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2021 Journal Article Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi jointsLiu, Shiqian, Tan, Xin Fu, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2021). Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of Cu-xNi/Ga/Cu-xNi joints. Intermetallics, 133 107168, 1-9. doi: 10.1016/j.intermet.2021.107168 |
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2021 Journal Article The effect of Na addition on the first hydrogen absorption kinetics of cast hypoeutectic Mg–La alloysKim, Manjin, Gu, Qinfen, Hussain, Tanveer, Ali, Yahia, Abbott, Trevor B. and Nogita, Kazuhiro (2021). The effect of Na addition on the first hydrogen absorption kinetics of cast hypoeutectic Mg–La alloys. International Journal of Hydrogen Energy, 46 (53), 27096-27106. doi: 10.1016/j.ijhydene.2021.05.180 |
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2021 Journal Article In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiographyAbdul Razak, N.R., Tan, X.F., Somidin, F., Yasuda, H., McDonald, S.D. and Nogita, K. (2021). In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography. Materials Letters, 291 129520, 1-4. doi: 10.1016/j.matlet.2021.129520 |
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2021 Journal Article Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG)Teoh, A.L., Mohd Salleh, M.A.A., Halin, D.S.C., Foo, K.L., Abdul Razak, N.R., Yasuda, H. and Nogita, K. (2021). Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG). Journal of Materials Research and Technology, 12, 1700-1714. doi: 10.1016/j.jmrt.2021.03.068 |
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2021 Journal Article Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu3Sn phase in Sn-10 wt.%Cu AlloysMehreen, Syeda U., Nogita, Kazuhiro, McDonald, Stuart D., Yasuda, Hideyuki and StJohn, David H. (2021). Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu3Sn phase in Sn-10 wt.%Cu Alloys. Journal of Electronic Materials, 50 (3), 881-892. doi: 10.1007/s11664-020-08709-3 |
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2021 Journal Article Microstructure evolution of Ag/TiO2 thin filmHalin, Dewi Suriyani Che, Razak, Kamrosni Abdul, Mohd Salleh, Mohd Arif Anuar, Ramli, Mohd Izrul Izwan, Abdullah, Mohd Mustafa Al Bakri, Azhari, Ayu Wazira, Nogita, Kazuhiro, Yasuda, Hideyuki, Nabiałek, Marcin and Wysłocki, Jerzy J. (2021). Microstructure evolution of Ag/TiO2 thin film. Magnetochemistry, 7 (1) 14, 1-10. doi: 10.3390/magnetochemistry7010014 |
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2021 Journal Article Evaluation of wave-like nucleation events in Al-4%Si alloys with addition of TiB2 particles by time-resolved and in-situ observation Yasuda, Hideyuki and Nogita, Kazuhiro (2021). Evaluation of wave-like nucleation events in Al-4%Si alloys with addition of TiB2 particles by time-resolved and in-situ observation . Keikinzoku/Journal of Japan Institute of Light Metals, 71 (1), 22-29. doi: 10.2464/jilm.71.22 |
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2021 Journal Article Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and StrengthMuhd Amli, S. F. N., Mohd Salleh, M. A. A., Ramli, M. I. I., Abdul Razak, N. R., Yasuda, H., Chaiprapa, J. and Nogita, K. (2021). Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength. Journal of Electronic Materials, 50 (3), 855-868. doi: 10.1007/s11664-020-08641-6 |
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2020 Journal Article A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La systemKim, Manjin, McDonald, Stuart D., Abbott, Trevor B., Easton, Mark A., Ali, Yahia, StJohn, David H. and Nogita, Kazuhiro (2020). A rational interpretation of solidification microstructures in the Mg-rich corner of the Mg–Al–La system. Journal of Alloys and Compounds, 844 156068, 156068. doi: 10.1016/j.jallcom.2020.156068 |
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2020 Journal Article Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applicationsTan, Xin F., Gu, Qinfen, Qu, Dongdong, Yong, Adrian X.B., Yang, Wenhui, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2020). Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications. Acta Materialia, 201, 341-349. doi: 10.1016/j.actamat.2020.10.011 |
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2020 Journal Article Origin of primary Cu6Sn5 in hypoeutectic solder alloys and a method of suppression to improve mechanical propertiesMuhd Amli, S. F.N., Mohd Salleh, M. A.A., Ramli, M. I.I., Yasuda, H., Chaiprapa, J., Somidin, F., Shayfull, Z. and Nogita, K. (2020). Origin of primary Cu6Sn5 in hypoeutectic solder alloys and a method of suppression to improve mechanical properties. Journal of Electronic Materials, 50 (3), 710-722. doi: 10.1007/s11664-020-08428-9 |
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2020 Journal Article The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodesTan, Xin Fu, Yong, Adrian Xiao Bin, Gu, Qinfen, Yang, Wenhui, Aso, Kohei, Matsumura, Syo, McDonald, Stuart D. and Nogita, Kazuhiro (2020). The effects of trace Sb and Zn additions on Cu6Sn5 lithium-ion battery anodes. Journal of Nanoscience and Nanotechnology, 20 (8), 5182-5191. doi: 10.1166/jnn.2020.18538 |
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2020 Journal Article Effect of Na and cooling rate on the activation of Mg-Ni alloys for hydrogen storageKim, Manjin, McDonald, Stuart D., Ali, Yahia, Abbott, Trevor and Nogita, Kazuhiro (2020). Effect of Na and cooling rate on the activation of Mg-Ni alloys for hydrogen storage. Journal of Nanoscience and Nanotechnology, 20 (8), 5192-5200. doi: 10.1166/jnn.2020.18529 |
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2020 Journal Article Atomic locations of minor dopants and their roles in the stabilization of η−Cu6Sn5Yang, Wenhui, Quy Tran, Xuan, Yamamoto, Tomokazu, Yoshioka, Satoru, Somidin, Flora, Nogita, Kazuhiro and Matsumura, Syo (2020). Atomic locations of minor dopants and their roles in the stabilization of η−Cu6Sn5. Physical Review Materials, 4 (6) 065002. doi: 10.1103/physrevmaterials.4.065002 |
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2020 Journal Article Intermetallic formation mechanisms and properties in room-temperature Ga solderingLiu, Shiqian, Qu, Dongdong, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Intermetallic formation mechanisms and properties in room-temperature Ga soldering. Journal of Alloys and Compounds, 826 154221, 154221. doi: 10.1016/j.jallcom.2020.154221 |
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2020 Journal Article On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrateQu, D.D., Gear, M., Setargew, N., Renshaw, W., McDonald, S., StJohn, D., Paterson, D.J. and Nogita, K. (2020). On the distribution of the trace elements V and Cr in an Al-Zn-Si alloy coating on a steel substrate. Materialia, 11 100669, 100669. doi: 10.1016/j.mtla.2020.100669 |
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2020 Journal Article Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder pasteMohd Said, R., Mohd Salleh, M. A. A., Saud, N., Ramli, M. I. I., Yasuda, H. and Nogita, K. (2020). Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste. Journal of Materials Science: Materials in Electronics, 31 (14), 11077-11094. doi: 10.1007/s10854-020-03657-4 |
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2020 Journal Article Interfacial reactions between Ga and Cu-10Ni substrate at low temperatureLiu, Shiqian, Zeng, Guang, Yang, Wenhui, McDonald, Stuart, Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2020). Interfacial reactions between Ga and Cu-10Ni substrate at low temperature. ACS Applied Materials and Interfaces, 12 (18) acsami.0c02032, 21045-21056. doi: 10.1021/acsami.0c02032 |
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2020 Journal Article Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profileSomidin, Flora, McDonald, Stuart David, Ye, Xiaozhou, Qu, Dongdong, Sweatman, Keith, Akaiwa, Tetsuya, Nishimura, Tetsuro and Nogita, Kazuhiro (2020). Reducing cracking in solder joint interfacial Cu6Sn5 with modified reflow profile. Japan Institute of Electronics Packaging. Transactions, 13, E19-004. doi: 10.5104/jiepeng.13.e19-004-1 |
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2020 Journal Article Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compoundsSomidin, Flora, Maeno, Hiroshi, Toriyama, Takaaki, McDonald, Stuart D., Yang, Wenhui, Matsumura, Syo and Nogita, Kazuhiro (2020). Direct observation of the Ni stabilising effect in interfacial (Cu,Ni)6Sn5 intermetallic compounds. Materialia, 9 100530, 100530. doi: 10.1016/j.mtla.2019.100530 |
