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2011 Journal Article Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5Mu, Dekui, Read, Jonathan, Yang, Yafeng and Nogita, Kazuhiro (2011). Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5. Journal of Materials Research, 26 (20), 2660-2664. doi: 10.1557/jmr.2011.293 |
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2011 Journal Article Granular deformation mechanisms in semi-solid alloysGourlay, C.M., Dahle, A. K., Nagira, T., Nakatsuka, N., Nogita, K., Uesugi, K. and Yasuda, H. (2011). Granular deformation mechanisms in semi-solid alloys. Acta Materialia, 59 (12), 4933-4943. doi: 10.1016/j.actamat.2011.04.038 |
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2011 Journal Article In-situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06NiGourlay, C. M., Nogita, K., Dahle, A. K., Yamamoto, Y., Uesugi, K., Nagira, T., Yoshiya, M. and Yasuda, H. (2011). In-situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni. Acta Materialia, 59 (10), 4043-4054. doi: 10.1016/j.actamat.2011.03.028 |
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2011 Journal Article The influence of solder composition on the impact strength of lead-free solder ball grid array jointsTsukamoto, H., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. W. and Nogita, K. (2011). The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectronics Reliability, 51 (3), 657-667. doi: 10.1016/j.microrel.2010.10.012 |
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2011 Journal Article Investigation of solidification behaviour in alumnimum alloys by synchrotron radiation X-rayYasuda, H., Nogita, Kazuhiro, Yamamoto, Y., Nagira, T., Yoshiya, M., Uesugi, K., Umetani, K., Takeuchi, A. and Suzuki, Y. (2011). Investigation of solidification behaviour in alumnimum alloys by synchrotron radiation X-ray. Journal of the Japan Institute of Light Metals, 61 (12), 736-742. |
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2011 Conference Publication Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder jointsMu, D., Read, J., Yang, Y-F. and Nogita, K. (2011). Thermal expansion behavior of Cu6Sn5 in high-temperature leadfree solder joints. International Conference on Electronic Packaging (ICEP 2011), Nara, Japan, 13-15 April 2011. Nara, Japan: The Japan Institute of Electronics Packaging. |
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2011 Journal Article Eutectic modification and porosity formation in Al-Si alloysNogita, Kazuhiro (2011). Eutectic modification and porosity formation in Al-Si alloys. Journal of Japan Foundry Engineering Society, 83 (2), 167-175. |
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2011 Conference Publication The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free soldersSweatman, Keith, Read, J., Nishimura, T. and Nogita, Kazuhiro (2011). The effect of microalloy additions on the morphology and growth of interfacial intermetallic in low-Ag and no-Ag Pb-free solders. SMTA International, Fort Worth, Texas, United States, 16-20 October 2011. |
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2011 Journal Article A hydrogen storage system utilising as-cast magnesium based alloysNogita, Kazuhiro (2011). A hydrogen storage system utilising as-cast magnesium based alloys. Ceramics Japan (Bulletin of The Ceramic Society of Japan), 46 (3), 196-200. |
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2010 Journal Article Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?野北 和宏 [Nogita, Kazuhiro] (2010). Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?. エレクトロニクスの実装技術 (Erekutoronikusu no Jissō-Gijutsu) [Electronic Packaging Technology], 26 (11), 20-26. |
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2010 Journal Article Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substratesTsukamoto, H., Nishimura, T., Suenaga, S. and Nogita, K. (2010). Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates. Materials Science and Engineering B, 171 (1-3), 162-171. doi: 10.1016/j.mseb.2010.03.092 |
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2010 Journal Article The influence of Ni additions on the relative stability of eta and eta(') Cu6Sn5Schwingenschlogl, U., Di Paola, C., Nogita, K. and Gourlay, C. M. (2010). The influence of Ni additions on the relative stability of eta and eta(') Cu6Sn5. Applied Physics Letters, 96 (6) 061908, 061908-1-061908-3. doi: 10.1063/1.3310019 |
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2010 Journal Article The role of trace element segregation in the eutectic modification of hypoeutectic Al-Si alloysNogita, K, Yasuda, H, Yoshiya, M, McDonald, SD, Takeuchi, A and Suzuki, Y (2010). The role of trace element segregation in the eutectic modification of hypoeutectic Al-Si alloys. Journal of Alloys and Compounds, 489 (2), 415-420. doi: 10.1016/j.jallcom.2009.09.138 |
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2010 Journal Article Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloysNogita, Kazuhiro (2010). Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys. Intermetallics, 18 (1), 145-149. doi: 10.1016/j.intermet.2009.07.005 |
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2010 Journal Article The performance of lead-free solders during a long-distance electric vehicle raceNogita, Kazuhiro, Greaves, Mathew C., Guymer, Benjamin D., Walsh, Bernard B., Kennedy, James M., Duke, Michael D. and Nishimura, Tetsuro (2010). The performance of lead-free solders during a long-distance electric vehicle race. Transactions of The Japan Institute of Electronics Packaging, 3 (1), 104-109. |
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2010 Conference Publication Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interfaceTsukamoto, Hideaki, Dong, Zigang, Huang, Han, Nishimura, Tetsuro and Nogita, Kazuhiro (2010). Nanoindentation characterization of intermetallics formed at the lead-free solder/Cu substrate interface. Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, 2-6 August, 2010. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2446 |
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2010 Journal Article Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni AlloysGourlay, C. M., Nogita, K., Read, J. and Dahle, A. K. (2010). Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys. Journal of Electronic Materials, 39 (1), 56-69. doi: 10.1007/s11664-009-0962-5 |
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2010 Conference Publication Lead-free solders for electric vehicles - Global Green Challenge: Eco-challenge racingNogita, K., Greaves, M., Guymer, B., Walsh, B., Kennedy, J., Duke, M. and Nishimura, T. (2010). Lead-free solders for electric vehicles - Global Green Challenge: Eco-challenge racing. International Conference on Electronics Packaging 2010, Sapporo, Japan, 12-14 May 2010. Tokyo, Japan: Japan Institute of Electronics Packaging (JIEP). |
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2010 Journal Article Synchrotron micro-XRF measurements of trace element distributions in BGA type solders and solder jointsNogita, Kazuhiro, Yasuda, Hideyuki, Gourlay, Christopher M., Suenaga, Shoichi, Tsukamoto, Hideaki, McDonald, Stuart D., Takeuchi, Akihisa, Uesugi, Kentaro and Suzuki, Yoshio (2010). Synchrotron micro-XRF measurements of trace element distributions in BGA type solders and solder joints. Transactions of The Japan Institute of Electronics Packaging, 3 (1), 40-46. |
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2010 Conference Publication Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder jointsMu, Dekui, Tsukamoto, Hideaki, Huang, Han and Nogita, Kazuhiro (2010). Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, Cairns, QLD, Australia, 2-6 August, 2010. Stafa-Zurich ; United Kingdom: Trans Tech Publications. doi: 10.4028/www.scientific.net/MSF.654-656.2450 |
