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2022 Journal Article Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder jointAbdul Razak, N. R., Tan, X. F., Mohd Salleh, M. A. A., McDonald, S. D., Bermingham, M. J., Yasuda, H. and Nogita, K. (2022). Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint. Materials Today Communications, 31 103248, 103248. doi: 10.1016/j.mtcomm.2022.103248 |
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2022 Journal Article Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by MgTan, C. Y., Salleh, M.A.A. Mohd, Tan, X. F., Yasuda, H., Saud, N., Ramli, M. I.I. and Nogita, K. (2022). Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg. Materials Today Communications, 31 103221, 103221. doi: 10.1016/j.mtcomm.2022.103221 |
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2022 Journal Article Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solderAmli, S. F. Muhd, Salleh, M. A. A. Mohd, Ramli, M. I. I., Aziz, M. S. Abdul, Yasuda, H., Chaiprapa, J. and Nogita, K. (2022). Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder. Journal of Materials Science: Materials in Electronics, 33 (17), 14249-14263. doi: 10.1007/s10854-022-08353-z |
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2022 Journal Article Cobalt‐doped Cu6Sn5 lithium‐ion battery anodes with enhanced electrochemical propertiesTan, Xin F., Tao, Shiwei, Ran, Lingbing, Knibbe, Ruth and Nogita, Kazuhiro (2022). Cobalt‐doped Cu6Sn5 lithium‐ion battery anodes with enhanced electrochemical properties. Nano Select, 3 (8), 1264-1276. doi: 10.1002/nano.202200056 |
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2022 Journal Article Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption processKim, Manjin, Tan, Xin Fu, Gu, Qinfen, McDonald, Stuart D., Ali, Yahia, Matsumura, Syo and Nogita, Kazuhiro (2022). Hydrogen sorption behaviour of Mg-5wt.%La alloys after the initial hydrogen absorption process. International Journal of Hydrogen Energy, 47 (36), 16132-16143. doi: 10.1016/j.ijhydene.2022.03.102 |
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2022 Journal Article Effect of kaolin geopolymer ceramics addition on the microstructure and shear strength of Sn-3.0Ag-0.5Cu solder joints during multiple reflowZaimi, Nur Syahirah Mohamad, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al-Bakri, Nadzri, Nur Izzati Muhammad, Sandu, Andrei Victor, Vizureanu, Petrica, Ramli, Mohd Izrul Izwan, Nogita, Kazuhiro, Yasuda, Hideyuki and Sandu, Ioan Gabriel (2022). Effect of kaolin geopolymer ceramics addition on the microstructure and shear strength of Sn-3.0Ag-0.5Cu solder joints during multiple reflow. Materials, 15 (8) 2758, 2758. doi: 10.3390/ma15082758 |
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2022 Journal Article The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloyChang, M. S., Salleh, M. A. A. Mohd, Halin, D. S. C., Ramli, M. I. I., Yasuda, H. and Nogita, K. (2022). The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy. Journal of Alloys and Compounds, 897 163172, 1-10. doi: 10.1016/j.jallcom.2021.163172 |
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2022 Journal Article Liquid/solid interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu dissimilar joints during soldering at low temperature by in-situ synchrotron imagingRamli, M. I.I., Salleh, M. A. A. Mohd, Nishimura, T., Yasuda, H., Zaimi, N. S. Mohamad and Nogita, K. (2022). Liquid/solid interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu dissimilar joints during soldering at low temperature by in-situ synchrotron imaging. JOM, 74 (7), 2760-2769. doi: 10.1007/s11837-022-05229-9 |
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2022 Journal Article Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature solderingTan, Xin F., Gu, Qinfen, Bermingham, Michael, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Systematic investigation of the effect of Ni concentration in Cu-xNi/Sn couples for high temperature soldering. Acta Materialia, 226 117661. doi: 10.1016/j.actamat.2022.117661 |
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2022 Conference Publication Effect of Microstructural Refinement and Na Addition on Hydrogenation Kinetics of Cast Mg–Al–La Alloy During the First Hydrogen Absorption ProcessKim, Manjin, McDonald, Stuart D., Ali, Yahia, Abbott, Trevor B. and Nogita, Kazuhiro (2022). Effect of Microstructural Refinement and Na Addition on Hydrogenation Kinetics of Cast Mg–Al–La Alloy During the First Hydrogen Absorption Process. 23rd Magnesium Technology Symposium at the 151st TMS Annual Meeting and Exhibition, Anaheim, CA, United States, 27 February - 3 March 2022. Cham, Switzlerland: Springer International Publishing. doi: 10.1007/978-3-030-92533-8_12 |
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2022 Journal Article The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloysHao, Qichao, Tan, Xin F., Gu, Qinfen, Sweatman, Keith, McDonald, Stuart D. and Nogita, Kazuhiro (2022). The effects of temperature and solute diffusion on volume change in Sn-Bi solder alloys. JOM, 74 (4), 1739-1750. doi: 10.1007/s11837-021-05145-4 |
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2022 Journal Article Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5Yang, Wenhui, Tran, Xuan Quy, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Tan, Xin Fu, Kawami, Youichirou, Nogita, Kazuhiro and Matsumura, Syo (2022). Atomic insights into the ordered solid solutions of Ni and Au in η-Cu6Sn5. Acta Materialia, 224 117513, 117513. doi: 10.1016/j.actamat.2021.117513 |
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2022 Journal Article In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopyTan, Xin F., Somidin, Flora, McDonald, Stuart D., Bermingham, Michael J., Maeno, Hiroshi, Matsumura, Syo and Nogita, Kazuhiro (2022). In situ observation of liquid solder alloys and solid substrate reactions using high-voltage transmission electron microscopy. Materials, 15 (2) 510, 510. doi: 10.3390/ma15020510 |
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2022 Journal Article Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a reviewZeng, Guang, Liu, Shiqian, Gu, Qinfen, Zheng, Zebang, Yasuda, Hideyuki, McDonald, Stuart D. and Nogita, Kazuhiro (2022). Investigation on the solidification and phase transformation in Pb-free solders using in situ synchrotron radiography and diffraction: a review. Acta Metallurgica Sinica, 35 (1), 49-66. doi: 10.1007/s40195-021-01350-x |
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2022 Conference Publication Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solderHao, Qichao, Tan, Xin Fu, McDonald, Stuart D., Sweatman, Keith, Nishimura, Takatoshi, Nishimura, Tetsuro and Nogita, Kazuhiro (2022). Comparison of the mechanical properties of conventional Pb-free solders and eutectic Sn-Bi solder. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795406 |
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2022 Conference Publication Maximum fluidity length of commercial solder alloys and the effects of Ni and Co in Sn-0.7wt%Cu solder alloysNogita, Kazuhiro, Read, Jonathan, McDonald, Stuart D., Xu, Dong and Nishimura, Tetsuro (2022). Maximum fluidity length of commercial solder alloys and the effects of Ni and Co in Sn-0.7wt%Cu solder alloys. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795610 |
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2022 Conference Publication Investigation of the effects of surface finish and reflow conditions on the microstructure and mechanical properties of Sn-based soldersSomidin, Flora, Akaiwa, Tetsuya, McDonald, Stuart D., Nishimura, Tetsuro, Ye, Xiaozhou, Smith, Anthony, Zhou, Jiye and Nogita, Kazuhiro (2022). Investigation of the effects of surface finish and reflow conditions on the microstructure and mechanical properties of Sn-based solders. International Conference on Electronics Packaging (ICEP), Sapporo, Japan, 11-14 May 2022. Piscataway, NJ, United States: Institute of Electrical and Electronics Engineers. doi: 10.23919/ICEP55381.2022.9795417 |
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2021 Journal Article Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regimeMehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart D., Yasuda, Hideyuki and StJohn, David H. (2021). Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime. Acta Materialia, 220 117295, 1-11. doi: 10.1016/j.actamat.2021.117295 |
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2021 Journal Article Re-evaluation of the mechanical properties and creep resistance of commercial magnesium die-casting alloy AE44Zhu, Suming, Abbott, Trevor B., Nie, Jian-Feng, Ang, Hua Qian, Qiu, Dong, Nogita, Kazuhiro and Easton, Mark A. (2021). Re-evaluation of the mechanical properties and creep resistance of commercial magnesium die-casting alloy AE44. Journal of Magnesium and Alloys, 9 (5), 1537-1545. doi: 10.1016/j.jma.2021.04.016 |
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2021 Journal Article Rapid fabrication of tin-copper anodes for lithium-ion battery applicationsTan, Xin Fu, Belyakov, Sergey A., Su, Te-Cheng, Gu, Qinfen, Liu, Shiqian, McDonald, Stuart D., Gourlay, Christopher M., Yasuda, Hideyuki, Matsumura, Syo and Nogita, Kazuhiro (2021). Rapid fabrication of tin-copper anodes for lithium-ion battery applications. Journal of Alloys and Compounds, 867 159031, 159031. doi: 10.1016/j.jallcom.2021.159031 |
