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2011 Journal Article Investigation of solidification behaviour in alumnimum alloys by synchrotron radiation X-rayYasuda, H., Nogita, Kazuhiro, Yamamoto, Y., Nagira, T., Yoshiya, M., Uesugi, K., Umetani, K., Takeuchi, A. and Suzuki, Y. (2011). Investigation of solidification behaviour in alumnimum alloys by synchrotron radiation X-ray. Journal of the Japan Institute of Light Metals, 61 (12), 736-742. |
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2011 Conference Publication Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder jointsMu, D., Read, J., Yang, Y-F. and Nogita, K. (2011). Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder joints. International Conference on Electronic Packaging (ICEP 2011), Nara, Japan, 13-15 April 2011. Nara, Japan: The Japan Institute of Electronics Packaging. |
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2010 Journal Article Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?野北 和宏 [Nogita, Kazuhiro] (2010). Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?. エレクトロニクスの実装技術 (Erekutoronikusu no Jissō-Gijutsu) [Electronic Packaging Technology], 26 (11), 20-26. |
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2010 Journal Article Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substratesTsukamoto, H., Nishimura, T., Suenaga, S. and Nogita, K. (2010). Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates. Materials Science and Engineering B, 171 (1-3), 162-171. doi: 10.1016/j.mseb.2010.03.092 |
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2010 Journal Article The influence of Ni additions on the relative stability of eta and eta(') Cu6Sn5Schwingenschlogl, U., Di Paola, C., Nogita, K. and Gourlay, C. M. (2010). The influence of Ni additions on the relative stability of eta and eta(') Cu6Sn5. Applied Physics Letters, 96 (6) 061908, 061908-1-061908-3. doi: 10.1063/1.3310019 |
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2010 Journal Article The role of trace element segregation in the eutectic modification of hypoeutectic Al-Si alloysNogita, K, Yasuda, H, Yoshiya, M, McDonald, SD, Takeuchi, A and Suzuki, Y (2010). The role of trace element segregation in the eutectic modification of hypoeutectic Al-Si alloys. Journal of Alloys and Compounds, 489 (2), 415-420. doi: 10.1016/j.jallcom.2009.09.138 |
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2010 Journal Article Synchrotron micro-XRF measurements of trace element distributions in BGA type solders and solder jointsNogita, Kazuhiro, Yasuda, Hideyuki, Gourlay, Christopher M., Suenaga, Shoichi, Tsukamoto, Hideaki, McDonald, Stuart D., Takeuchi, Akihisa, Uesugi, Kentaro and Suzuki, Yoshio (2010). Synchrotron micro-XRF measurements of trace element distributions in BGA type solders and solder joints. Transactions of The Japan Institute of Electronics Packaging, 3 (1), 40-46. |
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2010 Conference Publication Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder jointsMu, Dekui, Tsukamoto, Hideaki, Huang, Han and Nogita, Kazuhiro (2010). Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, Cairns, QLD, Australia, 2-6 August, 2010. Stafa-Zurich ; United Kingdom: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2450 |
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2010 Conference Publication Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFSNogita, Kazuhiro, Jenke, Marc, Wood, David, Duguid, Andrew and McDonald, Stuart D. (2010). Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS. 7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2 - 6 August 2010. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2851 |
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2010 Conference Publication Trace element distribution in solder joints between Sn-based solders and Cu substratesNogita, K., Yasuda, H., Gourlay, C. M., Suenaga, S., Tsukamoto, H., McDonald, S. D., Takeuchi, A., Uesugi, K. and Suzuki, Y. (2010). Trace element distribution in solder joints between Sn-based solders and Cu substrates. International Conference on Electronics Packaging ICEP2010, Sapporo, Hokkaido, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP). |
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2010 Journal Article Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloysNogita, Kazuhiro (2010). Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys. Intermetallics, 18 (1), 145-149. doi: 10.1016/j.intermet.2009.07.005 |
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2010 Journal Article The performance of lead-free solders during a long-distance electric vehicle raceNogita, Kazuhiro, Greaves, Mathew C., Guymer, Benjamin D., Walsh, Bernard B., Kennedy, James M., Duke, Michael D. and Nishimura, Tetsuro (2010). The performance of lead-free solders during a long-distance electric vehicle race. Transactions of The Japan Institute of Electronics Packaging, 3 (1), 104-109. |
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2010 Conference Publication Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interfaceTsukamoto, Hideaki, Dong, Zigang, Huang, Han, Nishimura, Tetsuro and Nogita, Kazuhiro (2010). Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface. Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2-6 August, 2010. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2446 |
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2010 Journal Article Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni AlloysGourlay, C. M., Nogita, K., Read, J. and Dahle, A. K. (2010). Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys. Journal of Electronic Materials, 39 (1), 56-69. doi: 10.1007/s11664-009-0962-5 |
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2010 Conference Publication Lead-free solders for electric vehicles - Global Green Challenge: Eco-challenge racingNogita, K., Greaves, M., Guymer, B., Walsh, B., Kennedy, J., Duke, M. and Nishimura, T. (2010). Lead-free solders for electric vehicles - Global Green Challenge: Eco-challenge racing. International Conference on Electronics Packaging 2010, Sapporo, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP). |
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2009 Journal Article Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interfaceTsukamoto, H, Nishimura, T and Nogita, K (2009). Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface. MATERIALS LETTERS, 63 (30), 2687-2690. doi: 10.1016/j.matlet.2009.09.041 |
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2009 Journal Article In-situ observation of Sn alloy solidification at SPring8Yasuda, Hideyuki, Nogita, Kazuhiro, Gourlay, Christopher, Yoshiya, Masato and Nagira, Tomoya (2009). In-situ observation of Sn alloy solidification at SPring8. Journal of the Japan Welding Society, 78 (7), 6-9. doi: 10.2207/jjws.78.600 |
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2009 Journal Article Engineering the Mg-Mg2Ni eutectic transformation to produce improved hydrogen storage alloysNogita, K., Ockert, S., Pierce, J., Greaves, M.C., Gourlay, C.M. and Dahle, A.K. (2009). Engineering the Mg-Mg2Ni eutectic transformation to produce improved hydrogen storage alloys. PERGAMON-ELSEVIER SCIENCE LTD, 34 (18), 7686-7691. doi: 10.1016/j.ijhydene.2009.07.036 |
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2009 Journal Article Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substratesTsukamoto, Hideaki, Dong, Zhigang, Huang, Han, Nishimura, Tetsuro and Nogita, Kazuhiro (2009). Nanoindentation characterization of intermetallic compounds formed between Sn-Cu(-Ni) ball grid arrays and Cu substrates. Materials Science and Engineering B, 164 (1), 44-50. doi: 10.1016/j.mseb.2009.06.013 |
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2009 Journal Article Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substratesNogita, Kazuhiro, Gourlay, C. M and Nishimura, T (2009). Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates. JOM (A publication of The Minerals, Metals & Materials Society), 61 (6), 45-51. doi: 10.1007/s11837-009-0087-6 |
