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2023 Journal Article The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloysZhou, Jiye, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D. and Nogita, Kazuhiro (2023). The temperature-dependent phase transformation and microstructural characterisation in In-Sn solder alloys. JOM, 75 (8), 3149-3161. doi: 10.1007/s11837-023-05870-y |
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2023 Conference Publication Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy studyTan, Xin F., Zhou, Jiye, McDonald, Stuart D., Ikeda, Masahiko and Nogita, Kazuhiro (2023). Evolution of the Sn-Bi solder microstructure vs. temperature – an in- situ scanning electron microscopy study. International Conference on Electronics Packaging, ICEP 2023, Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep58572.2023.10129743 |
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2023 Conference Publication Controlling porosity during transient liquid phase bonding for high-temperature soldering processesAbdul Razak, Nurul R., Tan, Xin F., McDonald, Stuart D., Bermingham, Michael J., Venezuela, Jeffery, Nishimura, Tetsuro and Nogita, Kazuhiro (2023). Controlling porosity during transient liquid phase bonding for high-temperature soldering processes. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/icep58572.2023.10129722 |
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2023 Conference Publication The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%BiYe, Xiaozhou, Tao, Lei, McDonald, Stuart D., Tan, Xin Fu, Sweatman, Keith and Nogita, Kazuhiro (2023). The effects of solution treatment and room temperature ageing on mechanical properties of Sn-37wt%Bi and Sn-57wt%Bi. 2023 International Conference on Electronics Packaging (ICEP), Kumamoto, Japan, 19-22 April 2023. Piscataway, NJ, United States: IEEE. doi: 10.23919/icep58572.2023.10129707 |
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2023 Journal Article Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bathQu, Dongdong, Gear, Matthew, Gu, Qinfen, Setargew, Nega, Renshaw, Wayne, McDonald, Stuart, StJohn, David and Nogita, Kazuhiro (2023). Phase stability of dross particles in hot-dip Zn-55wt%Al-1.6wt%Si galvanizing bath. Materials, 16 (3) 1211, 1211. doi: 10.3390/ma16031211 |
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2023 Conference Publication Fluidity and microstructural analysis of Al–Ni alloys with varied Ni concentrationsHari, Vigneshwar, Xu, Dong, McDonald, Stuart D., Tong, Zherui, Qu, Dongdong and Nogita, Kazuhiro (2023). Fluidity and microstructural analysis of Al–Ni alloys with varied Ni concentrations. TMS 2023 Annual Meeting & Exhibition, San Diego, CA, United States, 19-23 March 2023. Cham, Switzerland: Springer Nature Switzerland. doi: 10.1007/978-3-031-22532-1_62 |
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2023 Journal Article Events That Led Me to Establish the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) at the University of Queensland, Australia オーストラリア Queensland 大学で，日本スペリア電子材料製造研究センター (NS CMEM) を設立してみた。Nogita, Kazuhiro (2023). Events That Led Me to Establish the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) at the University of Queensland, Australia オーストラリア Queensland 大学で，日本スペリア電子材料製造研究センター (NS CMEM) を設立してみた。. Journal of Japan Institute of Electronics Packaging, 26 (6), 571-576. doi: 10.5104/jiep.26.571 |
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2022 Journal Article Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic jointsZhou, Jiye, Tan, Xin Fu, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Mechanical properties and microstructure of binary In-Sn alloys for flexible low temperature electronic joints. Materials, 15 (23) 8321, 1-12. doi: 10.3390/ma15238321 |
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2022 Journal Article Grain refinement of primary Cu6Sn5 in the Sn-3wt%Ag-5wt%Cu alloy by GeTan, C.Y., Salleh, M.A.A.Mohd, Saud, N., Chaiprapa, J. and Nogita, K. (2022). Grain refinement of primary Cu6Sn5 in the Sn-3wt%Ag-5wt%Cu alloy by Ge. Journal of Materials Research and Technology, 21, 3301-3312. doi: 10.1016/j.jmrt.2022.10.128 |
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2022 Journal Article Negative thermal expansion and phase transition of low-temperature Mg2NiH4Luo, Qun, Cai, Qi, Gu, Qinfen, Shi, Yu, Liu, Bin, Tran, Xuan Quy, Matsumura, Syo, Zhang, Tong-Yi, Nogita, Kazuhiro, Lyu, Tao, Li, Qian and Pan, Fusheng (2022). Negative thermal expansion and phase transition of low-temperature Mg2NiH4. Journal of Magnesium and Alloys, 11 (9), 3338-3349. doi: 10.1016/j.jma.2022.09.012 |
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2022 Journal Article Understanding micro and atomic structures of secondary phases in Cu‐doped SnTeKawami, Youichirou, Tran, Xuan Quy, Aso, Kohei, Yamamoto, Tomokazu, Wang, Yuan, Li, Meng, Yago, Anya, Matsumura, Syo, Nogita, Kazuhiro and Zou, Jin (2022). Understanding micro and atomic structures of secondary phases in Cu‐doped SnTe. Small, 18 (42) 2204225, 1-12. doi: 10.1002/smll.202204225 |
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2022 Journal Article Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storageTan, Xin F., Kim, Manjin, Gu, Qinfen, Pinzon Piraquive, Julio, Zeng, Guang, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Na-modified cast hypo-eutectic Mg–Mg2Si alloys for solid-state hydrogen storage. Journal of Power Sources, 538 231538, 231538. doi: 10.1016/j.jpowsour.2022.231538 |
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2022 Journal Article Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder jointAbdul Razak, N. R., Tan, X. F., Mohd Salleh, M. A. A., McDonald, S. D., Bermingham, M. J., Yasuda, H. and Nogita, K. (2022). Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint. Materials Today Communications, 31 103248, 1-12. doi: 10.1016/j.mtcomm.2022.103248 |
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2022 Journal Article Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by MgTan, C. Y., Salleh, M.A.A. Mohd, Tan, X. F., Yasuda, H., Saud, N., Ramli, M. I.I. and Nogita, K. (2022). Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg. Materials Today Communications, 31 103221, 103221. doi: 10.1016/j.mtcomm.2022.103221 |
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2022 Journal Article Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solderAmli, S. F. Muhd, Salleh, M. A. A. Mohd, Ramli, M. I. I., Aziz, M. S. Abdul, Yasuda, H., Chaiprapa, J. and Nogita, K. (2022). Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder. Journal of Materials Science: Materials in Electronics, 33 (17), 14249-14263. doi: 10.1007/s10854-022-08353-z |
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2022 Journal Article Cobalt‐doped Cu6Sn5 lithium‐ion battery anodes with enhanced electrochemical propertiesTan, Xin F., Tao, Shiwei, Ran, Lingbing, Knibbe, Ruth and Nogita, Kazuhiro (2022). Cobalt‐doped Cu6Sn5 lithium‐ion battery anodes with enhanced electrochemical properties. Nano Select, 3 (8), 1264-1276. doi: 10.1002/nano.202200056 |
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2022 Journal Article Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption processKim, Manjin, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D., Ali, Yahia, Matsumura, Syo and Nogita, Kazuhiro (2022). Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process. International Journal of Hydrogen Energy, 47 (36), 16132-16143. doi: 10.1016/j.ijhydene.2022.03.102 |
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2022 Journal Article Effect of kaolin geopolymer ceramics addition on the microstructure and shear strength of Sn-3.0Ag-0.5Cu solder joints during multiple reflowZaimi, Nur Syahirah Mohamad, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al-Bakri, Nadzri, Nur Izzati Muhammad, Sandu, Andrei Victor, Vizureanu, Petrica, Ramli, Mohd Izrul Izwan, Nogita, Kazuhiro, Yasuda, Hideyuki and Sandu, Ioan Gabriel (2022). Effect of kaolin geopolymer ceramics addition on the microstructure and shear strength of Sn-3.0Ag-0.5Cu solder joints during multiple reflow. Materials, 15 (8) 2758, 2758. doi: 10.3390/ma15082758 |
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2022 Journal Article The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloyChang, M. S., Salleh, M. A. A. Mohd, Halin, D. S. C., Ramli, M. I. I., Yasuda, H. and Nogita, K. (2022). The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy. Journal of Alloys and Compounds, 897 163172, 1-10. doi: 10.1016/j.jallcom.2021.163172 |
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2022 Journal Article Liquid/solid interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu dissimilar joints during soldering at low temperature by in-situ synchrotron imagingRamli, M. I.I., Salleh, M. A. A. Mohd, Nishimura, T., Yasuda, H., Zaimi, N. S. Mohamad and Nogita, K. (2022). Liquid/solid interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu dissimilar joints during soldering at low temperature by in-situ synchrotron imaging. JOM, 74 (7), 2760-2769. doi: 10.1007/s11837-022-05229-9 |
