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2020 Journal Article A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La systemKim, Manjin, McDonald, Stuart D., Abbott, Trevor B., Easton, Mark A., Ali, Yahia, StJohn, David H. and Nogita, Kazuhiro (2020). A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La system. Journal of Alloys and Compounds, 844 156068, 156068. doi: 10.1016/j.jallcom.2020.156068 |
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2020 Journal Article Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applicationsTan, Xin F., Gu, Qinfen, Qu, Dongdong, Yong, Adrian X.B., Yang, Wenhui, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2020). Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications. Acta Materialia, 201, 341-349. doi: 10.1016/j.actamat.2020.10.011 |
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2020 Journal Article Origin of primary Cu6Sn5 in hypoeutectic solder alloys and a method of suppression to improve mechanical propertiesMuhd Amli, S. F.N., Mohd Salleh, M. A.A., Ramli, M. I.I., Yasuda, H., Chaiprapa, J., Somidin, F., Shayfull, Z. and Nogita, K. (2020). Origin of primary Cu6Sn5 in hypoeutectic solder alloys and a method of suppression to improve mechanical properties. Journal of Electronic Materials, 50 (3), 710-722. doi: 10.1007/s11664-020-08428-9 |
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2020 Journal Article Effect of Na and cooling rate on the activation of Mg-Ni alloys for hydrogen storageKim, Manjin, McDonald, Stuart D., Ali, Yahia, Abbott, Trevor and Nogita, Kazuhiro (2020). Effect of Na and cooling rate on the activation of Mg-Ni alloys for hydrogen storage. Journal of Nanoscience and Nanotechnology, 20 (8), 5192-5200. doi: 10.1166/jnn.2020.18529 |
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2020 Journal Article The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodesTan, Xin Fu, Yong, Adrian Xiao Bin, Gu, Qinfen, Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2020). The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodes. Journal of Nanoscience and Nanotechnology, 20 (8), 5182-5191. doi: 10.1166/jnn.2020.18538 |
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2020 Journal Article Atomic locations of minor dopants and their roles in the stabilization of η−Cu6Sn5Yang, Wenhui, Quy Tran, Xuan, Yamamoto, Tomokazu, Yoshioka, Satoru, Somidin, Flora, Nogita, Kazuhiro and Matsumura, Syo (2020). Atomic locations of minor dopants and their roles in the stabilization of η−Cu6Sn5. Physical Review Materials, 4 (6) 065002. doi: 10.1103/physrevmaterials.4.065002 |
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2020 Journal Article Intermetallic formation mechanisms and properties in room-temperature Ga solderingLiu, Shiqian, Qu, Dongdong, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Intermetallic formation mechanisms and properties in room-temperature Ga soldering. Journal of Alloys and Compounds, 826 154221, 154221. doi: 10.1016/j.jallcom.2020.154221 |
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2020 Journal Article On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrateQu, D.D., Gear, M., Setargew, N., Renshaw, W., McDonald, S., StJohn, D., Paterson, D.J. and Nogita, K. (2020). On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrate. Materialia, 11 100669, 100669. doi: 10.1016/j.mtla.2020.100669 |
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2020 Journal Article Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder pasteMohd Said, R., Mohd Salleh, M. A. A., Saud, N., Ramli, M. I. I., Yasuda, H. and Nogita, K. (2020). Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste. Journal of Materials Science: Materials in Electronics, 31 (14), 11077-11094. doi: 10.1007/s10854-020-03657-4 |
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2020 Journal Article Interfacial reactions between Ga and Cu-10Ni substrate at low temperatureLiu, Shiqian, Zeng, Guang, Yang, Wenhui, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Interfacial reactions between Ga and Cu-10Ni substrate at low temperature. ACS Applied Materials and Interfaces, 12 (18) acsami.0c02032, 21045-21056. doi: 10.1021/acsami.0c02032 |
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2020 Journal Article Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profileSomidin, Flora, McDonald, Stuart David, Ye, Xiaozhou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profile. Japan Institute of Electronics Packaging. Transactions, 13, E19-004. doi: 10.5104/jiepeng.13.e19-004-1 |
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2020 Journal Article Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compoundsSomidin, Flora, Maeno, Hiroshi, Toriyama, Takaaki, McDonald, Stuart D., Yang, Wenhui, Matsumura, Syo and Nogita, Kazuhiro (2020). Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compounds. Materialia, 9 100530, 100530. doi: 10.1016/j.mtla.2019.100530 |
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2020 Journal Article The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength solderingRamli, M. I.I., Mohd Salleh, M. A.A., Yasuda, H., Chaiprapa, J. and Nogita, K. (2020). The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering. Materials and Design, 186 108281, 108281. doi: 10.1016/j.matdes.2019.108281 |
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2020 Journal Article Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room TemperatureLiu, Shiqian, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, Sweatman, Keith, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature. Journal of Electronic Materials, 49 (1), 128-139. doi: 10.1007/s11664-019-07688-4 |
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2020 Conference Publication The Independent Effects of Cooling Rate and Na Addition on Hydrogen Storage Properties in Hypo-eutectic Mg AlloysKim, Manjin, Ali, Yahia, McDonald, Stuart D., Abbott, Trevor B. and Nogita, Kazuhiro (2020). The Independent Effects of Cooling Rate and Na Addition on Hydrogen Storage Properties in Hypo-eutectic Mg Alloys. 149th TMS Annual Meeting & Exhibition, San Diego, CA, United States, 23-27 February 2020. Cham, Switzerland: Springer. doi: 10.1007/978-3-030-36647-6_43 |
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2020 Journal Article The effect of Ni and Bi additions on the solderability of Sn-0.7Cu solder coatingsRamli, M. I.I., Mohd Salleh, M. A.A., Abdullah, M. M.A., Narayanan, P., Chaiprapa, J., Mohd Said, R., Yoriya, S. and Nogita, K. (2020). The effect of Ni and Bi additions on the solderability of Sn-0.7Cu solder coatings. Journal of Electronic Materials, 49 (1), 1-12. doi: 10.1007/s11664-019-07596-7 |
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2019 Journal Article Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodesTan, Xin F., Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodes. ACS Applied Energy Materials, 3 (1) acsaem.9b02014, 141-145. doi: 10.1021/acsaem.9b02014 |
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2019 Journal Article The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodesTan, Xin F., McDonald, Stuart D., Gu, Qinfen, Wang, Lianzhou, Matsumura, Syo and Nogita, Kazuhiro (2019). The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes. Journal of Power Sources, 440 227085, 227085. doi: 10.1016/j.jpowsour.2019.227085 |
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2019 Journal Article Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reactionLiu, Shiqian, Yang, Wenhui, Kawami, Youichirou, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, McDonald, Stuart and Nogita, Kazuhiro (2019). Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reaction. ACS Applied Materials and Interfaces, 11 (35) acsami.9b10630, 32523-32532. doi: 10.1021/acsami.9b10630 |
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2019 Journal Article In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloyZeng, G., Callaghan, M. D., McDonald, S. D., Yasuda, H. and Nogita, K. (2019). In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloy. Journal of Alloys and Compounds, 797, 804-810. doi: 10.1016/j.jallcom.2019.04.153 |
