Reliable intermetallic bonding for high power and temperature electronics (2027-2028)
Abstract
Electronics play a vital role in modern life and the global economy. This project aims to develop a novel method for manufacturing connections between functional elements in electronic devices. The project expects to create reliable bonds for high-power, high-temperature applications by leveraging a new approach to the synthesis and property tuning of intermetallic compounds, discovered by the investigators. The expected outcomes include enhanced thermal and mechanical stability of electronic interconnects. This advancement offers significant benefits, enabling the development of compact, high-performance electronics for advanced circuitry in portable devices, electric vehicles, artificial intelligence hardware, and defence applications.
