|
2025 Conference Publication Temperature dependent crystallographic changes in hypoeutectic Sn-Bi alloysHao, Qichao, Tan, Xin F., McDonald, Stuart D. and Nogita, Kazuhiro (2025). Temperature dependent crystallographic changes in hypoeutectic Sn-Bi alloys. EPITS 2024, Ho Chi Minh City, Vietnam, 26–27 August 2024. Singapore: Springer Nature. doi: 10.1007/978-981-96-2871-1_11 |
|
2025 Journal Article Thermal stability of Bi in Sn-Cu and Sn-Ag-Cu based high strength Pb-free solder alloysZhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2025). Thermal stability of Bi in Sn-Cu and Sn-Ag-Cu based high strength Pb-free solder alloys. Transactions of The Japan Institute of Electronics Packaging, 18, E24-006-1-E24-006-7. doi: 10.5104/jiepeng.18.e24-006-1 |
|
2025 Conference Publication Solution hardening effect of Bi additions to the β-In3Sn phase in In-Sn-Bi low temperature solder alloys via alloy design and heat treatmentZhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2025). Solution hardening effect of Bi additions to the β-In3Sn phase in In-Sn-Bi low temperature solder alloys via alloy design and heat treatment. Green Materials and Electronic Packaging Interconnect Technology Symposium (EPITS 2024), Ho Chi Minh City, Vietnam, 26-27 August 2024. New York, NY, United States: Springer New York. doi: 10.1007/978-981-96-2871-1_10 |
|
2024 Other Outputs Tensile properties of hypo-eutectic Sn37Bi and eutectic Sn57BiYe, Xiaozhou, Nogita, Kazuhiro, Tan, Xin Fu and McDonald, Stuart (2024). Tensile properties of hypo-eutectic Sn37Bi and eutectic Sn57Bi. The University of Queensland. (Dataset) doi: 10.48610/20ec053 |
|
2024 Journal Article Cu-atom locations in rocksalt SnTe thermoelectric alloyKawami, Youichirou, Tran, Xuan Quy, Yamamoto, Tomokazu, Yoshioka, Satoru, Murakami, Yasukazu, Matsumura, Syo, Nogita, Kazuhiro and Zou, Jin (2024). Cu-atom locations in rocksalt SnTe thermoelectric alloy. Advanced Materials, 36 (47) 2410508, 1-16. doi: 10.1002/adma.202410508 |
|
2024 Conference Publication Wave soldering with low temperature solder - a case studySweatman, Keith, Nishimura, Takatoshi, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2024). Wave soldering with low temperature solder - a case study. SMTA International Conference & Exposition 2024, Rosemont, IL United States, 20-24 October 2024. Eden Prairie, MN United States: Surface Mount Technology Association. doi: 10.37665/smppdzo77483 |
|
2024 Journal Article The effect of in concentration and temperature on dissolution and precipitation in Sn–Bi alloysHao, Qichao, Tan, Xinfu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2024). The effect of in concentration and temperature on dissolution and precipitation in Sn–Bi alloys. Materials, 17 (17) 4372, 1-17. doi: 10.3390/ma17174372 |
|
2024 Journal Article Phase transformations and mechanical properties in In–Bi–Sn alloys as a result of low-temperature storageZhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2024). Phase transformations and mechanical properties in In–Bi–Sn alloys as a result of low-temperature storage. Materials, 17 (15) 3669, 3669. doi: 10.3390/ma17153669 |
|
2024 Journal Article Characterisation of Fe distribution in the liquid–solid boundary of Al–Zn–Mg–Si alloy using synchrotron X-ray fluorescence microscopyTian, He, Qu, Dongdong, Setargew, Nega, Parker, Daniel J., Paterson, David J., StJohn, David and Nogita, Kazuhiro (2024). Characterisation of Fe distribution in the liquid–solid boundary of Al–Zn–Mg–Si alloy using synchrotron X-ray fluorescence microscopy. Materials, 17 (14) 3583, 1-17. doi: 10.3390/ma17143583 |
|
2024 Journal Article Effects of vanadium on the properties of Sn-3wt%Ag-5wt%Cu solder alloyTan, C. Y., Mohd Salleh, M. A.A., Saud, N., Nishimura, T. and Nogita, K. (2024). Effects of vanadium on the properties of Sn-3wt%Ag-5wt%Cu solder alloy. Journal of Materials Science: Materials in Electronics, 35 (20) 1408, 1-12. doi: 10.1007/s10854-024-13164-5 |
|
2024 Journal Article Characterization of Solidification and Microstructure of an Al-Zn-Mg-Si AlloyTian, He, Qu, Dongdong, Tong, Zherui, Setargew, Nega, Parker, Daniel J., StJohn, David and Nogita, Kazuhiro (2024). Characterization of Solidification and Microstructure of an Al-Zn-Mg-Si Alloy. Corrosion Science and Technology, 23 (2), 104-112. doi: 10.14773/CST.2024.23.2.104 |
|
2024 Conference Publication Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder AlloysZhou, Jiye, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535431 |
|
2024 Conference Publication In-situ observations of CU6Sn5 mophological changes at the liquid SAC305/ solid OSP-Cu interfaceNogita, Kazuhiro, Tan, Xin F., Somidin, Flora, McDonald, Stuart D., Maeno, Hiroshi and Matsumura, Syo (2024). In-situ observations of CU6Sn5 mophological changes at the liquid SAC305/ solid OSP-Cu interface. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535651 |
|
2024 Conference Publication Temperature-Dependent Electrical Resistivity in Sn-Bi AlloysTan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys. 2024 International Conference on Electronics Packaging (ICEP), Toyama, Japan, 17-20 April 2024. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep61562.2024.10535619 |
|
2024 Journal Article Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloysHao, Qichao, Tan, Xin F., McDonald, Stuart D., Sweatman, Keith, Akaiwa, Tetsuya and Nogita, Kazuhiro (2024). Investigating the effects of rapid precipitation of Bi in Sn on the shear strength of BGA Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1223-1238. doi: 10.1007/s11664-023-10850-8 |
|
2024 Journal Article In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloysTan, Xin F., Hao, Qichao, Zhou, Jiye, Gu, Qinfen, McDonald, Stuart D., Sweatman, Keith, Ikeda, Masahiko, Yasuda, Kazuhiro, Bermingham, Michael J. and Nogita, Kazuhiro (2024). In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys. Materialia, 33 101974, 1-12. doi: 10.1016/j.mtla.2023.101974 |
|
2024 Journal Article Controlling pore position during transient liquid phase bonding for high-temperature soldering processesRazak, N. R. Abdul, Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffrey, Nishimura, Tetsuro and Nogita, Kazuhiro (2024). Controlling pore position during transient liquid phase bonding for high-temperature soldering processes. Transactions of The Japan Institute of Electronics Packaging, 17 E23-009. doi: 10.5104/jiepeng.17.e23-009-1 |
|
2024 Journal Article The effect of temperature on the electrical resistivity of Sn-Bi alloysTan, Xin F., Hao, Qichao, Zhou, Jiye, McDonald, Stuart D., Sweatman, Keith and Nogita, Kazuhiro (2024). The effect of temperature on the electrical resistivity of Sn-Bi alloys. Journal of Electronic Materials, 53 (3), 1183-1191. doi: 10.1007/s11664-023-10849-1 |
|
2023 Journal Article In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiographyHao, Qichao, Tan, Xin Fu, Liu, Shiqian, McDonald, Stuart D., Yasuda, Hideyuki and Nogita, Kazuhiro (2023). In situ observation of the Ga- and Cu-based substrate reaction by synchrotron microradiography. ACS Applied Electronic Materials, 5 (12), 7004-7014. doi: 10.1021/acsaelm.3c01383 |
|
2023 Journal Article Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflowsChang, M.S., Mohd Salleh, M.A.A., Halin, D.S.C., Somidin, F., Yasuda, H. and Nogita, K. (2023). Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows. Journal of Materials Research and Technology, 26, 8670-8687. doi: 10.1016/j.jmrt.2023.09.139 |
