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2019 Conference Publication Role of Bi, Sb and in in microstructure formation and properties of Sn-0.7Cu-0.05Ni-X BGA interconnectionsBelyakov, S. A., Nishimura, T., Akaiwa, T., Sweatman, K., Nogita, K. and Gourlay, C. M. (2019). Role of Bi, Sb and in in microstructure formation and properties of Sn-0.7Cu-0.05Ni-X BGA interconnections. 2019 International Conference on Electronics Packaging (ICEP2019), Niigata, Japan, 17-20 April 2019. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers (IEEE). doi: 10.23919/ICEP.2019.8733493 |
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2019 Conference Publication Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substratesTan, Xin Fu, Abdul Razak, Nurul Razliana, Husain, Muhammad Hafiz, McDonald, Stuart and Nogita, Kazuhiro (2019). Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019, Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012007 |
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2019 Journal Article Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compoundYang, Wenhui, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Nogita, Kazuhiro and Matsumura, Syo (2019). Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compound. Scripta Materialia, 158, 1-5. doi: 10.1016/j.scriptamat.2018.08.020 |
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2019 Journal Article Al8Mn5 particle settling and interactions with oxide films in liquid AZ91 magnesium alloysPeng, L., Zeng, G., Su, T. C., Yasuda, H., Nogita, K. and Gourlay, C. M. (2019). Al8Mn5 particle settling and interactions with oxide films in liquid AZ91 magnesium alloys. JOM, 71 (7), 2235-2244. doi: 10.1007/s11837-019-03471-2 |
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2019 Conference Publication Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditionsSomidin, Flora, McDonald, Stuart D., Ye, Xiaozou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions. 2019 International Conference on Electronics Packaging (ICEP2019), Niigata, Japan, 17-20 April 2019. NEW YORK: Institute of Electrical and Electronics Engineers (IEEE). doi: 10.23919/ICEP.2019.8733594 |
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2019 Conference Publication Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloysMehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart and Stjohn, David (2019). Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloys. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012009 |
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2019 Conference Publication Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflowSomidin, Flora, McDonald, Stuart, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflow. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012006 |
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2019 Conference Publication Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substratesAbdul Razak, Nurul Razliana, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012008 |
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2018 Journal Article Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder jointSomidin, Flora, Maeno, Hiroshi, Tran, Xuan, McDonald, Stuart D., Mohd Salleh, Mohd, Matsumura, Syo and Nogita, Kazuhiro (2018). Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint. Materials, 11 (11) 2229, 2229. doi: 10.3390/ma11112229 |
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2018 Journal Article Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05NiXian, J. W., Mohd Salleh, M. A.A., Belyakov, S. A., Su, T. C., Zeng, G., Nogita, K., Yasuda, H. and Gourlay, C. M. (2018). Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni. Intermetallics, 102, 34-45. doi: 10.1016/j.intermet.2018.08.002 |
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2018 Journal Article Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of NiMehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart, Yasuda, Hideyuki and St John, David (2018). Suppression of Cu3Sn in the Sn-10Cu peritectic alloy by the addition of Ni. Journal of Alloys and Compounds, 766, 1003-1013. doi: 10.1016/j.jallcom.2018.06.251 |
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2018 Journal Article Ga-based alloys in microelectronic interconnects: a reviewLiu, Shiqian, Sweatman, Keith, McDonald, Stuart and Nogita, Kazuhiro (2018). Ga-based alloys in microelectronic interconnects: a review. Materials, 11 (8) 1384, 1384. doi: 10.3390/ma11081384 |
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2018 Journal Article The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: reviewLiu, Shiqian, McDonald, Stuart, Sweatman, Keith and Nogita, Kazuhiro (2018). The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: review. Microelectronics Reliability, 84, 170-180. doi: 10.1016/j.microrel.2018.03.038 |
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2018 Journal Article Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grainSomidin, Flora, Maeno, Hiroshi, Mohd Salleh, M. A.A., Tran, Xuan Quy, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2018). Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain. Materials Characterization, 138, 113-119. doi: 10.1016/j.matchar.2018.02.006 |
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2018 Conference Publication Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solderXuan, Quy Tran, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart D. and Nogita, Kazuhiro (2018). Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solder. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan , 1-2 November 2017 . Zurich, Switzerland : Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.9 |
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2018 Journal Article PrefaceNogita, Kazuhiro, Mohd Salleh, Mohd Arif Anuar, Abdullah, Mohd Mustafa Al Bakri, Jamaludin, Liyana and Mohd Tahir, Muhammad Faheem (2018). Preface. Solid State Phenomena, 273 SSP |
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2018 Conference Publication Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bondingSomidin, Flora, McDonald, Stuart and Nogita, Kazuhiro (2018). Formation of Cu6Sn5/(Cu, Ni)6Sn5intermetallic compounds between Cu3Sn-rich Sn-Cu/Sn-Cu-Ni powdered alloys and molten Sn by transient liquid bonding. Electronic Packaging Interconnect Technology Symposium (EPITS 2017), Fukuoka, Japan, 1-2 November 2017. Pfaffikon, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.14 |
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2018 Conference Publication Experimental study of the solidification microstructure in the Mg-Rich corner of Mg–Al–Ce systemWong, Charlotte, Styles, Mark J., Zhu, Suming, Abbott, Trevor, Nogita, Kazuhiro, McDonald, Stuart D., StJohn, David H., Gibson, Mark A. and Easton, Mark A. (2018). Experimental study of the solidification microstructure in the Mg-Rich corner of Mg–Al–Ce system. International Symposium on Magnesium Technology, 2018, Phoenix, AZ, USA, March 11, 2018-March 15, 2018. Springer International Publishing. doi: 10.1007/978-3-319-72332-7_13 |
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2018 Conference Publication Effect of reflow conditions on the intermetallic layer in solder jointsNogita, K., Somidin, F., Mohd Salleh, M. A.A., Sweatman, K., Nishimura, T., McDonald, S. D., Maeno, H. and Matsumura, S. (2018). Effect of reflow conditions on the intermetallic layer in solder joints. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kuwana, Mie, Japan, 17 - 21 April 2018. Japan: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP.2018.8374678 |
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2018 Conference Publication Influence of Bi addition on wettability and mechanical properties of Sn-0.7Cu solder alloyRamli, M. I.I., Yusof, M. S.S., Mohd Salleh, M. A.A., Said, R. M. and Nogita, K. (2018). Influence of Bi addition on wettability and mechanical properties of Sn-0.7Cu solder alloy. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, 1-2 November 2017. Zurich, Switzerland: Trans Tech Publications. doi: 10.4028/www.scientific.net/SSP.273.27 |
