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2012 Conference Publication Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5Mu, Dekui, Huang, Han and Nogita, Kazuhiro (2012). Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. TMS 2012 141st Annual Meeting and Exhibition, Orlando, United States, 11-15 March 2012. |
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2012 Conference Publication Industry-university collaboration and advances in lead-free solder technologyNogita, Kazuhiro (2012). Industry-university collaboration and advances in lead-free solder technology. Proc. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012. |
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2012 Conference Publication The stability of Cu6Sn5 in the formation and performance of lead-free solder jointsSweatman, Keith, Nishimura, T. and Nogita, Kazuhiro (2012). The stability of Cu6Sn5 in the formation and performance of lead-free solder joints. SMTA Pan Pacific Microelectronics Symposium, Kaui, Hawaii, United States, 14-16 February 2012. |
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2012 Conference Publication Effect of cooling rate on the intermetallic layer in solder jointsSweatman, Keith, Nishimura, Tetsuro, McDonald, Stuary D. and Nogita, Kazuhiro (2012). Effect of cooling rate on the intermetallic layer in solder joints. IPC APEX Expo 2012, San Diego, United States, 28 February - 1 March 2012. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries. |
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2011 Journal Article Kinetics of the eta-eta' transformation in Cu6Sn5Nogita, K., Gourlay, C. M., McDonald, S. D., Wu, Y. Q., Read, J. and Gu, Q. F. (2011). Kinetics of the eta-eta' transformation in Cu6Sn5. Scripta Materialia, 65 (10), 922-925. doi: 10.1016/j.scriptamat.2011.07.058 |
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2011 Journal Article The influence of topological structure on bulk glass formation in Al-based metallic glassesYan, M, Kohara, S., Wang, J. Q., Nogita, K., Schaffer, G. B. and Qian, M. (2011). The influence of topological structure on bulk glass formation in Al-based metallic glasses. Scripta Materialia, 65 (9), 755-758. doi: 10.1016/j.scriptamat.2011.07.009 |
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2011 Journal Article Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5Mu, Dekui, Read, Jonathan, Yang, Yafeng and Nogita, Kazuhiro (2011). Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5. Journal of Materials Research, 26 (20), 2660-2664. doi: 10.1557/jmr.2011.293 |
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2011 Journal Article Granular deformation mechanisms in semi-solid alloysGourlay, C.M., Dahle, A. K., Nagira, T., Nakatsuka, N., Nogita, K., Uesugi, K. and Yasuda, H. (2011). Granular deformation mechanisms in semi-solid alloys. Acta Materialia, 59 (12), 4933-4943. doi: 10.1016/j.actamat.2011.04.038 |
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2011 Journal Article In-situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06NiGourlay, C. M., Nogita, K., Dahle, A. K., Yamamoto, Y., Uesugi, K., Nagira, T., Yoshiya, M. and Yasuda, H. (2011). In-situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni. Acta Materialia, 59 (10), 4043-4054. doi: 10.1016/j.actamat.2011.03.028 |
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2011 Journal Article The influence of solder composition on the impact strength of lead-free solder ball grid array jointsTsukamoto, H., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. W. and Nogita, K. (2011). The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectronics Reliability, 51 (3), 657-667. doi: 10.1016/j.microrel.2010.10.012 |
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2011 Journal Article Investigation of solidification behaviour in alumnimum alloys by synchrotron radiation X-rayYasuda, H., Nogita, Kazuhiro, Yamamoto, Y., Nagira, T., Yoshiya, M., Uesugi, K., Umetani, K., Takeuchi, A. and Suzuki, Y. (2011). Investigation of solidification behaviour in alumnimum alloys by synchrotron radiation X-ray. Journal of the Japan Institute of Light Metals, 61 (12), 736-742. |
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2011 Conference Publication Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder jointsMu, D., Read, J., Yang, Y-F. and Nogita, K. (2011). Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder joints. International Conference on Electronic Packaging (ICEP 2011), Nara, Japan, 13-15 April 2011. Nara, Japan: The Japan Institute of Electronics Packaging. |
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2011 Journal Article Eutectic modification and porosity formation in Al-Si alloysNogita, Kazuhiro (2011). Eutectic modification and porosity formation in Al-Si alloys. Journal of Japan Foundry Engineering Society, 83 (2), 167-175. |
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2011 Conference Publication The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free soldersSweatman, Keith, Read, J., Nishimura, T. and Nogita, Kazuhiro (2011). The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free solders. SMTA International, Fort Worth, Texas, United States, 16-20 October 2011. |
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2011 Journal Article A hydrogen storage system utilising as-cast magnesium based alloysNogita, Kazuhiro (2011). A hydrogen storage system utilising as-cast magnesium based alloys. Ceramics Japan (Bulletin of The Ceramic Society of Japan), 46 (3), 196-200. |
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2010 Journal Article Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?野北 和宏 [Nogita, Kazuhiro] (2010). Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?. エレクトロニクスの実装技術 (Erekutoronikusu no Jissō-Gijutsu) [Electronic Packaging Technology], 26 (11), 20-26. |
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2010 Journal Article Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substratesTsukamoto, H., Nishimura, T., Suenaga, S. and Nogita, K. (2010). Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates. Materials Science and Engineering B, 171 (1-3), 162-171. doi: 10.1016/j.mseb.2010.03.092 |
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2010 Journal Article The influence of Ni additions on the relative stability of eta and eta(') Cu6Sn5Schwingenschlogl, U., Di Paola, C., Nogita, K. and Gourlay, C. M. (2010). The influence of Ni additions on the relative stability of eta and eta(') Cu6Sn5. Applied Physics Letters, 96 (6) 061908, 061908-1-061908-3. doi: 10.1063/1.3310019 |
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2010 Journal Article The role of trace element segregation in the eutectic modification of hypoeutectic Al-Si alloysNogita, K, Yasuda, H, Yoshiya, M, McDonald, SD, Takeuchi, A and Suzuki, Y (2010). The role of trace element segregation in the eutectic modification of hypoeutectic Al-Si alloys. Journal of Alloys and Compounds, 489 (2), 415-420. doi: 10.1016/j.jallcom.2009.09.138 |
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2010 Journal Article Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloysNogita, Kazuhiro (2010). Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys. Intermetallics, 18 (1), 145-149. doi: 10.1016/j.intermet.2009.07.005 |
