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2024 Journal Article Effects of vanadium on the properties of Sn-3wt%Ag-5wt%Cu solder alloyTan, C. Y., Mohd Salleh, M. A.A., Saud, N., Nishimura, T. and Nogita, K. (2024). Effects of vanadium on the properties of Sn-3wt%Ag-5wt%Cu solder alloy. Journal of Materials Science: Materials in Electronics, 35 (20) 1408, 1-12. doi: 10.1007/s10854-024-13164-5 |
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2024 Journal Article Characterization of Solidification and Microstructure of an Al-Zn-Mg-Si AlloyTian, He, Qu, Dongdong, Tong, Zherui, Setargew, Nega, Parker, Daniel J., StJohn, David and Nogita, Kazuhiro (2024). Characterization of Solidification and Microstructure of an Al-Zn-Mg-Si Alloy. Corrosion Science and Technology, 23 (2), 104-112. doi: 10.14773/CST.2024.23.2.104 |
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2024 Conference Publication Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder AlloysZhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535431 |
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2024 Conference Publication In-situ observations of CU6Sn5 mophological changes at the liquid SAC305/ solid OSP-Cu interfaceNogita, Kazuhiro, Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Maeno, Hiroshi and Matsumura, Syo (2024). In-situ observations of CU6Sn5 mophological changes at the liquid SAC305/ solid OSP-Cu interface. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535651 |
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2024 Conference Publication Temperature-Dependent Electrical Resistivity in Sn-Bi AlloysTan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535619 |
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2024 Journal Article Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloysHao, Qichao, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1223-1238. doi: 10.1007/s11664-023-10850-8 |
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2024 Journal Article In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloysTan, Xin F., Hao, Qichao, Zhou, Jiye, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Ikeda, Masahiko, Yasuda, Kazuhiro, Bermingham, Michael J. and Nogita, Kazuhiro (2024). In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys. Materialia, 33 101974, 1-12. doi: 10.1016/j.mtla.2023.101974 |
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2024 Journal Article Controlling pore position during transient liquid phase bonding for high-temperature soldering processesRazak, N. R. Abdul, Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffrey, Nishimura, Tetsuro and Nogita, Kazuhiro (2024). Controlling pore position during transient liquid phase bonding for high-temperature soldering processes. Transactions of The Japan Institute of Electronics Packaging, 17 E23-009. doi: 10.5104/jiepeng.17.e23-009-1 |
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2024 Journal Article The effect of temperature on the electrical resistivity of Sn-Bi alloysTan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). The effect of temperature on the electrical resistivity of Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1183-1191. doi: 10.1007/s11664-023-10849-1 |
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2023 Journal Article In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiographyHao, Qichao, Tan, Xin Fu, Liu, Shiqian, McDonald, Stuart D., Yasuda, Hideyuki and Nogita, Kazuhiro (2023). In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography. ACS Applied Electronic Materials, 5 (12), 7004-7014. doi: 10.1021/acsaelm.3c01383 |
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2023 Journal Article Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflowsChang, M.S., Mohd Salleh, M.A.A., Halin, D.S.C., Somidin, F., Yasuda, H. and Nogita, K. (2023). Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows. Journal of Materials Research and Technology, 26, 8670-8687. doi: 10.1016/j.jmrt.2023.09.139 |
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2023 Journal Article The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder jointChang, M.S., Mohd Salleh, M.A.A., Somidin, F., Halin, D.S.C., Yasuda, H. and Nogita, K. (2023). The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder joint. Materials Science and Engineering A: Structural Materials: Properties, Microstructures and Processing, 882 145457, 145457. doi: 10.1016/j.msea.2023.145457 |
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2023 Journal Article Strategies to enhance hydrogen storage performances in bulk Mg-based hydridesTan, Xin F., Kim, Manjin, Yasuda, Kazuhiro and Nogita, Kazuhiro (2023). Strategies to enhance hydrogen storage performances in bulk Mg-based hydrides. Journal of Materials Science and Technology, 153, 139-158. doi: 10.1016/j.jmst.2022.12.054 |
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2023 Journal Article Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloysYao, Hu, Zeng, Guang, Tan, Xin F., Gu, Qinfen, Nogita, Kazuhiro, Guo, Jing and Li, Qian (2023). Hydrogen storage performance and phase transformations in as-cast and extruded Mg-Ni-Gd-Y-Zn-Cu alloys. Journal of Materials Science and Technology, 151, 162-177. doi: 10.1016/j.jmst.2022.12.015 |
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2023 Journal Article The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloysTan, Xin F., Hao, Qichao, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Bermingham, Michael and Nogita, Kazuhiro (2023). The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys. Materials Characterization, 201 112934, 1-11. doi: 10.1016/j.matchar.2023.112934 |
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2023 Journal Article Effects of multiple reflow on the formation of primary crystals in Sn-3.5Ag and solder joint strength: experimental and finite element analysisAmli, Siti Farahnabilah Muhd, Salleh, Mohd Arif Anuar Mohd, Aziz, Mohd Sharizal Abdul, Yasuda, Hideyuki, Nogita, Kazuhiro, Abdullah, Mohd Mustafa Al Bakri, Nemes, Ovidiu, Sandu, Andrei Victor and Vizureanu, Petrica (2023). Effects of multiple reflow on the formation of primary crystals in Sn-3.5Ag and solder joint strength: experimental and finite element analysis. Materials, 16 (12) 4360, 1-17. doi: 10.3390/ma16124360 |
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2023 Journal Article The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloysZhou, Jiye, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2023). The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys. JOM, 75 (8), 3149-3161. doi: 10.1007/s11837-023-05870-y |
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2023 Conference Publication Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy studyTan, Xin F., Zhou, Jiye, McDonald, Stuart D., Ikeda, Masahiko and Nogita, Kazuhiro (2023). Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study. International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep58572.2023.10129743 |
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2023 Conference Publication Controlling porosity during transient liquid phase bonding for high-temperature soldering processesAbdul Razak, Nurul R., Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffery, Nishimura, Tetsuro and Nogita, Kazuhiro (2023). Controlling porosity during transient liquid phase bonding for high-temperature soldering processes. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep58572.2023.10129722 |
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2023 Conference Publication The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%BiYe, Xiaozhou, Tao, Lei, McDonald, Stuart D., Tan, Xin Fu, Sweatman, Keith and Nogita, Kazuhiro (2023). The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129707 |
