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2014 Journal Article Solidification of Sn-0.7Cu-0.15Zn solder: In situ observationZeng, Guang, McDonald, Stuart David, Gourlay, Christopher M., Uesugi, Kentaro, Terada, Yasuko, Yasuda, Hideyuki and Nogita, Kazuhiro (2014). Solidification of Sn-0.7Cu-0.15Zn solder: In situ observation. Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science, 45 (2), 918-926. doi: 10.1007/s11661-013-2008-0 |
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2014 Conference Publication Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'Nogita, Kazuhiro, Kennedy, James, Amsler, John, Greaves, Matthew, Tuesley, Cameron and Nishimura, Takatoshi (2014). Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'. 2014 International Conference on Electronics Packaging, ICEP 2014, Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826652 |
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2014 Conference Publication Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kineticsZeng, Guang, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2014). Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics. 2014 International Conference on Electronics Packaging (ICEP 2014), Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826677 |
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2014 Journal Article Grain refinement for improved lead-free solder joint reliabilitySweatman, K., Nishimura, T., McDonald, S. D., Whitewick, M. and Nogita, K. (2014). Grain refinement for improved lead-free solder joint reliability. SMT Surface Mount Technology Magazine, 29 (1), 30-41. |
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2014 Journal Article Effects of element addition on the beta->alpha transformation in tinZeng, Guang, McDonald, Stuart David, Gu, Qinfen, Sweatman, Keith and Nogita, Kazuhiro (2014). Effects of element addition on the beta->alpha transformation in tin. Philosophical Magazine Letters, 94 (2), 53-62. doi: 10.1080/09500839.2013.860247 |
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2013 Journal Article Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and InZeng, Guang, McDonald, Stuart D., Gu, Qinfen, Suenaga, Shoichi, Zhang, Yong, Chen, Jianghua and Nogita, Kazuhiro (2013). Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In. Intermetallics, 43, 85-98. doi: 10.1016/j.intermet.2013.07.012 |
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2013 Journal Article Real time synchrotron X-ray observations of solidification in hypoeutectic Al-Si alloysNogita, Kazuhiro, Yasuda, Hideyuki, Prasad, Arvind, McDonald, Stuart D., Nagira, Tomoya, Nakatsuka, Noriaki, Uesugi, Kentaro and StJohn, David H. (2013). Real time synchrotron X-ray observations of solidification in hypoeutectic Al-Si alloys. Materials Characterization, 85, 134-140. doi: 10.1016/j.matchar.2013.08.015 |
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2013 Journal Article XRD study of the kinetics of transformations in tinNogita, K., Gourlay, C. M., McDonald, S. D., Suenaga, S., Read, J., Zeng, G. and Gu, Q. F. (2013). XRD study of the kinetics of transformations in tin. Philosophical Magazine, 93 (27), 3627-3647. doi: 10.1080/14786435.2013.820381 |
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2013 Journal Article A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methodsSalleh, Mohd Arif Anuar Mohd, Al Bakri, Abdullah Mohd Mustafa, Somidin, Flora, Sandu, Andrei Victor, Saud, Norainiza, Kamaruddin, Hussin, McDonald, Stuart D. and Nogita, Kazuhiro (2013). A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods. Revista De Chimie, 64 (7), 725-728. |
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2013 Journal Article Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5Wu, Y. Q., McDonald, S. D., Read, J., Huang, H. and Nogita, K. (2013). Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5. Scripta Materialia, 68 (8), 595-598. doi: 10.1016/j.scriptamat.2012.12.012 |
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2013 Journal Article Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planesMu, D., Huang, H., McDonald, S. D., Read, J. and Nogita, K. (2013). Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 566, 126-133. doi: 10.1016/j.msea.2012.12.057 |
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2013 Journal Article Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperaturesMu, Dekui, Huang, Han, McDonald, Stuart D. and Nogita, Kazuhiro (2013). Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperatures. Journal of Electronic Materials, 42 (2), 304-311. doi: 10.1007/s11664-012-2227-y |
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2013 Journal Article Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloysMcDonald, Stuart, Nogita, Kazuhiro, Read, Jonathan, Ventura, Tina and Nishimura, Tetsuro (2013). Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloys. Journal of Electronic Materials, 42 (2), 256-262. doi: 10.1007/s11664-012-2222-3 |
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2013 Journal Article Hydrogen desorption of Mg-Mg2Ni hypo-eutectic alloys in Air, Ar, C02, N2 and H2Nogita, K., McDonald, S., Duguid, A., Tsubota, M. and Gu, Q. F. (2013). Hydrogen desorption of Mg-Mg2Ni hypo-eutectic alloys in Air, Ar, C02, N2 and H2. Journal of Alloys and Compounds, 580 (SUPPL1), S140-S143. doi: 10.1016/j.jallcom.2013.01.006 |
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2013 Conference Publication Grain refinement for improved lead-Free solder joint reliabilitySweatman, K., Mcdonald, S. D., Whitewick, M., Nishimura, T. and Nogita, K. (2013). Grain refinement for improved lead-Free solder joint reliability. IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013, San Diego, United States, 19-21 February 2013. Bannockburn, IL, United States: IPC - Association Connecting Electronics Industries. |
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2013 Conference Publication Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short reviewMohd Salleh, M. A. A., McDonald, Stuart and Nogita, Kazuhiro (2013). Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review. ITMS 2013: 4th International Conference on Information Technology for Manufacturing Systems, Auckland, New Zealand, 27-29 August, 2013. Stafa-Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/AMM.421.260 |
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2013 Conference Publication Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallicsZeng, Guang, McDonald, Stuart, Gu, Qinfen and Nogita, Kazuhiro (2013). Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallics. Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, 3-7 March 2013. |
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2013 Conference Publication Crack formation and propagation mechanisms in interfacial Cu6Sn5Nogita, Kazuhiro, Mu, Dekui, McDonald, Stuart D., Read, Stuart D. and Sweatman, Keith (2013). Crack formation and propagation mechanisms in interfacial Cu6Sn5. ICEP 2013: International Conference on Electronic Packaging 2013, Osaka, Japan, 10-12 April 2013. Osaka, Japan: Japan Institute of Electronics Packaging (JIEP). |
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2013 Journal Article Real time synchrotron X-ray imaging for nucleation and growth of Cu6Sn5 in Sn-7Cu-0.05Ni high temperature lead-free solder alloysNogita, Kazuhiro, Yasuda, Hideyuki, McDonald, Stuart D. and Uesugi, Kentaro (2013). Real time synchrotron X-ray imaging for nucleation and growth of Cu6Sn5 in Sn-7Cu-0.05Ni high temperature lead-free solder alloys. Advanced Materials Research, 626, 200-204. doi: 10.4028/www.scientific.net/AMR.626.200 |
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2013 Conference Publication New phase in stoichiometric Cu6Sn5 and effect of Ni addition on phase stabilization in wide temperature rangeBarry, J., Yamamoto, T., Gu, Q., Huang, Yang, Matsumura, S. and Nogita, Kazuhiro (2013). New phase in stoichiometric Cu6Sn5 and effect of Ni addition on phase stabilization in wide temperature range. Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, 3-7 March 2013. |
