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2015 Journal Article Evidence of the hydrogen release mechanism in bulk MgH2Nogita, Kazuhiro, Tran, Xuan Q., Yamamoto, Tomokazu, Tanaka, Eishi, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Kazuhiro and Matsumura, Syo (2015). Evidence of the hydrogen release mechanism in bulk MgH2. Scientific Reports, 5 (8450) 43720, 1-5. doi: 10.1038/srep08450 |
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2015 Journal Article The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder jointsZeng, Guang, McDonald, Stuart D., Gu, Qinfen, Terada, Yasuko, Uesugi, Kentaro, Yasuda, Hideyuki and Nogita, Kazuhiro (2015). The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints. Acta Materialia, 83, 357-371. doi: 10.1016/j.actamat.2014.10.003 |
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2015 Conference Publication Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modellingPrasad, A., Liotti, E., McDonald, S. D., Nogita, K., Yasuda, H., Grant, P. S. and StJohn, D. H. (2015). Real-time synchrotron x-ray observations of equiaxed solidification of aluminium alloys and implications for modelling. 14th International Conference on Modeling of Casting, Welding and Advanced Solidification Processes, Awaji island, Hyogo, Japan, 21-26 June 2015. Bristol, United Kingdom: Institute of Physics Publishing. doi: 10.1088/1757-899X/84/1/012014 |
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2015 Conference Publication The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substratesNg, Wayne, Zeng, Guang, Nishimura, Takatoshi, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2015). The beneficial effect of Zn additions on the microstructure of SnCu and SnCuNi solder joints to Cu substrates. 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, Kyoto, Japan, 14-17 April 2015. Japan: IEEE. doi: 10.1109/ICEP-IAAC.2015.7111122 |
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2014 Journal Article Comparison of solidification behavior between in situ observation and simulation of Fe-C-Si systemHenao, Hector M., Sugiyama, Akira and Nogita, Kazuhiro (2014). Comparison of solidification behavior between in situ observation and simulation of Fe-C-Si system. Journal of Alloys and Compounds, 613, 132-138. doi: 10.1016/j.jallcom.2014.05.184 |
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2014 Journal Article Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) jointsZeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen and Nogita, Kazuhiro (2014). Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints. Intermetallics, 54, 20-27. doi: 10.1016/j.intermet.2014.05.004 |
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2014 Journal Article Kinetics of the polymorphic phase transformation of Cu6Sn5Zeng, Guang, McDonald, Stuart David, Read, Jonathan J., Gu, Qinfen and Nogita, Kazuhiro (2014). Kinetics of the polymorphic phase transformation of Cu6Sn5. Acta Materialia, 69, 135-148. doi: 10.1016/j.actamat.2014.01.027 |
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2014 Journal Article Solidification of Sn-0.7Cu-0.15Zn solder: In situ observationZeng, Guang, McDonald, Stuart David, Gourlay, Christopher M., Uesugi, Kentaro, Terada, Yasuko, Yasuda, Hideyuki and Nogita, Kazuhiro (2014). Solidification of Sn-0.7Cu-0.15Zn solder: In situ observation. Metallurgical and Materials Transactions A - Physical Metallurgy and Materials Science, 45 (2), 918-926. doi: 10.1007/s11661-013-2008-0 |
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2014 Conference Publication Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'Nogita, Kazuhiro, Kennedy, James, Amsler, John, Greaves, Matthew, Tuesley, Cameron and Nishimura, Takatoshi (2014). Lead-free solders for solar and electric vehicles- Reflections on the Bridgestone World Solar Challenge 2013 in 'Arrow1'. 2014 International Conference on Electronics Packaging, ICEP 2014, Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826652 |
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2014 Conference Publication Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kineticsZeng, Guang, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2014). Tin pest in lead-free solders? Fundamental studies on the effect of impurities on phase transformation kinetics. 2014 International Conference on Electronics Packaging (ICEP 2014), Toyama, Japan, 23-25 April 2014. Piscataway, NJ, United States: IEEE. doi: 10.1109/ICEP.2014.6826677 |
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2014 Journal Article Grain refinement for improved lead-free solder joint reliabilitySweatman, K., Nishimura, T., McDonald, S. D., Whitewick, M. and Nogita, K. (2014). Grain refinement for improved lead-free solder joint reliability. SMT Surface Mount Technology Magazine, 29 (1), 30-41. |
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2014 Journal Article Effects of element addition on the beta->alpha transformation in tinZeng, Guang, McDonald, Stuart David, Gu, Qinfen, Sweatman, Keith and Nogita, Kazuhiro (2014). Effects of element addition on the beta->alpha transformation in tin. Philosophical Magazine Letters, 94 (2), 53-62. doi: 10.1080/09500839.2013.860247 |
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2013 Journal Article Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and InZeng, Guang, McDonald, Stuart D., Gu, Qinfen, Suenaga, Shoichi, Zhang, Yong, Chen, Jianghua and Nogita, Kazuhiro (2013). Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In. Intermetallics, 43, 85-98. doi: 10.1016/j.intermet.2013.07.012 |
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2013 Journal Article Real time synchrotron X-ray observations of solidification in hypoeutectic Al-Si alloysNogita, Kazuhiro, Yasuda, Hideyuki, Prasad, Arvind, McDonald, Stuart D., Nagira, Tomoya, Nakatsuka, Noriaki, Uesugi, Kentaro and StJohn, David H. (2013). Real time synchrotron X-ray observations of solidification in hypoeutectic Al-Si alloys. Materials Characterization, 85, 134-140. doi: 10.1016/j.matchar.2013.08.015 |
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2013 Journal Article XRD study of the kinetics of transformations in tinNogita, K., Gourlay, C. M., McDonald, S. D., Suenaga, S., Read, J., Zeng, G. and Gu, Q. F. (2013). XRD study of the kinetics of transformations in tin. Philosophical Magazine, 93 (27), 3627-3647. doi: 10.1080/14786435.2013.820381 |
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2013 Journal Article A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methodsSalleh, Mohd Arif Anuar Mohd, Al Bakri, Abdullah Mohd Mustafa, Somidin, Flora, Sandu, Andrei Victor, Saud, Norainiza, Kamaruddin, Hussin, McDonald, Stuart D. and Nogita, Kazuhiro (2013). A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods. Revista De Chimie, 64 (7), 725-728. |
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2013 Journal Article Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5Wu, Y. Q., McDonald, S. D., Read, J., Huang, H. and Nogita, K. (2013). Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5. Scripta Materialia, 68 (8), 595-598. doi: 10.1016/j.scriptamat.2012.12.012 |
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2013 Journal Article Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planesMu, D., Huang, H., McDonald, S. D., Read, J. and Nogita, K. (2013). Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 566, 126-133. doi: 10.1016/j.msea.2012.12.057 |
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2013 Journal Article Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperaturesMu, Dekui, Huang, Han, McDonald, Stuart D. and Nogita, Kazuhiro (2013). Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperatures. Journal of Electronic Materials, 42 (2), 304-311. doi: 10.1007/s11664-012-2227-y |
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2013 Journal Article Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloysMcDonald, Stuart, Nogita, Kazuhiro, Read, Jonathan, Ventura, Tina and Nishimura, Tetsuro (2013). Influence of composition on the morphology of primary Cu6Sn5 in Sn-4Cu alloys. Journal of Electronic Materials, 42 (2), 256-262. doi: 10.1007/s11664-012-2222-3 |
