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2020 Journal Article The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength solderingRamli, M. I.I., Mohd Salleh, M. A.A., Yasuda, H., Chaiprapa, J. and Nogita, K. (2020). The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering. Materials and Design, 186 108281, 108281. doi: 10.1016/j.matdes.2019.108281 |
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2020 Journal Article Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room TemperatureLiu, Shiqian, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, Sweatman, Keith, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature. Journal of Electronic Materials, 49 (1), 128-139. doi: 10.1007/s11664-019-07688-4 |
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2020 Conference Publication The Independent Effects of Cooling Rate and Na Addition on Hydrogen Storage Properties in Hypo-eutectic Mg AlloysKim, Manjin, Ali, Yahia, McDonald, Stuart D., Abbott, Trevor B. and Nogita, Kazuhiro (2020). The Independent Effects of Cooling Rate and Na Addition on Hydrogen Storage Properties in Hypo-eutectic Mg Alloys. 149th TMS Annual Meeting & Exhibition, San Diego, CA, United States, 23-27 February 2020. Cham, Switzerland: Springer. doi: 10.1007/978-3-030-36647-6_43 |
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2020 Journal Article The effect of Ni and Bi additions on the solderability of Sn-0.7Cu solder coatingsRamli, M. I.I., Mohd Salleh, M. A.A., Abdullah, M. M.A., Narayanan, P., Chaiprapa, J., Mohd Said, R., Yoriya, S. and Nogita, K. (2020). The effect of Ni and Bi additions on the solderability of Sn-0.7Cu solder coatings. Journal of Electronic Materials, 49 (1), 1-12. doi: 10.1007/s11664-019-07596-7 |
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2019 Journal Article Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodesTan, Xin F., Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Evidence of copper separation in lithiated Cu6Sn5 lithium-ion battery anodes. ACS Applied Energy Materials, 3 (1) acsaem.9b02014, 141-145. doi: 10.1021/acsaem.9b02014 |
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2019 Journal Article The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodesTan, Xin F., McDonald, Stuart D., Gu, Qinfen, Wang, Lianzhou, Matsumura, Syo and Nogita, Kazuhiro (2019). The effects of Ni on inhibiting the separation of Cu during the lithiation of Cu6Sn5 lithium-ion battery anodes. Journal of Power Sources, 440 227085, 227085. doi: 10.1016/j.jpowsour.2019.227085 |
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2019 Journal Article Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reactionLiu, Shiqian, Yang, Wenhui, Kawami, Youichirou, Gu, Qinfen, Matsumura, Syo, Qu, Dongdong, McDonald, Stuart and Nogita, Kazuhiro (2019). Effects of Ni and Cu antisite substitution on the phase stability of CuGa2 from liquid Ga/Cu–Ni interfacial reaction. ACS Applied Materials and Interfaces, 11 (35) acsami.9b10630, 32523-32532. doi: 10.1021/acsami.9b10630 |
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2019 Journal Article In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloyZeng, G., Callaghan, M. D., McDonald, S. D., Yasuda, H. and Nogita, K. (2019). In situ studies revealing dendrite and eutectic growth during the solidification of Sn-0.7Cu-0.5Ag Pb-free solder alloy. Journal of Alloys and Compounds, 797, 804-810. doi: 10.1016/j.jallcom.2019.04.153 |
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2019 Journal Article Solidification path and microstructure evolution of Mg-3Al-14La alloy: implications for the Mg-rich corner of the Mg-Al-La phase diagramWong, Charlotte, Nogita, Kazuhiro, Styles, Mark J., Zhu, Suming, Qiu, Dong, McDonald, Stuart D., Gibson, Mark A., Abbott, Trevor B. and Easton, Mark A. (2019). Solidification path and microstructure evolution of Mg-3Al-14La alloy: implications for the Mg-rich corner of the Mg-Al-La phase diagram. Journal of Alloys and Compounds, 784, 527-534. doi: 10.1016/j.jallcom.2019.01.029 |
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2019 Journal Article Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collectorTan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Hu, Yuxiang, Wang, Lianzhou, Matsumura, Syo, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collector. Journal of Power Sources, 415, 50-61. doi: 10.1016/j.jpowsour.2019.01.034 |
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2019 Journal Article Relationship between free solder thickness to the solderability of Sn–0.7Cu–0.05Ni solder coating during solderingRamli, M.I.I., Mohd Salleh, M.A.A., Mohd Sobri, F. A., Narayanan, P., Sweatman, K. and Nogita, K. (2019). Relationship between free solder thickness to the solderability of Sn–0.7Cu–0.05Ni solder coating during soldering. Journal of Materials Science: Materials in Electronics, 30 (4), 3669-3677. doi: 10.1007/s10854-018-00647-5 |
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2019 Journal Article Experimental determination of the Sn-Cu-Ni phase diagram for Pb-free solder applicationsHenao, Hector M., Chu, Ching-shun, Solis, Juan P. and Nogita, Kazuhiro (2019). Experimental determination of the Sn-Cu-Ni phase diagram for Pb-free solder applications. Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science, 50 (1), 502-516. doi: 10.1007/s11663-018-1456-8 |
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2019 Conference Publication Role of Bi, Sb and in in microstructure formation and properties of Sn-0.7Cu-0.05Ni-X BGA interconnectionsBelyakov, S. A., Nishimura, T., Akaiwa, T., Sweatman, K., Nogita, K. and Gourlay, C. M. (2019). Role of Bi, Sb and in in microstructure formation and properties of Sn-0.7Cu-0.05Ni-X BGA interconnections. 2019 International Conference on Electronics Packaging (ICEP2019), Niigata, Japan, 17-20 April 2019. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers (IEEE). doi: 10.23919/ICEP.2019.8733493 |
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2019 Conference Publication Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substratesTan, Xin Fu, Abdul Razak, Nurul Razliana, Husain, Muhammad Hafiz, McDonald, Stuart and Nogita, Kazuhiro (2019). Temperature dependency of the growth rate of (Cu,Ni)6Sn5 on Cu-xNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019, Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012007 |
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2019 Journal Article Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compoundYang, Wenhui, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Nogita, Kazuhiro and Matsumura, Syo (2019). Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compound. Scripta Materialia, 158, 1-5. doi: 10.1016/j.scriptamat.2018.08.020 |
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2019 Journal Article Al8Mn5 particle settling and interactions with oxide films in liquid AZ91 magnesium alloysPeng, L., Zeng, G., Su, T. C., Yasuda, H., Nogita, K. and Gourlay, C. M. (2019). Al8Mn5 particle settling and interactions with oxide films in liquid AZ91 magnesium alloys. JOM, 71 (7), 2235-2244. doi: 10.1007/s11837-019-03471-2 |
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2019 Conference Publication Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditionsSomidin, Flora, McDonald, Stuart D., Ye, Xiaozou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions. 2019 International Conference on Electronics Packaging (ICEP2019), Niigata, Japan, 17-20 April 2019. NEW YORK: Institute of Electrical and Electronics Engineers (IEEE). doi: 10.23919/ICEP.2019.8733594 |
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2019 Conference Publication Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloysMehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart and Stjohn, David (2019). Effect of Zn addition on Cu3Sn formation in Sn-10Cu alloys. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012009 |
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2019 Conference Publication Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflowSomidin, Flora, McDonald, Stuart, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2019). Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflow. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012006 |
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2019 Conference Publication Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substratesAbdul Razak, Nurul Razliana, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2019). Interfacial reactions between different Sn-based lead- free solder alloys and CuNi substrates. The Electronic Packaging Interconnect Technology Symposium 2019 , Penang, Malaysia, 24–25 November 2019. Institute of Physics Publishing. doi: 10.1088/1757-899X/701/1/012008 |
