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2009 Conference Publication Mechanism of Improved Hydrogen Absorption Kinetics in Cast Mg-Ni AlloysNogita, Kazuhiro (2009). Mechanism of Improved Hydrogen Absorption Kinetics in Cast Mg-Ni Alloys. Switzerland: Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/MSF.618-619.391 |
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2009 Conference Publication The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substratesNogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. TMS 2009, San Francisco, California, USA, 15-19 February 2009. |
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2009 Conference Publication Ball impact behavior of Sn-Cu (-Ni) lead-free solder jointsTsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, 1-3 July 2009. |
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2009 Conference Publication Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfacesNogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, 14-16 April, 2009. Kyoto, Japan: Japan Institute of Electronics Packaging. |
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2009 Journal Article Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free soldersNogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009). Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 (1), 46-54. |
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2009 Conference Publication The influence of Ni additions on the solidification of Sn-0.7%Cu solderT. Ventura, C. M. Gourlay, K. Nogita, M. Rappaz and A. K. Dahle (2009). The influence of Ni additions on the solidification of Sn-0.7%Cu solder. Materials and AustCeram 2009 Conference, Gold Coast, Australia, 1-3 July 2009. |
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2009 Conference Publication The Effect of Ni on Phase Stability in Cu6Sn5Nogita, K., Read, J., Tsukamoto, H., McDonald, S. D., Gourlay, C. M. and Nishimura, T. (2009). The Effect of Ni on Phase Stability in Cu6Sn5. Japan Institute of Metals Autumn Meeting 2009, Kyoto, Japan, 15-17 September 2009. |
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2009 Conference Publication Effect of intermetallic stabilization on the impact resistance of joints to BGA packagesSweatman, Keith, Suenaga, Shoichi, Miyaoka, M., Nozu, Takashi, Nogita, Kazuhiro and Nishimura, Tetsuro (2009). Effect of intermetallic stabilization on the impact resistance of joints to BGA packages. 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, 9 - 11 December 2009. Piscataway, NJ United States: I E E E. doi: 10.1109/EPTC.2009.5416526 |
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2009 Conference Publication The influence of solder composition on the impact strength of lead-free solder BGA jointsTsukamoto, Hideaki, Nogita, Kazuhiro, McDonald, Stuart, Nishimura, Tetsuro, Suenaga, Shoichi and Sweatman, Keith W. (2009). The influence of solder composition on the impact strength of lead-free solder BGA joints. 2009 TMS Annual Meeting & Exhibition, San Francisco, CA, USA, 15 - 19 February 2009. TMS. |
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2009 Conference Publication Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substratesHideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, 1-16 April 2009. Japan: Japan Institute of Electronics Packaging. |
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2008 Journal Article Copper erosion: The influence of metallurgy on copper dissolution: The rate of copper dissolutionShea, Chrys, Kenny, Jim, Rasmussen, Jean, Wable, Girish, Chu, Quyen, Teng. Shiang, Sweatman, Keith and Nogita, Kazuhiro (2008). Copper erosion: The influence of metallurgy on copper dissolution: The rate of copper dissolution. Printed Circuit Design & Fab, 25 (10), 35-38. |
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2008 Journal Article Effects of boron on microstructure in cast titanium alloysBermingham, M., McDonald, S.D., Nogita, K., St John, D.H. and Dargusch, M.S. (2008). Effects of boron on microstructure in cast titanium alloys. Scripta Materialia, 59 (5), 538-541. doi: 10.1016/j.scriptamat.2008.05.002 |
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2008 Journal Article Nickel-stabilized hexagonal (Cu, Ni)(6)Sn-5 in Sn-Cu-Ni lead-free solder alloysNogita, K. and Nishimura, T. (2008). Nickel-stabilized hexagonal (Cu, Ni)(6)Sn-5 in Sn-Cu-Ni lead-free solder alloys. Scripta Materialia, 59 (2), 191-194. doi: 10.1016/j.scriptamat.2008.03.002 |
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2008 Journal Article Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solderNogita, K., Gourlay, C., Read, J., Nishimura, T., Suenaga, S. and Dahle, A.K. (2008). Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder. Materials Transactions, 49 (3), 443-448. doi: 10.2320/matertrans.MBW200713 |
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2008 Journal Article The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNiVentura, Tina, Gourlay, Christopher M., Nogita, Kazuhiro, Nishimura, Tetsuro, Rappaz, Michel and Dahle, Arne K. (2008). The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi. Journal of Electronic Materials, 37 (1), 32-39. doi: 10.1007/s11664-007-0281-7 |
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2008 Conference Publication Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloysNogita, K., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. and Tsukamoto, H. (2008). Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys. Japanese Institute of Metals Annual Autumn Meeting 2008, Kumamoto, Japan, 23-25 September 2008. |
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2008 Journal Article The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloysGourlay, C., Read, J., Nogita, K. and Dahle, A.K. (2008). The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys. Journal of Electronic Materials, 37 (1), 51-60. doi: 10.1007/s11664-007-0248-8 |
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2008 Conference Publication Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfacesTsukamoto, H., Dong, Z., Huang, H., Nishimura, T. and Nogita, K. (2008). Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces. Materials and AustCeram Conference (MAC 2009), Gold Coast, Queensland, 1-3 July 2009. |
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2007 Journal Article Ultrahigh electron emissive carbon nanotubes with nano-sized RuO2 particles depositionKnibbe, Ruth, Nogita, Kazuhiro, Drennan, John, Noguchi, Tsuneyuki, Tatenuma, Katsuyoshi, Liu, Pou, Arai, Fumihito, Yashima, Eiji, Nishiwaki, Michiru and Kato, Shigeki (2007). Ultrahigh electron emissive carbon nanotubes with nano-sized RuO2 particles deposition. Journal of Nanoparticle Research, 9 (6), 1201-1204. doi: 10.1007/s11051-006-9207-1 |
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2007 Conference Publication Analysis of trace elements in Na-modified Al-10 wt%Si using EMPA and NanoSIMSSimensen, C.J., Hillion, F., Nielsen, O., Nogita, K. and Dahle, A.K. (2007). Analysis of trace elements in Na-modified Al-10 wt%Si using EMPA and NanoSIMS. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. Great Britain: Department of Engineering Materials, University of Sheffield. |
