
Overview
Background
Prof Kazuhiro Nogita’s research interests are in: working on Pb-free solder alloys and intermetallics, hydrogen storage alloys, Li-ion battery anode materials, Zn-Al coating alloys and structural Al-Si and Mg alloys. The unifying theme throughout his research career has been the development of environmentally sustainable materials solutions for conventional and alternative electronic, transport and power industries.
Prof Nogita graduated as an Engineer in Japan in 1990 and worked in the nuclear power industry with Hitachi Ltd. for several years. He was awarded a PhD from Kyushu University in 1997 and has subsequently worked on a variety of research projects, including the development of materials for alternative power industries and environmentally friendly applications. He migrated to Australia in 1999 after accepting a position at the University of Queensland, where he currently holds the title of Professor and Director of the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) within the School of Mechanical & Mining Engineering, and a founding manager of The University of Queensland - Kyushu University Oceania Project (“UQ-KU Project”). He is also an invited Professor at Kyushu University and at the University of Malaysia Perlis.
Currently, the majority of Prof Nogita’s research is in two major areas, namely lead-free solders for electronic applications and metal based hydrogen-storage alloys. He holds 15 international patents and has authored over 200 refereed scientific papers. His research has been acknowledged with several awards/fellowships, including Queensland Government Smart Futures Fellowship and he has been instrumental in the establishment of a spin-off company, Hydrexia Pty. Ltd.
Availability
- Professor Kazuhiro Nogita is:
- Available for supervision
- Media expert
Fields of research
Qualifications
- Bachelor of Engineering, Institution to be confirmed
- Doctoral Diploma, Institution to be confirmed
Research impacts
In 2002 I became aware, through following international literature, that the Mg-Ni system was a suitable candidate for hydrogen storage applications. I applied my experience in solidification, control and characterisation of eutectic microstructures to investigate bulk casting as means of producing a suitable alloy from this system. The research was novel in the field of hydrogen storage alloys as it resulted in a commercially viable product that could be economically cast, in bulk, to produce a nano-scale microstructure with acceptable kinetics of hydrogen absorption and desorption. The alloy that was developed also displayed a spontaneous protective oxidation reaction preventing the release of hydrogen from the alloy in a compromised storage system. This research resulted in many papers, 3 patent, 3 awards and the development of a spin-off company, Hydrexia Pty. Ltd. To date, Hydrexia has attracted over $20m from investors including Air Liquide, and employed many full time staff in Queensland.
Concurrent to my research in hydrogen storage alloys, I was approached to perform some consulting for a major international manufacturer, Nihon Superior Co. Ltd, involving the characterisation of lead-free solder alloys. This consultancy was highly valued by the company and the work expanded into 5 major research funds with a total investment of over $4.3m at UQ over the past 10 years. Our work was critical to Nihon in protecting its IP (in both the US patent court and Japanese supreme court), and as a result, the company was presented an award from the Japanese Emperor for the creation of significant IP at a ceremony marking the 125 year anniversary of the Japanese patent system in 2010. The research has expanded and resulted in the establishment of the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) at UQ in 2012 and is associated with over 60 peer-reviewed papers, 5 patents and 3 awards. The NS CMEM has a strong focus on commercially relevant and environmentally sustainable research with the purpose of bringing world-class research capability to the manufacture of electronic materials at the University of Queensland. The Centre has a diverse range of projects and has attracted requests for consulting work from Australian manufacturers in the electronics sector. The research relating to NS CMEM and lead-free solder development was selected for assessment in the ATN Go8 EIA Trial and was recognised in the National Report, 28th November 2012, as having considerable impacts in terms of “reach and significance” and it was stated that “Adoption of the research has produced new policies, products, attitudes, behaviours and /or outlooks in the end-user community”.
I have engaged communities beyond academia by participating in media coverage on my research and endeavouring to communicate the content and potential of research projects to a broader audience. My research has been used to assist in the manufacture of an electric vehicle that participated in the Global Green Challenge in Oct 2009, a 3000km race through outback Australia. Highlights of this race were shared at a seminar with Australian embassy representatives from Austrade, Queensland Government Trade and Export Department representatives, and private industries and academic institutions. I had participated in the coming World Solar Challenge 2013 as a team member of the “Team Arrow” solar car racing team (http://www.teamarrow.com.au/), which consists of a consortium of four Australian engineering companies (Integral Pty. Ltd., Meshlogic Pty. Ltd., Rinstrum Pty. Ltd. and Tritium Pty. Ltd.).
Works
Search Professor Kazuhiro Nogita’s works on UQ eSpace
2009
Conference Publication
Mechanism of Improved Hydrogen Absorption Kinetics in Cast Mg-Ni Alloys
Nogita, Kazuhiro (2009). Mechanism of Improved Hydrogen Absorption Kinetics in Cast Mg-Ni Alloys. Switzerland: Trans Tech Publications Ltd. doi: 10.4028/www.scientific.net/MSF.618-619.391
2009
Conference Publication
The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates
Nogita, K., Gourlay, C. M., Nishimura, T., Suenaga, S., McDonald, S. D. and Tsukamoto, H. (2009). The influence of Ni content on cracking in IMC reaction layers between Sn-Cu-Ni solders and Cu substrates. TMS 2009, San Francisco, California, USA, 15-19 February 2009.
2009
Conference Publication
Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints
Tsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, 1-3 July 2009.
2009
Conference Publication
Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces
Nogita, K., Suenaga, S., McDonald, S. D., Tsukamoto. H., Read, J. and Nishimura, T. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. ICEP 2009: International Conference on Electronics Packaging 2009, Kyoto, Japan, 14-16 April, 2009. Kyoto, Japan: Japan Institute of Electronics Packaging.
2009
Journal Article
Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders
Nogita, Kazuhiro, McDonald, Stuart D., Tsukamoto, Hideaki, Read, Jonathan, Suenaga, S. and Nishimura, T. (2009). Inhibiting cracking of interfacial Cu6Sn5 by Ni additions to Sn-based Lead-free solders. Transactions of the Japan Institute of Electronics Packaging, 2 (1), 46-54.
2009
Conference Publication
The influence of Ni additions on the solidification of Sn-0.7%Cu solder
T. Ventura, C. M. Gourlay, K. Nogita, M. Rappaz and A. K. Dahle (2009). The influence of Ni additions on the solidification of Sn-0.7%Cu solder. Materials and AustCeram 2009 Conference, Gold Coast, Australia, 1-3 July 2009.
2009
Conference Publication
The Effect of Ni on Phase Stability in Cu6Sn5
Nogita, K., Read, J., Tsukamoto, H., McDonald, S. D., Gourlay, C. M. and Nishimura, T. (2009). The Effect of Ni on Phase Stability in Cu6Sn5. Japan Institute of Metals Autumn Meeting 2009, Kyoto, Japan, 15-17 September 2009.
2009
Conference Publication
Effect of intermetallic stabilization on the impact resistance of joints to BGA packages
Sweatman, Keith, Suenaga, Shoichi, Miyaoka, M., Nozu, Takashi, Nogita, Kazuhiro and Nishimura, Tetsuro (2009). Effect of intermetallic stabilization on the impact resistance of joints to BGA packages. 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, 9 - 11 December 2009. Piscataway, NJ United States: I E E E. doi: 10.1109/EPTC.2009.5416526
2009
Conference Publication
The influence of solder composition on the impact strength of lead-free solder BGA joints
Tsukamoto, Hideaki, Nogita, Kazuhiro, McDonald, Stuart, Nishimura, Tetsuro, Suenaga, Shoichi and Sweatman, Keith W. (2009). The influence of solder composition on the impact strength of lead-free solder BGA joints. 2009 TMS Annual Meeting & Exhibition, San Francisco, CA, USA, 15 - 19 February 2009. TMS.
2009
Conference Publication
Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates
Hideaki Tsukamoto, Nishimura, T., Suenaga, S., McDonald, Stuart, Jonathan Read and Nogita, Kazuhiro (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. Int. Conf. on Electronics Packaging 2009, Kyoto, Japan, 1-16 April 2009. Japan: Japan Institute of Electronics Packaging.
2008
Journal Article
Copper erosion: The influence of metallurgy on copper dissolution: The rate of copper dissolution
Shea, Chrys, Kenny, Jim, Rasmussen, Jean, Wable, Girish, Chu, Quyen, Teng. Shiang, Sweatman, Keith and Nogita, Kazuhiro (2008). Copper erosion: The influence of metallurgy on copper dissolution: The rate of copper dissolution. Printed Circuit Design & Fab, 25 (10), 35-38.
2008
Journal Article
Effects of boron on microstructure in cast titanium alloys
Bermingham, M., McDonald, S.D., Nogita, K., St John, D.H. and Dargusch, M.S. (2008). Effects of boron on microstructure in cast titanium alloys. Scripta Materialia, 59 (5), 538-541. doi: 10.1016/j.scriptamat.2008.05.002
2008
Journal Article
Nickel-stabilized hexagonal (Cu, Ni)(6)Sn-5 in Sn-Cu-Ni lead-free solder alloys
Nogita, K. and Nishimura, T. (2008). Nickel-stabilized hexagonal (Cu, Ni)(6)Sn-5 in Sn-Cu-Ni lead-free solder alloys. Scripta Materialia, 59 (2), 191-194. doi: 10.1016/j.scriptamat.2008.03.002
2008
Journal Article
Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder
Nogita, K., Gourlay, C., Read, J., Nishimura, T., Suenaga, S. and Dahle, A.K. (2008). Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder. Materials Transactions, 49 (3), 443-448. doi: 10.2320/matertrans.MBW200713
2008
Journal Article
The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi
Ventura, Tina, Gourlay, Christopher M., Nogita, Kazuhiro, Nishimura, Tetsuro, Rappaz, Michel and Dahle, Arne K. (2008). The influence of 0-0.1 wt.% Ni on the microstructure and fluidity length of Sn-0.7Cu-xNi. Journal of Electronic Materials, 37 (1), 32-39. doi: 10.1007/s11664-007-0281-7
2008
Conference Publication
Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys
Nogita, K., Nishimura, T., Suenaga, S., McDonald, S. D., Sweatman, K. and Tsukamoto, H. (2008). Role of Ni in stabilization of intermetallic compounds in Sn-Cu alloys. Japanese Institute of Metals Annual Autumn Meeting 2008, Kumamoto, Japan, 23-25 September 2008.
2008
Journal Article
The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys
Gourlay, C., Read, J., Nogita, K. and Dahle, A.K. (2008). The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys. Journal of Electronic Materials, 37 (1), 51-60. doi: 10.1007/s11664-007-0248-8
2008
Conference Publication
Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces
Tsukamoto, H., Dong, Z., Huang, H., Nishimura, T. and Nogita, K. (2008). Nanoindentation characterization of intermetallic compounds formed at Sn-Cu (-Ni) solder/Cu substrate interfaces. Materials and AustCeram Conference (MAC 2009), Gold Coast, Queensland, 1-3 July 2009.
2007
Journal Article
Ultrahigh electron emissive carbon nanotubes with nano-sized RuO2 particles deposition
Knibbe, Ruth, Nogita, Kazuhiro, Drennan, John, Noguchi, Tsuneyuki, Tatenuma, Katsuyoshi, Liu, Pou, Arai, Fumihito, Yashima, Eiji, Nishiwaki, Michiru and Kato, Shigeki (2007). Ultrahigh electron emissive carbon nanotubes with nano-sized RuO2 particles deposition. Journal of Nanoparticle Research, 9 (6), 1201-1204. doi: 10.1007/s11051-006-9207-1
2007
Conference Publication
Analysis of trace elements in Na-modified Al-10 wt%Si using EMPA and NanoSIMS
Simensen, C.J., Hillion, F., Nielsen, O., Nogita, K. and Dahle, A.K. (2007). Analysis of trace elements in Na-modified Al-10 wt%Si using EMPA and NanoSIMS. Solidification Processing 2007, Sheffield, United Kingdom, 23-25 July 2007. Great Britain: Department of Engineering Materials, University of Sheffield.
Funding
Current funding
Past funding
Supervision
Availability
- Professor Kazuhiro Nogita is:
- Available for supervision
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Available projects
-
Intermetallic compounds for high reliability electronic interconnections
The aim of this project is to optimise the properties of intermetallics so that they can provide connections between the elements of electrical and electronic circuitry that have greater long-term stability and reliability than can be delivered by the solder alloys currently used to make these connections. The outcome will be electronics, from smart phones to smart grids and electric vehicles in which the high reliability connections will be made with tailored intermetallic compounds rather than traditional solders.
Supervision history
Current supervision
-
Doctor Philosophy
Mechanical properties of Sn-Bi alloys and mechanisms of ductility improvement
Principal Advisor
Other advisors: Dr Stuart McDonald, Dr Xin Fu Tan
-
Doctor Philosophy
Microstructure control of hot-dip coated Al-Zn based alloy layers on steel
Principal Advisor
-
Doctor Philosophy
Structure Development and Stability in Sn-Bi Based Solder Alloys
Principal Advisor
Other advisors: Dr Stuart McDonald, Dr Xin Fu Tan
-
Doctor Philosophy
Understanding and controlling oxidation of Ga and Ga-based alloys to facilitate electronic assemblies
Principal Advisor
Other advisors: Dr Stuart McDonald, Dr Xin Fu Tan
-
Doctor Philosophy
Large scale solid-state hydrogen storage for transportation and grid integration
Principal Advisor
Other advisors: Dr Xin Fu Tan, Dr Zhiliang Wang
-
Doctor Philosophy
Development of Sn-Bi based low temperature lead-free solder alloys
Principal Advisor
Other advisors: Dr Stuart McDonald, Dr Xin Fu Tan
-
Doctor Philosophy
Microstructural Characterisation of Trace Element Modified Al-Zn-Mg-Si Alloys
Principal Advisor
-
Doctor Philosophy
Al-Ni alloys for use as a novel brazing material for joining Al with dissimilar metals
Principal Advisor
Other advisors: Dr Stuart McDonald, Dr Xin Fu Tan
-
Doctor Philosophy
Development of Sn-Bi based low temperature lead-free solder alloys
Principal Advisor
Other advisors: Dr Stuart McDonald, Dr Xin Fu Tan
-
Doctor Philosophy
Production of hydrogen from renewable energy surplus
Associate Advisor
Other advisors: Professor Lianzhou Wang, Dr Zhiliang Wang
Completed supervision
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2023
Doctor Philosophy
Atomic-scale Structural Characterisation of Telluride-based Materials for Functional Applications in Thermoelectricty and Electronic Data Storage
Principal Advisor
Other advisors: Emeritus Professor Jin Zou
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2023
Doctor Philosophy
Functional Concentration Gradients in Copper-Nickel Substrates for Transient Liquid Phase Soldering
Principal Advisor
Other advisors: Dr Stuart McDonald, Dr Xin Fu Tan
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2022
Doctor Philosophy
Effect of Na Addition and Microstructure Modification on Mg-based Alloys for Hydrogen Storage Systems
Principal Advisor
Other advisors: Dr Yahia Ali
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2022
Doctor Philosophy
Development of High-Temperature Sn-Cu Soldering Alloys
Principal Advisor
Other advisors: Dr Stuart McDonald
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2020
Doctor Philosophy
The Interfacial Reactions Between Ga-based Alloys and Common Substrates Used in Microelectronics
Principal Advisor
Other advisors: Dr Stuart McDonald
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2020
Doctor Philosophy
New Manufacturing Methods for Advanced Lithium Ion Battery Anode Materials
Principal Advisor
Other advisors: Professor Lianzhou Wang
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2020
Doctor Philosophy
Phase Transformation Considerations in Manufacturing Reliable Sn-rich Solder Joints
Principal Advisor
Other advisors: Dr Stuart McDonald
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2019
Doctor Philosophy
Mechanisms of Surface Stability in Al-Zn Coated Steel
Principal Advisor
Other advisors: Dr Stuart McDonald
-
2017
Doctor Philosophy
Mechanisms of hydrogen absorption and desorption in Mg-Ni alloys
Principal Advisor
Other advisors: Dr Stuart McDonald
-
2016
Doctor Philosophy
Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys
Principal Advisor
Other advisors: Dr Stuart McDonald
-
2014
Doctor Philosophy
Phase Formation, Transformation and Stability in Micro-alloyed Sn-based Lead-free Solder Alloys and Joints
Principal Advisor
Other advisors: Dr Stuart McDonald
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2013
Doctor Philosophy
Critical properties of Cu6Sn5 for high-temperature and 3D lead-free soldering applications
Principal Advisor
-
2019
Doctor Philosophy
Development of Novel Electrode Materials for Next Generation Rechargeable Batteries
Associate Advisor
Other advisors: Professor Lianzhou Wang
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2014
Doctor Philosophy
Eutectic Solidification in Hypo-eutectic Aluminium-Silicon Alloys
Associate Advisor
Other advisors: Dr Stuart McDonald
-
2011
Doctor Philosophy
Solidification Mechanisms in the Lead-free Solder Alloy System Sn-Cu-Ni
Associate Advisor
Media
Enquiries
Contact Professor Kazuhiro Nogita directly for media enquiries about:
- Alloys and casting
- Crystallography
- Electron microscopy
- Engineering - materials
- Engineering microanalysis
- Eutectic alloys
- Hydrogen absorption alloys
- Lead-free soldering alloys
- Magnesium alloys
- Materials engineering
- Nuclear materials - microstructural change
- Nucleation and growth of Al-Si alloys
- Radiation damage in nuclear materials
- Soldering alloys - lead-free
- Solidification
- X-ray imaging
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