 (2), 55-76. doi: 10.1016/j.cossms.2015.08.001 |
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2016 Conference Publication Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applicationsSmith, S., Zeng, G., Read, J., McDonald, S. D. and Nogita, K. (2016). Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.58 |
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2016 Conference Publication Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloysNogita, K., Kefford, B., Read, J. and McDonald, S. D. (2016). Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.53 |
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2016 Conference Publication Effects of trace phosphorus in Sn-Cu-Ni wave solder drossNogita, K., Mohd Salleh, M. A. A., Tran, X. Q., Read, J., Smith, S. and McDonald, S. D. (2016). Effects of trace phosphorus in Sn-Cu-Ni wave solder dross. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.49 |
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2016 Conference Publication XPS analysis of oxide films on lead-free solders with trace additions of germanium and galliumWatling, K. M., Chandler-Temple, A. and Nogita, K. (2016). XPS analysis of oxide films on lead-free solders with trace additions of germanium and gallium. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.63 |
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2016 Conference Publication Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%)Belyakov, S. A., Nishimura, T., Sweatman, K., Nogita, K. and Gourlay, C. M. (2016). Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%). 2016 International Conference on Electronics Packaging, ICEP 2016, Hokkaido, Japan, 20-22 April 2016. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.1109/ICEP.2016.7486816 |
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2016 Conference Publication Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni soldersGourlay, C. M., Ma, Z. L., Xian, J. W., Belyakov, S. A., Mohd Salleh, M. A. A., Zeng, G., Yasuda, H. and Nogita, K. (2016). Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni solders. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, 4-5 December 2015. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.857.44 |
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2015 Journal Article Understanding the Origin of Li2MnO3 Activation in Li-Rich Cathode Materials for Lithium-Ion BatteriesYe, Delai, Zeng, Guang, Nogita, Kazuhiro, Ozawa, Kiyoshi, Hankel, Marlies, Searles, Debra J and Wang, Lianzhou (2015). Understanding the Origin of Li2MnO3 Activation in Li-Rich Cathode Materials for Lithium-Ion Batteries. Advanced Functional Materials, 25 (48), 7488-7496. doi: 10.1002/adfm.201503276 |
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2015 Journal Article A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloysPrasad, Arvind, Macdonald, Stuart D., Yasuda, Hideyuki, Nogita, Kazuhiro and StJohn, David (2015). A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys. Journal of Crystal Growth, 430, 122-137. doi: 10.1016/j.jcrysgro.2015.06.024 |
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2015 Journal Article Kinetics of the β → α transformation of tin: role of α-tin nucleationZeng, Guang, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2015). Kinetics of the β → α transformation of tin: role of α-tin nucleation. Crystal Growth and Design, 15 (12), 5767-5773. doi: 10.1021/acs.cgd.5b01069 |
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2015 Journal Article Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering ProcessMohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H. and Nogita, K. (2015). Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process. Journal of Electronic Materials, 45 (1), 154-163. doi: 10.1007/s11664-015-4121-x |
